公开(公告)号：US20130103338A1

公开(公告)日：2013-04-25

申请号：US13673111

申请日：2012-11-09

Applicant: FORMFACTOR, INC.

Inventor： Richard James Casler, JR. ,  Fenglei Du ,  Stephen Craig Fullerton

IPC: G05B13/04

CPC classification number: G05B13/048 ,  G01R31/2891 ,  H01L22/20

Abstract: An improved method and apparatus for automatically aligning probe pins to the test or bond pads of semiconductor devices under changing conditions. In at least one embodiment, a dynamic model is used to predict an impact of changing conditions to wafer probing process. This reduces the need for frequent measurements and calibrations during probing and testing, thereby increasing the number of dice that can be probed and tested in a given period of time and increasing the accuracy of probing at the same time. Embodiments of the present invention also make it possible to adjust positions of probe pins and pads in response to the changing conditions while they are in contact with each other.

Abstract translation: 一种改进的方法和装置，用于在变化的条件下将探针引脚自动对准半导体器件的测试或接合焊盘。 在至少一个实施例中，使用动态模型来预测改变条件对晶片探测过程的影响。 这减少了在探测和测试期间频繁测量和校准的需要，从而增加了在给定时间段内可以探测和测试的骰子的数量，同时提高了探测的准确性。 本发明的实施例还使得可以在彼此接触的同时响应于变化条件来调整探针和焊盘的位置。

公开(公告)号：US08781779B2

公开(公告)日：2014-07-15

申请号：US13673111

申请日：2012-11-09

Applicant: Formfactor, Inc.

Inventor： Richard James Casler, Jr. ,  Fenglei Du ,  Stephen Craig Fullerton

IPC: G01C3/00

CPC classification number: G05B13/048 ,  G01R31/2891 ,  H01L22/20

Abstract: An improved method and apparatus for automatically aligning probe pins to the test or bond pads of semiconductor devices under changing conditions. In at least one embodiment, a dynamic model is used to predict an impact of changing conditions to wafer probing process. This reduces the need for frequent measurements and calibrations during probing and testing, thereby increasing the number of dice that can be probed and tested in a given period of time and increasing the accuracy of probing at the same time. Embodiments of the present invention also make it possible to adjust positions of probe pins and pads in response to the changing conditions while they are in contact with each other.

Abstract translation: 一种改进的方法和装置，用于在变化的条件下将探针引脚自动对准半导体器件的测试或接合焊盘。 在至少一个实施例中，使用动态模型来预测改变条件对晶片探测过程的影响。 这减少了在探测和测试期间频繁测量和校准的需要，从而增加了在给定时间段内可以探测和测试的骰子的数量，同时提高了探测的准确性。 本发明的实施例还使得可以在彼此接触的同时响应于变化条件来调整探针和焊盘的位置。