公开(公告)号：US20110217848A1

公开(公告)日：2011-09-08

申请号：US12717079

申请日：2010-03-03

申请人： Eric J. Bergman ,  Jerry Dustin Leonhard ,  Bryan Puch ,  Jason Rye

发明人： Eric J. Bergman ,  Jerry Dustin Leonhard ,  Bryan Puch ,  Jason Rye

IPC分类号： H01L21/306

CPC分类号： H01L21/31133 ,  G03F7/42 ,  G03F7/423 ,  H01L21/67115 ,  H01L21/6719

摘要： A processing chamber successfully removes hardened photoresist via direct infrared radiation onto the wafer, in the presence of an acid such as sulfuric acid, optionally along with an oxidizer such as hydrogen peroxide. The processing chamber includes a fixture for holding and optionally rotating the wafer. An infrared irradiating assembly has infrared lamps outside of the processing chamber positioned to radiate infrared light into the processing chamber. The infrared lamps may be arranged to irradiate substantially the entire surface of a wafer on the rotor. A cooling assembly can be associated with the infrared radiating assembly to provide a quick cool down and avoid over-processing. Photoresist is removed using small amounts of chemical solutions.

摘要翻译： 处理室在酸例如硫酸存在下，任选地与氧化剂如过氧化氢成功地将硬化的光致抗蚀剂通过直接红外辐射除去到晶片上。 处理室包括用于保持和任选地旋转晶片的固定装置。 红外辐射组件具有位于处理室外面的红外灯，其被定位成将红外光辐射到处理室中。 红外灯可以被布置成基本上照射转子上的晶片的整个表面。 冷却组件可以与红外辐射组件相关联以提供快速冷却并避免过度处理。 使用少量化学溶液除去光刻胶。

公开(公告)号：US08968532B2

公开(公告)日：2015-03-03

申请号：US13267693

申请日：2011-10-06

申请人： Bryan Puch

发明人： Bryan Puch

IPC分类号： C25D17/00 ,  H01L21/67 ,  H01L21/68

CPC分类号： C25D17/001 ,  H01L21/6719 ,  H01L21/68 ,  Y10T29/49778

摘要： A substrate plating processor has a vessel on a support structure and a head support fixed in place relative to the support structure. A head having a rotor is attached to the head support. A lifter associated with the head support moves the head into and out of engagement with the vessel. An alignment assembly attachable to the rotor has at least one sensor adapted to detect a position of an inside surface of the vessel when the head is engaged with the vessel. The sensor may be a physical contact sensor positioned to contact the inside surface of the vessel.

摘要翻译： 衬底电镀处理器具有在支撑结构上的容器和相对于支撑结构固定在适当位置的头部支撑件。 具有转子的头部附接到头部支撑件。 与头部支撑件相关联的升降机将头部移动进入与该容器的接合。 可附接到转子的对准组件具有至少一个传感器，适于在头部与容器接合时检测容器的内表面的位置。 传感器可以是定位成接触容器内表面的物理接触传感器。

公开(公告)号：US20120199475A1

公开(公告)日：2012-08-09

申请号：US13023317

申请日：2011-02-08

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Bryan Puch

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Bryan Puch

IPC分类号： C25D19/00 ,  B01F13/00

CPC分类号： C25D17/001

摘要： A substrate or semiconductor wafer processing apparatus has an agitator plate adjacent to an upper end of a process vessel. A workpiece holder holds a workpiece in the vessel at a processing position above the agitator plate. A vertical actuator assembly supporting the agitator plate oscillates the agitator plate vertically. The agitator plate may also rotate while oscillating vertically. In one design, the agitator plate has a spiral vane and a spiral slot. In a related metal plating apparatus, electrodes and a dielectric field shaping unit are in the vessel, below the agitator plate, and a shield ring is adjacent to the upper end of the vessel, above the agitator plate.

摘要翻译： 基板或半导体晶片处理装置具有与处理容器的上端相邻的搅拌板。 工件夹持器在搅拌器板上方的处理位置处将容器保持在容器中。 支撑搅拌板的垂直致动器组件垂直振荡搅拌器板。 搅拌器板也可以在垂直摆动的同时旋转。 在一种设计中，搅拌器板具有螺旋叶片和螺旋槽。 在相关的金属电镀装置中，电极和电介质场成形单元位于搅拌器板下面的容器中，并且在搅拌器板上方的屏蔽环与容器的上端相邻。

公开(公告)号：US20130086787A1

公开(公告)日：2013-04-11

申请号：US13267693

申请日：2011-10-06

申请人： Bryan Puch

发明人： Bryan Puch

IPC分类号： C25C7/06 ,  B23Q17/00 ,  C25B9/00

CPC分类号： C25D17/001 ,  H01L21/6719 ,  H01L21/68 ,  Y10T29/49778

摘要： A substrate plating processor has a vessel on a support structure and a head support fixed in place relative to the support structure. A head having a rotor is attached to the head support. A lifter associated with the head support moves the head into and out of engagement with the vessel. An alignment assembly attachable to the rotor has at least one sensor adapted to detect a position of an inside surface of the vessel when the head is engaged with the vessel. The sensor may be a physical contact sensor positioned to contact the inside surface of the vessel.

摘要翻译： 衬底电镀处理器具有在支撑结构上的容器和相对于支撑结构固定在适当位置的头部支撑件。 具有转子的头部附接到头部支撑件。 与头部支撑件相关联的升降机将头部移动进入与该容器的接合。 可附接到转子的对准组件具有至少一个传感器，适于在头部与容器接合时检测容器的内表面的位置。 传感器可以是定位成接触容器内表面的物理接触传感器。

公开(公告)号：US20120052204A1

公开(公告)日：2012-03-01

申请号：US12873002

申请日：2010-08-31

申请人： Bryan Puch ,  Kyle M. Hanson ,  Marvin Bernt ,  Paul R. McHugh ,  Gregory J. Wilson

发明人： Bryan Puch ,  Kyle M. Hanson ,  Marvin Bernt ,  Paul R. McHugh ,  Gregory J. Wilson

IPC分类号： C23C16/56

CPC分类号： H01L21/6719 ,  H01L21/67057 ,  H01L21/67126

摘要： In a workpiece processor, a head is moveable onto a bowl to form a process chamber. A workpiece can be cleaned in the processor by immersing the workpiece into a liquid bath in the bowl and then boiling the liquid. Vacuum may be applied to the chamber to reduce the pressure within the chamber, thereby reducing the boiling temperature of the liquid and allowing processing at lower temperatures. In a separate method for prewetting a workpiece, a humid gas is provided into the process chamber and condenses on the workpiece. In another separate method for wetting a workpiece, liquid water is provided into the bowl, with the workpiece above the liquid water. Water vapor is created in the process chamber by applying vacuum to the process chamber. The vapor wets the workpiece. The workpiece is then further wetted by submerging the workpiece into the liquid water.

摘要翻译： 在工件处理器中，头可移动到碗上以形成处理室。 工件可以通过将工件浸入碗中的液体浴中，然后煮沸液体而在处理器中进行清洁。 真空可以施加到室以减小室内的压力，从而降低液体的沸腾温度并允许在较低温度下进行加工。 在用于预润湿工件的单独方法中，将湿气提供到处理室中并在工件上冷凝。 在用于润湿工件的另一种分开的方法中，液体水被提供到碗中，工件在液态水上方。 通过对处理室施加真空，在处理室中产生水蒸汽。 蒸汽润湿工件。 然后通过将工件浸入液体水中来进一步润湿工件。