公开(公告)号：US20240144864A1

公开(公告)日：2024-05-02

申请号：US18457755

申请日：2023-08-29

申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

发明人： Libing PAN ,  Zhiguo XIE ,  Penghui DONG ,  Xiaoji ZHANG ,  Danlei GONG ,  Man ZHAO ,  Zihao CHEN

IPC分类号： G09G3/32 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238

CPC分类号： G09G3/32 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238 ,  F21W2131/30 ,  G09G2320/02

摘要： Provided are a beveled light-emitting lamp bead, a beveled light-emitting lamp bead holder, a manufacturing method therefor, and a display device. The beveled light-emitting lamp bead holder includes a holder body and a metal holder embedded in the holder body, where the holder body is divided by the metal holder into a cup shield located on a top side and a support structure located on a bottom side, a cup bottom in the cup shield is provided with a chip mounting surface parallel to a cup rim top surface, a bottom portion of the support structure is provided with a soldering plane, the soldering plane is electrically connected to the chip mounting surface through the metal holder, and an inclination angle is formed between the chip mounting surface and the soldering plane.

公开(公告)号：US20230217586A1

公开(公告)日：2023-07-06

申请号：US18091539

申请日：2022-12-30

申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

发明人： Xinghan HE ,  Danlei GONG ,  Zhonghai YAN ,  Hua FAN ,  Fabo LIU ,  Youwei ZHAN ,  Weineng CHEN ,  Taotao SONG

IPC分类号： H05K1/02 ,  F21V19/00 ,  F21V29/70 ,  H05K3/40 ,  H05K3/30

CPC分类号： H05K1/0271 ,  F21V19/0025 ,  F21V29/70 ,  H05K1/0203 ,  H05K3/306 ,  H05K3/4038 ,  F21Y2105/10

摘要： Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.

公开(公告)号：US20230351974A1

公开(公告)日：2023-11-02

申请号：US18136018

申请日：2023-04-18

申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

发明人： Weineng CHEN ,  Xiang CHEN ,  Dequan ZHENG ,  Zhonghai YAN ,  Fabo LIU ,  Danlei GONG ,  Hua FAN

IPC分类号： G09G3/34

CPC分类号： G09G3/342 ,  G09G2310/08 ,  G09G2320/0626 ,  G09G2300/0426 ,  H01L25/0753

摘要： Provided are a backlight board and a driving method thereof, a backlight module and a driving method thereof, and a display device. The backlight board includes light-emitting devices arranged in rows and columns and a first connector, where each first pin of the first connector is electrically connected to first electrodes of light-emitting devices in one row, each second pin of the first connector is electrically connected to second electrodes of light-emitting devices in one column; and in one drive cycle, a first drive signal drives light-emitting devices in each row for a duration T/n at different times, and a second drive signal drives light-emitting devices in each column for a duration T/n at different times.

公开(公告)号：US20210167256A1

公开(公告)日：2021-06-03

申请号：US16609453

申请日：2018-10-23

申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

发明人： Haijun WANG ,  Yangcheng HUANG ,  Xiang CHEN ,  Fabo LIU ,  Zhonghai YAN ,  Danlei GONG ,  Junhua CHEN ,  Yushan LIN ,  Jian GAN ,  Haixing TAN

IPC分类号： H01L33/50 ,  C09K11/77 ,  C09K11/08

摘要： The disclosure provides an LED white light device, including a blue light chip and phosphors. The blue light chip has a band of (455-470) nm. The phosphors include a dual-band yellow phosphor and a red phosphor having an excited light peak wavelength range of (610-660) nm. The yellow phosphor and the red phosphor are mixed according to a proportion of 1:(0.03-0.2) and cover the blue light chip, such that blue light emitted by the packaged LED white light device has a peak wavelength range of (450-465) nm. The disclosure also provides a preparation method of an LED white light device and an LED backlight module adopting the above LED white light device. The disclosure achieves the effects of blue light prevention, high color gamut and pure white simultaneously, the color uniformity and consistency are good, and a blue-green-red three-color continuous spectrum is provided, which is closer to a solar spectrum.