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22 条记录 (耗时 0.016 秒)

    Embedded copper structure for microelectronics package
    1.
    发明授权
    Embedded copper structure for microelectronics package 有权

    公开(公告)号：US11270974B2

    公开(公告)日：2022-03-08

    申请号：US16709750

    申请日：2019-12-10

    申请人： FLEX LTD

    发明人： Cheng Yang ,  Dongkai Shangguan ,  Li Yao

    IPC分类号： H01L21/50 ,  H01L23/00 ,  H05K1/02 ,  H01L23/367

    摘要： An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.

    METHODS, DEVICES, AND SYSTEMS FOR ELECTRONIC DEVICE MOLDING AND ENCAPSULATION
    2.
    发明申请
    METHODS, DEVICES, AND SYSTEMS FOR ELECTRONIC DEVICE MOLDING AND ENCAPSULATION 有权

    公开(公告)号：US20210193543A1

    公开(公告)日：2021-06-24

    申请号：US16793788

    申请日：2020-02-18

    申请人： Flex Ltd.

    发明人： Weifeng Liu ,  Jesus A. Tan ,  William L. Uy ,  Dongkai Shangguan

    IPC分类号： H01L23/31 ,  H01L21/56

    摘要： Methods, devices, and systems are provided for the molding and encapsulation of flexible electronic devices. The encapsulation includes providing a mold shell made from an encapsulation material, positioning a flexible electronic device in the mold shell, and dispensing an encapsulant, in a liquid form, around the flexible electronic device. The mold shell, the dispensed encapsulant, and the electronic device forms an integral encapsulation package when the encapsulant is cured. The mold shell and the encapsulant may be made from a same material and, once cured, become an integral part of the encapsulated flexible electronic device.

    ELECTRONIC ENCAPSULATION THROUGH STENCIL PRINTING
    5.
    发明申请
    ELECTRONIC ENCAPSULATION THROUGH STENCIL PRINTING 有权

    公开(公告)号：US20210321524A1

    公开(公告)日：2021-10-14

    申请号：US17228893

    申请日：2021-04-13

    申请人： Flex Ltd.

    发明人： Weifeng Liu ,  Jesus A. Tan ,  William L. Uy ,  Dongkai Shangguan

    IPC分类号： H05K5/06 ,  B41F15/08

    摘要： Methods, devices, and systems are provided for the encapsulation of electronic devices. The encapsulation includes positioning an electronic device in a cavity of a mold, and screen or stencil printing an encapsulant, in a liquid form, around the flexible electronic device. The mold is of a sufficient thickness to allow the encapsulant to completely cover electronic components mounted on a first surface of the electronic device.

    Testing system for flexible sample in electronics having a retractable holder configured to conform a sample by a mandrel
    7.
    发明授权
    Testing system for flexible sample in electronics having a retractable holder configured to conform a sample by a mandrel 有权

    公开(公告)号：US11493414B2

    公开(公告)日：2022-11-08

    申请号：US17065403

    申请日：2020-10-07

    申请人： Flex Ltd.

    发明人： Weifeng Liu ,  Jesus A. Tan ,  William L. Uy ,  Dongkai Shangguan

    IPC分类号： G01N3/20 ,  G01N3/02

    摘要： Methods, devices, and systems for testing the flexibility of a sample such as an electronic device are provided herein. A testing system can have a motor operably connected to a mandrel such that the motor causes the mandrel to accurately and precisely rotate and cause the sample to conform to an outer surface of the mandrel. Moreover, a proximal end of the sample is secured to the outer surface of the mandrel, and the opposing distal end is controlled by a retractable holder such that the entire sample is subjected to a constant bend radius as the mandrel rotates. Other aspects and features such as controlling the environment around the mandrel and securing small samples to the mandrel are also described herein.

    Methods, devices, and systems for electronic device molding and encapsulation
    8.
    发明授权
    Methods, devices, and systems for electronic device molding and encapsulation 有权

    公开(公告)号：US11289393B2

    公开(公告)日：2022-03-29

    申请号：US16793788

    申请日：2020-02-18

    申请人： Flex Ltd.

    发明人： Weifeng Liu ,  Jesus A. Tan ,  William L. Uy ,  Dongkai Shangguan

    IPC分类号： H01L23/31 ,  H01L21/56 ,  B29C45/14

    摘要： Methods, devices, and systems are provided for the molding and encapsulation of flexible electronic devices. The encapsulation includes providing a mold shell made from an encapsulation material, positioning a flexible electronic device in the mold shell, and dispensing an encapsulant, in a liquid form, around the flexible electronic device. The mold shell, the dispensed encapsulant, and the electronic device forms an integral encapsulation package when the encapsulant is cured. The mold shell and the encapsulant may be made from a same material and, once cured, become an integral part of the encapsulated flexible electronic device.

    EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE
    9.
    发明申请
    EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE 有权

    公开(公告)号：US20210125958A1

    公开(公告)日：2021-04-29

    申请号：US16709750

    申请日：2019-12-10

    申请人： FLEX LTD

    发明人： Cheng Yang ,  Dongkai Shangguan ,  Li Yao

    IPC分类号： H01L23/00 ,  H01L23/367 ,  H05K1/02

    摘要： An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.