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公开(公告)号:US07147906B2
公开(公告)日:2006-12-12
申请号:US10603497
申请日:2003-06-24
CPC分类号: G11B5/73 , C08G73/1053 , Y10S360/902 , Y10T428/21 , Y10T428/31504 , Y10T428/31681 , Y10T428/31721
摘要: In one aspect the present invention provides a storage medium for data, the storage medium comprising: a) a substrate, a physical portion of which comprises at least one polyimide, and b) at least one data layer on the substrate. The substrate comprising a polyimide exhibits low axial displacement and beneficial damping characteristics.
摘要翻译: 一方面,本发明提供了一种用于数据的存储介质,所述存储介质包括:a)衬底,其物理部分包括至少一个聚酰亚胺,以及b)所述衬底上的至少一个数据层。 包含聚酰亚胺的基材表现出低轴向位移和有利的阻尼特性。
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公开(公告)号:US06977057B2
公开(公告)日:2005-12-20
申请号:US10063407
申请日:2002-04-19
IPC分类号: B29C59/02 , B29C59/00 , B29K27/06 , B29K79/00 , C08G73/10 , G11B5/74 , G11B5/84 , G11B7/24 , G11B7/241 , G11B7/26 , G11B11/105 , H01B3/30
CPC分类号: C08G73/1042 , B29C59/005 , C08G73/10 , C08G73/1039 , C08G73/106 , C08G73/1064 , C08G73/1067 , C08G73/1071 , G11B5/74 , G11B5/8404 , G11B7/241 , G11B7/263 , G11B11/10582 , H01B3/306
摘要: A method for manufacturing an embossed surface including a polymer composition having reactive moieties and a first glass transition temperature of Tg1. The method includes embossing the surface at temperature Temb; and raising the first glass transition temperature Tg1 of the embossed polymeric surface to a second glass transition temperature Tg2 such that Tg2>Temb. In another embodiment, a method for improving the release of a polymeric surface from an embossing tool includes incorporating of one or more of fluorine atoms, silicon atoms, or siloxane segments into the backbone of the polymer. The methods are particularly suited for direct patterning of photoresists, fabrication of interdigitated electrodes, and fabrication of data storage media.
摘要翻译: 一种制造压花表面的方法,其包括具有反应性部分和第一玻璃化转变温度为T g1的聚合物组合物。 该方法包括在温度T T下压花表面; 并将压花的聚合物表面的第一玻璃化转变温度T 1 g 1提高到第二玻璃化转变温度T g2,使得T g2 < SUB> emb SUB>。 在另一个实施方案中,用于改进聚合物表面从压花工具释放的方法包括将一个或多个氟原子,硅原子或硅氧烷链段掺入聚合物的主链中。 这些方法特别适用于光刻胶的直接图案化,交叉电极的制造和数据存储介质的制造。
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