公开(公告)号：US20230217586A1

公开(公告)日：2023-07-06

申请号：US18091539

申请日：2022-12-30

申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

发明人： Xinghan HE ,  Danlei GONG ,  Zhonghai YAN ,  Hua FAN ,  Fabo LIU ,  Youwei ZHAN ,  Weineng CHEN ,  Taotao SONG

IPC分类号： H05K1/02 ,  F21V19/00 ,  F21V29/70 ,  H05K3/40 ,  H05K3/30

CPC分类号： H05K1/0271 ,  F21V19/0025 ,  F21V29/70 ,  H05K1/0203 ,  H05K3/306 ,  H05K3/4038 ,  F21Y2105/10

摘要： Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.