公开(公告)号：US10388492B2

公开(公告)日：2019-08-20

申请号：US15248496

申请日：2016-08-26

申请人： FM Industries, Inc.

发明人： Mahmood Naim ,  David Hammerich

IPC分类号： H01J37/32 ,  C23C4/134 ,  C23C4/11 ,  C23C4/02

摘要： A semiconductor processing member is provided, including a body and a plasma spray coating provided on the body. The coating is an ABO or ABCO complex oxide solid solution composition, where A, B and C are selected from the group consisting of La, Zr, Ce, Gd, Y, Yb and Si, and O is an oxide. The coating imparts both chlorine and fluorine plasma erosion resistance, reduces particle generation during plasma etching, and prevents spalling of the coating during wet cleaning of the semiconductor processing member.

公开(公告)号：US09790581B2

公开(公告)日：2017-10-17

申请号：US14562810

申请日：2014-12-08

申请人： FM Industries, Inc.

发明人： Mahmood Naim ,  David Hammerich

IPC分类号： C23C4/12 ,  C04B35/505 ,  C09K5/14 ,  C01F17/00 ,  C23C4/02 ,  C23C28/04 ,  C23C4/11 ,  C04B35/486

CPC分类号： C23C4/134 ,  C01F17/0018 ,  C01F17/0043 ,  C01P2006/32 ,  C04B35/486 ,  C04B35/505 ,  C04B2235/3225 ,  C04B2235/3244 ,  C09K5/14 ,  C23C4/02 ,  C23C4/11 ,  C23C28/042 ,  C23C28/048 ,  C04B41/009 ,  C04B35/581 ,  C04B35/111 ,  C04B35/565 ,  C04B35/52

摘要： A component for a semiconductor processing chamber, the component including a substrate and a coating layer provided on a surface of the substrate, wherein the coating layer includes at least a first coating layer having a thermal emissivity of more than 0.98 to 1, having plasma resistance, and having a color value L in a range of 35 to 40 through a thickness direction thereof.