公开(公告)号：US20180180085A1

公开(公告)日：2018-06-28

申请号：US15835651

申请日：2017-12-08

Applicant: FANUC CORPORATION

Inventor： Masato WATANABE ,  Taku SASAKI ,  Kiichi INABA

IPC: F16B33/06 ,  G05B19/418

CPC classification number: F16B33/06 ,  F16B5/02 ,  G05B19/41805 ,  G05B2219/36442 ,  G05B2219/40111 ,  G05B2219/45203 ,  Y02P90/02

Abstract: A machine learning device includes a state observation unit for observing state variables that include at least one of the state of an assembly constituted of first and second components, an assembly time and information on a force, the result of a continuity test on the assembly, and at least one of position and posture command values for at least one of the first and second components and direction, speed and force command values for an assembly operation; and a learning unit for learning, in a related manner, at least one of the state of the assembly, the assembly time and the information on the force, the result of the continuity test on the assembly, and at least one of the position and posture command values for at least one of the first and second components and the direction, speed and force command values for the assembly operation.

公开(公告)号：US20140029323A1

公开(公告)日：2014-01-30

申请号：US13952835

申请日：2013-07-29

Applicant: FANUC Corporation

Inventor： Hajime MAKITA ,  Masato WATANABE

IPC: H02M7/5387

CPC classification number: H02M7/5387 ,  H02M7/493 ,  H03K17/127 ,  H03K17/168

Abstract: A power converter for converting DC power to AC power by switching operation of a switching element includes: a bridge circuit configured by at least two series circuits using, as power input terminals, terminals on both sides of two switching elements connected to each other in series and using, as a power output terminal, a connection point of the two switching elements are connected in parallel via the power output terminal; a gate drive circuit for outputting a driving signal which controls to turn on/off the switching elements; and signal lines using a driving signal output terminal in the gate drive circuit as a starting point of wiring, individually hard-wired to each of the switching elements in each of series circuits to which the same driving signal is supplied from the driving signal output terminal, and having inductances which are configured equal to each other.

Abstract translation: 一种用于通过开关元件的开关操作将直流电力转换为交流电力的电力转换器包括：由至少两个串联电路构成的桥接电路，所述两个串联电路使用串联连接的两个开关元件两侧的端子作为电力输入端子 并且通过功率输出端子并联连接两个开关元件的连接点作为功率输出端子; 栅极驱动电路，用于输出控制开关元件的驱动信号; 以及使用栅极驱动电路中的驱动信号输出端子作为布线的起始点的信号线，分别硬接到从驱动信号输出端子提供相同驱动信号的串联电路中的每个开关元件 并且具有被配置为彼此相等的电感。

公开(公告)号：US20230066238A1

公开(公告)日：2023-03-02

申请号：US17795118

申请日：2021-01-25

Applicant: FANUC CORPORATION

Inventor： Masato WATANABE ,  Taku SASAKI

IPC: H02K11/33 ,  H02K5/22 ,  H05K1/18

Abstract: Provided are a motor drive device that reduces the likelihood of mounting error during manufacture, and a method for manufacturing the same. The motor drive device is provided with: a substrate; a first mounting region for mounting first circuit component; a second mounting region for mounting a second circuit component; a first pair of connection points for connecting a first connecting wire member, constituting a first path for supplying electric current to the first circuit component, onto the substrate such that at least a part of the first connecting wire member overlaps the second mounting region; and a second pair of connection points for connecting second connecting wire member, constituting a second path for supplying electric current to the second circuit component, onto the substrate such that at least a part of the second connecting wire member overlaps the first mounting region.

公开(公告)号：US20180350721A1

公开(公告)日：2018-12-06

申请号：US15972559

申请日：2018-05-07

Applicant: FANUC CORPORATION

Inventor： Masato WATANABE ,  Taku SASAKI

IPC: H01L23/473 ,  H01L25/07

CPC classification number: H01L23/473 ,  F28D15/00 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/12 ,  F28F2215/04 ,  H01L23/3672 ,  H01L23/3735 ,  H01L23/3736 ,  H01L25/072 ,  H01L25/115 ,  H01L29/1608

Abstract: A heat sink capable of dissipating heat concentrating on a chip portion of a power semiconductor device module efficiently is provided. A heat sink (20) includes a heat sink body (21) in which a power semiconductor device module (10) having a plurality of power semiconductor devices (11) is placed on a cooling surface F1 and which radiates heat generated by the power semiconductor device (11); and a heat dissipation structure portion (25) having a higher heat conductivity than the heat sink body (21) and capable of dissipating heat generated by the power semiconductor device (11), wherein the heat dissipation structure portion (25) is provided at a position overlapping the power semiconductor device (11) disposed in the power semiconductor device module (10) in a direction (Z) orthogonal to the cooling surface (F1) of the heat sink body (21).