公开(公告)号：US20210269272A1

公开(公告)日：2021-09-02

申请号：US16986225

申请日：2020-08-05

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Susumu YOSHINO ,  Yoshifumi IIDA ,  Satoshi KAMIWAKI ,  Sakae TAKEUCHI ,  Satomi KASHIWAGI ,  Sumiaki YAMASAKI ,  Takahiro ISHIZUKA ,  Shigeru SEITOKU ,  Kiyohiro YAMANAKA

IPC: B65H37/04 ,  B65H37/02 ,  C09J125/14

Abstract: A method for producing a printed material includes providing pressure-induced phase transition particles to a part of an outside margin portion or a portion to be folded of a recording medium; bonding the pressure-induced phase transition particles to the recording medium; and pressure-bonding a multilayer body in which plural recording media are stacked, the recording media including the recording medium having the pressure-induced phase transition particles bonded thereon.

公开(公告)号：US20220305739A1

公开(公告)日：2022-09-29

申请号：US17385301

申请日：2021-07-26

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takeshi IWANAGA ,  Shigeru SEITOKU ,  Kosuke NAKADA ,  Tomoyo OKUBO ,  Hidekazu HIROSE

IPC: B29C65/00 ,  H01M10/0525 ,  H01M50/417 ,  H01M50/491 ,  C08J7/043 ,  H01M50/457

Abstract: A polyimide porous film includes: a polyimide porous film body; and at least one of resin particles and a resin porous film, the at least one of the resin particles and the resin porous film adhering to one surface or both surfaces of the polyimide porous film body, and containing a fluorine-based resin or containing a fluorine-based resin and an acrylic resin.

公开(公告)号：US20220267527A1

公开(公告)日：2022-08-25

申请号：US17403011

申请日：2021-08-16

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kosuke NAKADA ,  Shigeru SEITOKU ,  Takeshi IWANAGA ,  Tomoyo OKUBO ,  Hajime SUGAHARA ,  Hidekazu HIROSE

IPC: C08G73/10 ,  C08J5/18 ,  C08J9/26

Abstract: A polyimide precursor solution contains: an aqueous solvent containing water; particles; and a polyimide precursor, wherein the polyimide precursor has a high molecular weight region A containing a high molecular weight side maximum value and a low molecular weight region B containing a low molecular weight side maximum value in an elution curve obtained by gel permeation chromatography, a weight average molecular weight in the high molecular weight region A is 50,000 or more, a weight average molecular weight in the low molecular weight region B is 10,000 or more and 30,000 or less, and a value of a/(a+b) is 0.60 or more and 0.98 or less in which a represents an area of the high molecular weight region A and b represents an area of the low molecular weight region B.

公开(公告)号：US20220306895A1

公开(公告)日：2022-09-29

申请号：US17699991

申请日：2022-03-21

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Shigeru SEITOKU ,  Kosaku YOSHIMURA ,  Hidekazu HIROSE ,  Hajime SUGAHARA ,  Kosuke NAKADA ,  Satoshi YOSHIDA

IPC: C09D179/08 ,  C08G73/10 ,  C08J9/24 ,  C08J9/00

Abstract: A polyimide precursor solution contains a polyimide precursor, particles, and a water-based solvent that contains an amine compound (A), an organic solvent (B) other than the amine compound (A) and amide compounds, and water, in which a boiling point of the organic solvent (B) is higher than a boiling point of the amine compound (A), and is 200° C. or higher and 300° C. or lower.

公开(公告)号：US20230192955A1

公开(公告)日：2023-06-22

申请号：US17827780

申请日：2022-05-29

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kosuke NAKADA ,  Hidekazu HIROSE ,  Kosaku YOSHIMURA ,  Shigeru SEITOKU ,  Hajime SUGAHARA ,  Satoshi YOSHIDA

IPC: C08G73/10 ,  H01B3/30 ,  C08J5/18

CPC classification number: C08G73/1007 ,  H01B3/306 ,  C08J5/18 ,  C08J2379/08

Abstract: A polyimide precursor solution includes a polyimide precursor that is a polymer of an aromatic tetracarboxylic dianhydride and an aromatic diamine compound, resin particles, an aqueous solvent containing water, and an amine compound having a boiling point of equal to or higher than 250° C. and equal to or lower than 300° C., in which a ratio of a volume of the resin particles to a volume of the amine compound (volume of resin particles/volume of amine compound) is equal to or more than 0.22 and equal to or less than 0.61.

公开(公告)号：US20230080755A1

公开(公告)日：2023-03-16

申请号：US17591983

申请日：2022-02-03

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Shigeru SEITOKU ,  Kosuke NAKADA ,  Takeshi IWANAGA ,  Hidekazu HIROSE

IPC: C08L79/08

Abstract: A polyimide precursor solution includes: a polyimide precursor; polyester resin particles containing a polyester resin and having a volume average particle diameter of from 3 μm to 50 μm inclusive and an average circularity of 0.970 or more; and a solvent.

公开(公告)号：US20230077397A1

公开(公告)日：2023-03-16

申请号：US17702776

申请日：2022-03-23

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takeshi IWANAGA ,  Shigeru SEITOKU ,  Kosuke NAKADA ,  Hidekazu HIROSE

IPC: C08G73/12 ,  C08G73/10

Abstract: A polyimide precursor solution includes an aqueous solvent including water, a polyimide precursor, resin particles, and an ionization agent X having a boiling point of 100° C. or more and 130° C. or less and an ionization agent Y having a boiling point of 250° C. or more and 300° C. or less.

公开(公告)号：US20230076583A1

公开(公告)日：2023-03-09

申请号：US17592084

申请日：2022-02-03

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kosuke NAKADA ,  Shigeru SEITOKU ,  Takeshi IWANAGA ,  Hidekazu HIROSE

IPC: C08G73/10 ,  C09D179/08

Abstract: A polyimide precursor solution includes: a polyimide precursor that is a polymer of a tetracarboxylic dianhydride and a diamine compound; particles; a solvent; and a compound having at least four carboxy groups per molecule.

公开(公告)号：US20220306806A1

公开(公告)日：2022-09-29

申请号：US17392608

申请日：2021-08-03

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Tomoyo OKUBO ,  Takeshi IWANAGA ,  Hidekazu HIROSE ,  Kosuke NAKADA ,  Hajime SUGAHARA ,  Shigeru SEITOKU

IPC: C08G73/10 ,  C08J5/18 ,  C08J9/26

Abstract: A polyimide precursor film contains a polyimide precursor, in which a total content of a solvent containing water and a solvent other than water in the polyimide precursor film is 5 mass % or more and 40 mass % or less, and a mass ratio of water to the solvent other than water in the polyimide precursor film is 0 or more and 2.5 or less.