公开(公告)号：US10359586B2

公开(公告)日：2019-07-23

申请号：US14873743

申请日：2015-10-02

Applicant: FINISAR CORPORATION

Inventor： Tat Ming Teo ,  John Hsieh ,  William H. Wang ,  Jinxiang Liu ,  Hon Siu Wee ,  Troy Wy Piew Chiang

IPC: G02B6/42 ,  H05K1/02 ,  H05K7/14 ,  H05K9/00 ,  G02B6/38

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

公开(公告)号：US20170097484A1

公开(公告)日：2017-04-06

申请号：US14873743

申请日：2015-10-02

Applicant: FINISAR CORPORATION

Inventor： Tat Ming Teo ,  John Hsieh ,  William H. Wang ,  Jinxiang Liu ,  Hon Siu Wee ,  Troy Wy Piew Chiang

IPC: G02B6/42 ,  H05K7/14 ,  H05K9/00 ,  H05K1/02

CPC classification number: G02B6/4277 ,  G02B6/3874 ,  G02B6/423 ,  G02B6/4246 ,  G02B6/4255 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/4292 ,  H05K1/0216 ,  H05K1/0274 ,  H05K7/1427 ,  H05K9/0058 ,  H05K2201/10121

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

公开(公告)号：US10802232B2

公开(公告)日：2020-10-13

申请号：US16519729

申请日：2019-07-23

Applicant: FINISAR CORPORATION

Inventor： Tat Ming Teo ,  John Hsieh ,  William H. Wang ,  Jinxiang Liu ,  Hon Siu Wee ,  Troy Wy Piew Chiang

IPC: G02B6/42 ,  H05K1/02 ,  H05K7/14 ,  H05K9/00 ,  G02B6/38

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.