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公开(公告)号：US11304302B2
公开(公告)日：2022-04-12
申请号：US16709743
申请日：2019-12-10
申请人： FLEX LTD
发明人： Dongkai Shangguan , David Geiger , Venkat Iyer , Cheng Yang
摘要： Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.
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公开(公告)号：US10737344B2
公开(公告)日：2020-08-11
申请号：US15807125
申请日：2017-11-08
申请人： Flex Ltd.
发明人： Zohair Mehkri , Anwar Mohammed , Jesus Tan , David Geiger , Murad Kurwa
IPC分类号： B23K1/08 , B33Y50/00 , G06F30/20 , G06F30/28 , B23K3/08 , B33Y50/02 , B33Y80/00 , B29C64/393 , H05K3/34 , B29C64/106 , B29C64/112 , B23K3/06 , B33Y10/00 , B29L31/34 , B29L31/00
摘要： A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.
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3.发明申请公开(公告)号：US20200187364A1
公开(公告)日：2020-06-11
申请号：US16787169
申请日：2020-02-11
申请人： FLEX LTD
发明人： Zohair Mehkri , Anwar Mohammed , Jesus Tan , David Geiger , Murad Kurwa
IPC分类号： H05K3/34 , F28F21/06 , B23K3/08 , F28F13/00 , H05K1/18 , H05K3/00 , H05K1/02 , B23K1/00 , B23K1/20 , B23K1/08 , B23K1/008
摘要： A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.
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公开(公告)号：US20200180060A1
公开(公告)日：2020-06-11
申请号：US16787183
申请日：2020-02-11
申请人： FLEX LTD
发明人： Zohair Mehkri , Anwar Mohammed , Jesus Tan , David Geiger , Murad Kurwa
摘要： A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.
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公开(公告)号：US20240040703A1
公开(公告)日：2024-02-01
申请号：US18231043
申请日：2023-08-07
申请人： FLEX LTD
发明人： Dongkai Shangguan , David Geiger , Venkat Iyer , Cheng Yang
CPC分类号： H05K3/0044 , H05K3/0026 , H05K3/284 , H05K2203/025
摘要： Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.
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公开(公告)号：US11850684B2
公开(公告)日：2023-12-26
申请号：US16787177
申请日：2020-02-11
申请人： FLEX LTD
发明人： Zohair Mehkri , Anwar Mohammed , Jesus Tan , David Geiger , Murad Kurwa
IPC分类号： B23K3/08 , H05K3/34 , B33Y50/02 , B33Y80/00 , B29C64/393 , B23K1/08 , B29C64/106 , B29C64/112 , B23K3/06 , H05K13/04 , B33Y10/00 , B29L31/34 , B29L31/00
CPC分类号： B23K3/08 , B23K1/085 , B23K3/0653 , B23K3/087 , B29C64/106 , B29C64/112 , B29C64/393 , B33Y50/02 , B33Y80/00 , H05K3/3447 , H05K3/3468 , H05K13/0465 , B29L2031/3425 , B29L2031/7178 , B33Y10/00 , H05K2203/0165 , H05K2203/0173 , H05K2203/044
摘要： A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.
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公开(公告)号：US11723151B2
公开(公告)日：2023-08-08
申请号：US17719348
申请日：2022-04-12
申请人： FLEX LTD
发明人： Dongkai Shangguan , David Geiger , Venkat Iyer , Cheng Yang
CPC分类号： H05K3/0044 , H05K3/0026 , H05K3/284 , H05K2203/025
摘要： Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.
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公开(公告)号：US10828828B2
公开(公告)日：2020-11-10
申请号：US15807161
申请日：2017-11-08
申请人： Flex Ltd.
发明人： Zohair Mehkri , Anwar Mohammed , David Geiger , Murad Kurwa , Jesus Tan
IPC分类号： B29C70/68 , B29C70/88 , B29C64/153 , B33Y80/00 , B33Y10/00 , B29C70/70 , B29C64/10 , B29C64/118 , B29C64/124
摘要： A method of manufacturing a part includes printing a layer of 3D printable material, positioning a layer of interlay material on the layer of 3D printable material, and printing another layer of 3D printable material on the layer of interlay material. A manufactured part includes a base layer of 3D printable material and a plurality of pairs of alternating layers disposed on the base layer of 3D printable material. Each pair of the plurality of pairs includes a layer of interlay material and another layer of 3D printable material printed on the layer of interlay material. The layers of interlay material provide at least one property to the manufactured part not provided by the layers of 3D printable material.
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9.发明申请公开(公告)号：US20180132392A1
公开(公告)日：2018-05-10
申请号：US15807154
申请日：2017-11-08
申请人： Flex Ltd.
发明人： Zohair Mehkri , Anwar Mohammed , Jesus Tan , David Geiger , Murad Kurwa
IPC分类号： H05K13/00
CPC分类号： H05K13/0061 , H05K13/0069
摘要： A carrier assembly configured to facilitate manufacture of a printed circuit board assembly includes a bottom frame defining a generally rectangular configuration and having a length and a width. The bottom frame is adjustable to vary at least one of the length or the width thereof. The assembly further includes a core releasably positionable on the bottom frame and configured to support a circuit board thereon. A carrier assembly system includes the bottom frame and a plurality of cores. Methods of manufacturing printed circuit board assemblies utilizing carrier assemblies are also provided.
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公开(公告)号：US11039531B1
公开(公告)日：2021-06-15
申请号：US15980096
申请日：2018-05-15
申请人： Flex Ltd.
发明人： Jesus Tan , Anwar Mohammed , David Geiger , Weifeng Liu
摘要： An In-Mold Electronics (IME) device and method of manufacturing the IME device introduce a stretchable substrate laminated to a thermoplastic layer. The stretchable substrate has a screen printable surface for receiving printed conductive interconnects. This combination enables formation of an IME device with conductive interconnects oriented for hard to reach cavities and areas. The IME device eliminates the need to have additional mold features to enable deeper drawn cavities.
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