公开(公告)号：US09526185B2

公开(公告)日：2016-12-20

申请号：US14248108

申请日：2014-04-08

Applicant: FINISAR CORPORATION

Inventor： Henry Meyer Daghighian ,  Steven C. Bird ,  Gerald Douglas Babel

IPC: H05K3/46 ,  H05K3/24 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K3/4688 ,  H01L2224/48227 ,  H01L2224/85464 ,  H05K1/024 ,  H05K1/0366 ,  H05K3/244 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0191

Abstract: A hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.

Abstract translation: 混合印刷电路板可以包括顶层，底层和堆叠在顶层和底层之间的多个内层。 多个内层可以包括在顶层下面的第一内层和在底层之上的第二内层。 混合印刷电路板可以包括放置在顶层和第一内层之间的第一未加强的层压材料。 混合电路板可以另外包括放置在第二内层和底层之间的第二未加强层叠体。 混合印刷电路板可以包括放置在多个内层的相邻内层之间的第三层压体。

公开(公告)号：US20150289368A1

公开(公告)日：2015-10-08

申请号：US14248108

申请日：2014-04-08

Applicant: FINISAR CORPORATION

Inventor： Henry Meyer Daghighian ,  Steven C. Bird ,  Gerald Douglas Babel

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/02

CPC classification number: H05K3/4688 ,  H01L2224/48227 ,  H01L2224/85464 ,  H05K1/024 ,  H05K1/0366 ,  H05K3/244 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0191

Abstract: A hybrid printed circuit board is described. The hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.

Abstract translation: 描述了混合印刷电路板。 混合印刷电路板可以包括顶层，底层和堆叠在顶层和底层之间的多个内层。 多个内层可以包括在顶层下面的第一内层和在底层之上的第二内层。 混合印刷电路板可以包括放置在顶层和第一内层之间的第一未加强的层压材料。 混合电路板可以另外包括放置在第二内层和底层之间的第二未加强层叠体。 混合印刷电路板可以包括放置在多个内层的相邻内层之间的第三层压体。