公开(公告)号：US10795102B2

公开(公告)日：2020-10-06

申请号：US16238534

申请日：2019-01-03

申请人： FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD. ,  FOXCONN INTERCONNECT TECHNOLOGY LIMITED

发明人： Shih-Wei Hsiao ,  Hsiu-Yuan Hsu ,  Wei-Chih Lin ,  Shuo-Hsiu Hsu ,  Yen-Hsu Ko ,  Chih-Chung Hsieh ,  Cheng-Kai Huang ,  Paul Chen ,  Genn-Sheng Lee ,  Jia-Hau Liu ,  Mao-Chun Weng ,  Wayne Chou

IPC分类号： H05K1/11 ,  H05K1/14 ,  G02B6/42 ,  H05K1/02 ,  H05K5/03 ,  H05K5/00 ,  H05K5/02 ,  H01R12/70 ,  H01R12/71 ,  H05K1/18 ,  G02B6/38

摘要： A interconnection system includes a panel side kit and a wall-mount kit coupled with each other and secured together via magnetic forces. The wall-mount kit includes a printed circuit board enclosed within a bracket and defining a center region for power transmission and a pair of side regions for high speed transmission. In the side regions, on the coupling side a plurality of wireless transmission units are located while on the back side a plurality of ROSA OE modules are provided to transfer the optical signal from optical fibers to the electronic signal for wireless transmission wherein the optical fibers are linked to a control box via a plurality of TOSA EO modules. The panel side kit includes wireless receiving units that interact with the wireless transmission units, and a plurality of connectors with the body of the display.

公开(公告)号：US09588312B2

公开(公告)日：2017-03-07

申请号：US14884772

申请日：2015-10-16

申请人： FOXCONN INTERCONNECT TECHNOLOGY LIMITED

发明人： Chun-Yi Chang ,  Jia-Hau Liu

IPC分类号： G02B6/42 ,  H05K1/02

CPC分类号： G02B6/428 ,  G02B6/4206 ,  H05K1/0209 ,  H05K1/0243 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10545 ,  H05K2203/167

摘要： An optoelectronic assembly includes a printed circuit board (PCB) defining opposite upper and lower surfaces, and equipped, on the upper surface, with an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, a lens module located on the side of the lower surface and communicating with the active component through via holes in the PCB, and a fiber assembly located in the lens module to be optically coupled to the active component via said lens module.

摘要翻译： 光电组件包括限定相对的上表面和下表面的印刷电路板（PCB），并且在上表面上配备有通过倒装芯片技术相互连接的有源部件和集成电路（IC），透镜模块 位于下表面的侧面并通过PCB中的通孔与有源部件连通，以及位于透镜模块中的光纤组件，以通过所述透镜模块光学耦合到有源部件。