公开(公告)号：US11006529B2

公开(公告)日：2021-05-11

申请号：US16307082

申请日：2016-06-28

Applicant: FUJI CORPORATION

Inventor： Kenji Tsukada ,  Masatoshi Fujita ,  Yoshitaka Hashimoto ,  Tasuku Takeuchi ,  Akihiro Kawajiri ,  Masato Suzuki ,  Katsuaki Makihara

IPC: H05K3/12 ,  H05K1/09 ,  H05K3/46

Abstract: A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.

公开(公告)号：US12048102B2

公开(公告)日：2024-07-23

申请号：US17630860

申请日：2019-07-30

Applicant: FUJI CORPORATION

Inventor： Ryojiro Tominaga ,  Kenji Tsukada ,  Ryo Sakakibara ,  Tasuku Takeuchi

IPC: H05K3/00 ,  H05K3/10 ,  H05K3/40

CPC classification number: H05K3/10 ,  H05K3/40 ,  H05K2203/0776

Abstract: To provide an electronic circuit production method using 3D layer shaping capable of producing an electronic circuit having improved electrical properties and mechanical properties by utilizing characteristics of a fluid containing a metal particle by selectively using the fluid containing the metal particle. The electronic circuit production method using 3D layer shaping, the method including a wiring forming step of forming a wiring by applying a fluid containing a nano-sized metal nanoparticle on an insulating member and curing the applied fluid containing the metal nanoparticle; and a connection terminal forming step of forming a connection terminal electrically connected to the wiring by applying a fluid containing a micro-sized metal microparticle and curing the applied fluid containing the metal microparticle.

公开(公告)号：US11945886B2

公开(公告)日：2024-04-02

申请号：US17630850

申请日：2019-07-31

Applicant: FUJI CORPORATION

Inventor： Tasuku Takeuchi ,  Ryojiro Tominaga

IPC: C08F2/48

CPC classification number: C08F2/48

Abstract: A cured resin formation method including an applying step of applying an ultraviolet curable resin on a base; and a curing step of curing the ultraviolet curable resin by irradiating the ultraviolet curable resin applied in the applying step with ultraviolet rays, in which in the curing step, the ultraviolet curable resin is irradiated with ultraviolet rays while cooling the ultraviolet curable resin, so that a difference between an ordinary temperature of the ultraviolet curable resin and a temperature of the ultraviolet curable resin when irradiated with ultraviolet rays is within a set temperature difference set in advance.