公开(公告)号：US10933589B2

公开(公告)日：2021-03-02

申请号：US16468930

申请日：2016-12-13

Applicant: FUJI CORPORATION

Inventor： Yoshitaka Hashimoto ,  Masatoshi Fujita ,  Kenji Tsukada ,  Akihiro Kawajiri ,  Masato Suzuki ,  Katsuaki Makihara

IPC: B29C64/393 ,  B33Y50/00 ,  B29C64/209 ,  B29C67/00 ,  G06F30/00 ,  B32B37/00

Abstract: To provide a data conversion device capable of generating data necessary for shaping a target object using an inkjet method from three-dimensional data in accordance with an impact diameter. Grid data generation section of data conversion device generates grid data obtained by defining layer data by each grid region indicating a position to which a droplet is ejected by the inkjet method. Ejection position change section changes the position (ejection region) to which the droplet is ejected on grid data, based on impact diameter when the droplet is ejected and length of grid regions.

公开(公告)号：US11439025B2

公开(公告)日：2022-09-06

申请号：US16301076

申请日：2016-06-08

Applicant: FUJI CORPORATION

Inventor： Yoshitaka Hashimoto ,  Masatoshi Fujita ,  Kenji Tsukada ,  Akihiro Kawajiri ,  Masato Suzuki ,  Katsuaki Makihara

IPC: H05K3/28 ,  H05K3/12 ,  H05K3/30 ,  H05K3/32 ,  H05K1/18 ,  H05K3/00

Abstract: In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.

公开(公告)号：US11006529B2

公开(公告)日：2021-05-11

申请号：US16307082

申请日：2016-06-28

Applicant: FUJI CORPORATION

Inventor： Kenji Tsukada ,  Masatoshi Fujita ,  Yoshitaka Hashimoto ,  Tasuku Takeuchi ,  Akihiro Kawajiri ,  Masato Suzuki ,  Katsuaki Makihara

IPC: H05K3/12 ,  H05K1/09 ,  H05K3/46

Abstract: A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.