公开(公告)号：US20140076842A1

公开(公告)日：2014-03-20

申请号：US14082756

申请日：2013-11-18

Applicant: FUJIFILM Corporation

Inventor： Shuji TAKAHASHI

IPC: H01L41/39

CPC classification number: H01L41/39 ,  B41J2/161 ,  B41J2/1628 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  H01L21/32136 ,  H01L41/0973 ,  H01L41/29

Abstract: A dry etching method of etching a conductive material layered on a dielectric material, comprising: using a mixed gas including a halogen gas and an oxygen gas as an etching gas, a mixing ratio of the oxygen gas in the mixed gas being equal to or greater than 30% and equal to or less than 60%; setting a gas pressure in a chamber at a time of supplying the mixed gas into the chamber and generating plasma, within a range equal to or greater than 1 Pa and less than 5 Pa; and applying a bias voltage of frequency equal to or greater than 800 kHz and less than 4 MHz as a bias voltage to an etched material in which the conductive material is layered on the dielectric material, and performing etching, wherein the dielectric material is a ferroelectric material and the conductive material is a noble metal material.

Abstract translation: 一种用于蚀刻层叠在电介质材料上的导电材料的干式蚀刻方法，包括：使用包含卤素气体和氧气的混合气体作为蚀刻气体，混合气体中的氧气的混合比等于或大于 超过30％且等于或小于60％; 在将混合气体供应到室中并在等于或大于1Pa且小于5Pa的范围内产生等离子体时，在室内设定气体压力; 以及将等于或大于800kHz且小于4MHz的频率的偏置电压作为偏置电压施加到其中导电材料层叠在电介质材料上的蚀刻材料，并进行蚀刻，其中介电材料是铁电体 材料和导电材料是贵金属材料。

公开(公告)号：US20140224427A1

公开(公告)日：2014-08-14

申请号：US14181279

申请日：2014-02-14

Applicant: FUJIFILM CORPORATION

Inventor： Shuji TAKAHASHI

IPC: H01L21/687 ,  H01J37/20

CPC classification number: H01J37/20 ,  H01J37/32082 ,  H01J37/32715 ,  H01L21/68721

Abstract: A dry etching apparatus according to an aspect of the present invention is provided with a stage on which a substrate including a resist mask on an outermost layer thereof is mounted; a clamp for holding down the substrate from above the resist mask to fix the substrate on the stage; a chamber within which the stage and the clamp are housed; an exhaust device which evacuates the chamber; a process gas supply device which supplies a process gas into the chamber; and a power supply for supplying electrical power used to generate plasma within the chamber, wherein the clamp has an annular structure for covering an entire outer circumference and side surface of the substrate, and an antiadhesion layer composed of an inorganic film for preventing an adhesion of a resist material is formed on the contact surface side of the clamp in contact with the substrate.

Abstract translation: 根据本发明的一个方面的干蚀刻装置设置有在其上安装包括其最外层上的抗蚀剂掩模的基板的阶段; 用于从抗蚀剂掩模上方压住衬底以将衬底固定在平台上的夹具; 其中容纳所述平台和所述夹具的室; 排气室的排气装置; 工艺气体供给装置，其将处理气体供给到所述室中; 以及用于提供用于在所述室内产生等离子体的电力的电源，其中所述夹具具有用于覆盖所述基板的整个外周和侧表面的环形结构，以及由用于防止粘附的无机膜构成的抗粘附层 在与基板接触的夹具的接触表面侧上形成抗蚀剂材料。

公开(公告)号：US20200066494A1

公开(公告)日：2020-02-27

申请号：US16669514

申请日：2019-10-31

Applicant: FUJIFILM CORPORATION

Inventor： Naoki MURAKAMI ,  Shuji TAKAHASHI

IPC: H01J37/32 ,  C23C14/34 ,  H01J37/34 ,  H01L41/316

Abstract: A film forming device includes an adhesion preventing mechanism in a film formation chamber, in which the adhesion preventing mechanism is configured with a plurality of adhesion preventing plates including at least a substrate edge adhesion preventing plate that is provided on an edge of a region on the substrate holding portion where the substrate is provided and a substrate outer peripheral region adhesion preventing plate that is disposed on an outer periphery of the substrate edge adhesion preventing plate to be spaced from the substrate edge adhesion preventing plate, a potential adjusting mechanism that is electrically connected to any one of the substrate edge adhesion preventing plate or the substrate outer peripheral region adhesion preventing plate is provided, and the adhesion preventing plate connected to the potential adjusting mechanism and an adhesion preventing plate disposed adjacent thereto are disposed at an interval of 0.5 mm to 3.0 mm.

公开(公告)号：US20140085377A1

公开(公告)日：2014-03-27

申请号：US14092657

申请日：2013-11-27

Applicant: FUJIFILM Corporation

Inventor： Shuji TAKAHASHI

IPC: B41J2/165

CPC classification number: B41J2/16535 ,  B41J2/1433 ,  B41J2/1606 ,  B41J2/16585 ,  B41J2002/16564 ,  B41J2002/16573

Abstract: There are provided an inkjet recording device that can stably secure liquid-repellent performance on a surface of a liquid-repellent film formed on a nozzle surface for a long term, and a maintenance method thereof. The inkjet recording device includes: an inkjet head that has a nozzle surface in which a nozzle opening of a nozzle to eject a liquid is formed and on which a liquid-repellent film is formed with an amorphous fluorine resin material; a cleaning portion that wipes off and cleans a surface of the liquid-repellent film by a wiping member; and a liquid-repellent performance recovery processing portion that performs liquid-repellent performance recovery processing to recover liquid-repellent performance on the surface of the liquid-repellent film by heating the liquid-repellent film.

Abstract translation: 提供了能够长期地在形成在喷嘴表面上的防液膜的表面上稳定地确保防液性能的喷墨记录装置及其维护方法。 喷墨记录装置包括：具有喷嘴表面的喷墨头，喷嘴表面形成用于喷射液体的喷嘴的喷嘴开口，并且用非晶态氟树脂材料形成防液膜; 清洁部，其通过擦拭部件擦拭并清洗所述防液膜的表面; 以及防液性能恢复处理部，其通过加热所述拒水膜，进行拒水性能恢复处理，以恢复拒液膜的表面上的拒水性能。