公开(公告)号：US12087213B2

公开(公告)日：2024-09-10

申请号：US18457755

申请日：2023-08-29

申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

发明人： Libing Pan ,  Zhiguo Xie ,  Penghui Dong ,  Xiaoji Zhang ,  Danlei Gong ,  Man Zhao ,  Zihao Chen

IPC分类号： G09G3/32 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238 ,  F21W131/30

CPC分类号： G09G3/32 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238 ,  F21W2131/30 ,  G09G2320/02

摘要： Provided are a beveled light-emitting lamp bead, a beveled light-emitting lamp bead holder, a manufacturing method therefor, and a display device. The beveled light-emitting lamp bead holder includes a holder body and a metal holder embedded in the holder body, where the holder body is divided by the metal holder into a cup shield located on a top side and a support structure located on a bottom side, a cup bottom in the cup shield is provided with a chip mounting surface parallel to a cup rim top surface, a bottom portion of the support structure is provided with a soldering plane, the soldering plane is electrically connected to the chip mounting surface through the metal holder, and an inclination angle is formed between the chip mounting surface and the soldering plane.

公开(公告)号：US11380827B2

公开(公告)日：2022-07-05

申请号：US16908771

申请日：2020-06-23

申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

发明人： Fuhai Li ,  Penghui Dong ,  Dongzi Chen ,  Zhiguo Xie ,  Quan Xie

IPC分类号： H01L33/60 ,  H01L25/075 ,  H01L33/54 ,  H01L33/52 ,  H01L33/46 ,  F21V19/00 ,  F21Y115/10

摘要： Provided are a Light Emitting Diode (LED) device and a backlight module. The LED device includes a substrate, a chip, an encapsulation structure and a top reflective shielding layer; the chip is disposed on the substrate; the encapsulation structure covers the substrate and covers the chip; and the top reflective shielding layer is disposed on the encapsulation structure and located at a central position of an upper surface of the encapsulation structure, and covers a part of the upper surface of the encapsulation structure.