公开(公告)号：US20220306895A1

公开(公告)日：2022-09-29

申请号：US17699991

申请日：2022-03-21

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Shigeru SEITOKU ,  Kosaku YOSHIMURA ,  Hidekazu HIROSE ,  Hajime SUGAHARA ,  Kosuke NAKADA ,  Satoshi YOSHIDA

IPC: C09D179/08 ,  C08G73/10 ,  C08J9/24 ,  C08J9/00

Abstract: A polyimide precursor solution contains a polyimide precursor, particles, and a water-based solvent that contains an amine compound (A), an organic solvent (B) other than the amine compound (A) and amide compounds, and water, in which a boiling point of the organic solvent (B) is higher than a boiling point of the amine compound (A), and is 200° C. or higher and 300° C. or lower.

公开(公告)号：US20220089829A1

公开(公告)日：2022-03-24

申请号：US17129286

申请日：2020-12-21

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Tomoyo OKUBO ,  Shunsuke NOZAKI ,  Tomoya SASAKI ,  Hidekazu HIROSE

IPC: C08J9/26 ,  C08L25/14

Abstract: A polyimide precursor solution, includes: a polyimide precursor; resin particles having a volume average particle diameter of 5 nm or more and 100 nm or less, and having a volume particle size distribution wherein a ratio of a volume frequency of resin particles having a particle diameter of 150 nm or more to a volume frequency of all of the resin particles in the polyimide precursor solution is 5% or less; and an aqueous solvent containing water.

公开(公告)号：US20220073743A1

公开(公告)日：2022-03-10

申请号：US17326364

申请日：2021-05-21

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Mieko SEKI ,  Hidekazu HIROSE

IPC: C08L79/08 ,  C08G73/10 ,  C08J5/18 ,  C08J9/28 ,  C08F212/08 ,  C08F220/18 ,  C08F222/10 ,  C08K5/3492

Abstract: A polyimide precursor solution contains a polyimide precursor, resin particles having a core and a coating resin layer, the coating resin layer contains a melamine resin, and a solvent.

公开(公告)号：US20220069413A1

公开(公告)日：2022-03-03

申请号：US17137876

申请日：2020-12-30

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Kosuke NAKADA ,  Yasunobu KASHIMA ,  Kosaku YOSHIMURA ,  Tomoya SASAKI ,  Hajime SUGAHARA ,  Tomoyo OKUBO ,  Hidekazu HIROSE

IPC: H01M50/423 ,  H01M50/429 ,  H01M50/403 ,  H01M50/46 ,  H01M50/491 ,  H01M50/494 ,  H01M50/449

Abstract: A separator for a non-aqueous secondary battery includes: a polyimide porous film; and adhesive resin particles that are attached to a surface of the polyimide porous film and have a responsiveness to at least one of pressure and heat.

公开(公告)号：US20220064379A1

公开(公告)日：2022-03-03

申请号：US17146436

申请日：2021-01-11

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Hajime SUGAHARA ,  Hidekazu HIROSE ,  Kosaku YOSHIMURA ,  Tomoya SASAKI ,  Yasunobu KASHIMA ,  Kosuke NAKADA ,  Tomoyo OKUBO

IPC: C08G73/10 ,  C08J9/26

Abstract: A particle-dispersed polyimide precursor solution contains: a polyimide precursor consisting of a polymer of a tetracarboxylic dianhydride and a diamine containing a fluorene-based diamine having a fluorene skeleton; particles; and an aqueous solvent containing water.

公开(公告)号：US20230192955A1

公开(公告)日：2023-06-22

申请号：US17827780

申请日：2022-05-29

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kosuke NAKADA ,  Hidekazu HIROSE ,  Kosaku YOSHIMURA ,  Shigeru SEITOKU ,  Hajime SUGAHARA ,  Satoshi YOSHIDA

IPC: C08G73/10 ,  H01B3/30 ,  C08J5/18

CPC classification number: C08G73/1007 ,  H01B3/306 ,  C08J5/18 ,  C08J2379/08

Abstract: A polyimide precursor solution includes a polyimide precursor that is a polymer of an aromatic tetracarboxylic dianhydride and an aromatic diamine compound, resin particles, an aqueous solvent containing water, and an amine compound having a boiling point of equal to or higher than 250° C. and equal to or lower than 300° C., in which a ratio of a volume of the resin particles to a volume of the amine compound (volume of resin particles/volume of amine compound) is equal to or more than 0.22 and equal to or less than 0.61.

公开(公告)号：US20230080755A1

公开(公告)日：2023-03-16

申请号：US17591983

申请日：2022-02-03

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Shigeru SEITOKU ,  Kosuke NAKADA ,  Takeshi IWANAGA ,  Hidekazu HIROSE

IPC: C08L79/08

Abstract: A polyimide precursor solution includes: a polyimide precursor; polyester resin particles containing a polyester resin and having a volume average particle diameter of from 3 μm to 50 μm inclusive and an average circularity of 0.970 or more; and a solvent.

公开(公告)号：US20230077397A1

公开(公告)日：2023-03-16

申请号：US17702776

申请日：2022-03-23

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takeshi IWANAGA ,  Shigeru SEITOKU ,  Kosuke NAKADA ,  Hidekazu HIROSE

IPC: C08G73/12 ,  C08G73/10

Abstract: A polyimide precursor solution includes an aqueous solvent including water, a polyimide precursor, resin particles, and an ionization agent X having a boiling point of 100° C. or more and 130° C. or less and an ionization agent Y having a boiling point of 250° C. or more and 300° C. or less.

公开(公告)号：US20230076583A1

公开(公告)日：2023-03-09

申请号：US17592084

申请日：2022-02-03

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kosuke NAKADA ,  Shigeru SEITOKU ,  Takeshi IWANAGA ,  Hidekazu HIROSE

IPC: C08G73/10 ,  C09D179/08

Abstract: A polyimide precursor solution includes: a polyimide precursor that is a polymer of a tetracarboxylic dianhydride and a diamine compound; particles; a solvent; and a compound having at least four carboxy groups per molecule.

公开(公告)号：US20220306806A1

公开(公告)日：2022-09-29

申请号：US17392608

申请日：2021-08-03

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Tomoyo OKUBO ,  Takeshi IWANAGA ,  Hidekazu HIROSE ,  Kosuke NAKADA ,  Hajime SUGAHARA ,  Shigeru SEITOKU

IPC: C08G73/10 ,  C08J5/18 ,  C08J9/26

Abstract: A polyimide precursor film contains a polyimide precursor, in which a total content of a solvent containing water and a solvent other than water in the polyimide precursor film is 5 mass % or more and 40 mass % or less, and a mass ratio of water to the solvent other than water in the polyimide precursor film is 0 or more and 2.5 or less.