ON-CHIP EMBEDDED THERMAL ANTENNA FOR CHIP COOLING
    1.
    发明申请
    ON-CHIP EMBEDDED THERMAL ANTENNA FOR CHIP COOLING 有权
    芯片嵌入式热天线芯片冷却

    公开(公告)号:US20120015511A1

    公开(公告)日:2012-01-19

    申请号:US13244998

    申请日:2011-09-26

    IPC分类号: H01L21/768

    摘要: An apparatus comprises a first layer within a semiconductor chip having active structures electrically connected to other active structures and having electrically isolated first inactive structures. A second layer within the semiconductor chip is physically connected to the first layer. The second layer comprises an insulator and has second inactive structures. The first inactive structures are physically aligned with the second inactive structures.

    摘要翻译: 一种装置包括半导体芯片内的第一层,其具有与其它有源结构电连接并且具有电隔离的第一无效结构的有源结构。 半导体芯片内的第二层物理连接到第一层。 第二层包括绝缘体并具有第二非活性结构。 第一非活性结构与第二非活性结构物理对准。

    OPTICAL PLATE AND BACKLIGHT MODULE USING THE SAME
    2.
    发明申请
    OPTICAL PLATE AND BACKLIGHT MODULE USING THE SAME 失效
    光学板和背光模块使用它

    公开(公告)号:US20080266875A1

    公开(公告)日:2008-10-30

    申请号:US11845790

    申请日:2007-08-28

    IPC分类号: F21V5/00 G02B5/00

    摘要: An exemplary optical plate includes at least one transparent plate unit. The transparent plate unit includes a light output surface, a bottom surface, a plurality of through holes and at least one lamp-receiving portion. The light output surface is opposite to the bottom surface. Each of the through holes communicates the light output surface with the bottom surface. The lamp-receiving portion is defined in the bottom surface. A backlight module using the present optical plate is also provided.

    摘要翻译: 示例性的光学板包括至少一个透明板单元。 透明板单元包括光输出表面,底表面,多个通孔和至少一个灯接收部分。 光输出表面与底表面相对。 每个通孔将光输出表面与底表面连通。 灯接收部分限定在底面。 还提供了使用本发明的光学板的背光模块。

    LED ILLUMINATING DEVICE
    3.
    发明申请
    LED ILLUMINATING DEVICE 失效
    LED照明装置

    公开(公告)号:US20110181166A1

    公开(公告)日:2011-07-28

    申请号:US12941973

    申请日:2010-11-08

    申请人: FEN CHEN TING DONG

    发明人: FEN CHEN TING DONG

    IPC分类号: H01J61/52

    摘要: An LED illuminating device includes a heat sink, a first substrate, a second substrate and a connector. The heat sink comprises a first end, a second end opposite to the first end along the axial direction of the heat sink. The first substrate mounted on the first end, the second substrate mounted on the second end, the second substrate has a size smaller than the first substrate. Heat generated by the first substrate is transferred to air and will not accumulate and be transferred to the second substrate. Additionally, because the first substrate and the second substrate are spaced by the heat sink, the heat radiation efficiency is improved.

    摘要翻译: LED照明装置包括散热器,第一基板,第二基板和连接器。 散热器包括第一端,沿着散热器的轴向与第一端相对的第二端。 安装在第一端上的第一衬底,安装在第二端上的第二衬底,第二衬底具有小于第一衬底的尺寸。 由第一基板产生的热量转移到空气中,并且不会积聚并转移到第二基板。 另外,由于第一基板和第二基板被散热器隔开,所以提高了散热效率。

    OPTICAL PLATE AND BACKLIGHT MODULE USING THE SAME
    4.
    发明申请
    OPTICAL PLATE AND BACKLIGHT MODULE USING THE SAME 失效
    光学板和背光模块使用它

    公开(公告)号:US20090161345A1

    公开(公告)日:2009-06-25

    申请号:US12106337

    申请日:2008-04-21

    摘要: An exemplary optical plate is used in a backlight module having a frame. The optical plate includes a main body and one bracket extension. The main body has a light input surface, and a light output surface opposite to the light input surface. The bracket extension extends from one end of the main body for fixing the optical plate to the frame. A backlight module using the optical plate is also provided.

    摘要翻译: 在具有框架的背光模块中使用示例性的光学板。 光学板包括主体和一个支架延伸部。 主体具有光输入表面和与光输入表面相对的光输出表面。 支架延伸部从主体的一端延伸,用于将光学板固定到框架上。 还提供了使用光学板的背光模块。