SUBSTRATE, LIGHT-EMITTING MODULE, AND PREPARATION METHOD THEREOF

    公开(公告)号:US20250113672A1

    公开(公告)日:2025-04-03

    申请号:US18774350

    申请日:2024-07-16

    Abstract: A substrate includes a substrate body and a top copper layer disposed on the substrate body. Multiple insulated channels are disposed on the top copper layer. The top copper layer forms a top circuit structure based on the multiple insulated channels. A light-emitting element installation region is disposed on the top layer circuit structure. The top copper layer in the light-emitting element installation region protrudes upward to form at least one copper layer boss. Multiple light-emitting element welding positions are disposed in the light-emitting element installation region. A light-emitting element welding position is disposed on any copper layer boss. The copper layer boss is configured to adjust the height of the light emission surface of a light-emitting element disposed in the light-emitting element installation region.

Patent Agency Ranking