公开(公告)号：US20240078942A1

公开(公告)日：2024-03-07

申请号：US18140001

申请日：2023-04-27

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Kuai QIN ,  Heng GUO ,  Shaojia XIE ,  Bin CAI ,  Caineng HUO ,  Kailiang FAN

IPC: G09G3/00 ,  H01L25/075 ,  H01L27/15 ,  H01L33/62

CPC classification number: G09G3/006 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/62 ,  G09G2330/12

Abstract: A display module includes a substrate, m rows and n columns of pad sets, m*n sets of light emitting chip sets and multiple pins. The substrate includes a first surface and a second surface disposed opposite to each other. Each set of pad sets among the m rows and n columns of pad sets includes three pairs of pads, and first pads in the each set of pad sets are electrically connected. In a same set of light emitting chips, each of first electrodes of the light emitting chips is connected to a respective one of first pads of one set of pad sets among the m rows and n columns of pad sets, and each of second electrodes of the light emitting chips is connected to a respective one of second pads of a same set of pad sets.

公开(公告)号：US20240006572A1

公开(公告)日：2024-01-04

申请号：US18215980

申请日：2023-06-29

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Kuai QIN ,  Shaojia XIE ,  Bin CAI ,  Fangping HE ,  Zhuang PENG ,  Caineng HUO

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L2933/0066

Abstract: A LED display unit group includes a substrate and an electronic device, where the substrate includes a pad layer, an ink layer and an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device; the pad layer includes pad regions and a non-pad region, each of the pad regions includes multiple pads, and the non-pad region includes metal traces; and the ink layer is disposed above the pad layer; each of the multiple pads is configured to secure the electronic device and is electrically connected to the electronic device; the metal traces are configured to connect the multiple pads via the metal traces; and an orthographic projection of the identification structure on the substrate is partially overlapped or staggered with an orthographic projection of the pad regions on the substrate.