公开(公告)号：US20230042165A1

公开(公告)日：2023-02-09

申请号：US17857148

申请日：2022-07-04

Applicant: FUJIFILM Corporation

Inventor： Daisuke HAYASHI ,  Keita TAKAHASHI ,  Genya TANAKA ,  Hirotaka KITAGAWA

IPC: C09K19/38

Abstract: Provided are a liquid crystal polymer particle in which a difference in contact angle of the liquid crystal polymer particle with water due to a water droplet in air at 25° C. and 50% RH between inside the particle and a surface of the particle is 7° or greater, a liquid crystal polymer particle in which a difference in atomic ratio of an oxygen atom to a carbon atom measured by X-ray photoelectron spectroscopy between inside a particle and a surface of the particle is 0.02 or greater, a method of producing the liquid crystal polymer particle, and a composite material formed of the liquid crystal polymer particle.

公开(公告)号：US20230392053A1

公开(公告)日：2023-12-07

申请号：US18451815

申请日：2023-08-17

Applicant: FUJIFILM Corporation

Inventor： Genya TANAKA ,  Hirotaka KITAGAWA

IPC: C09J7/35 ,  C09J7/22 ,  C09J5/06 ,  H05K1/03

CPC classification number: C09J7/35 ,  C09J7/22 ,  C09J5/06 ,  H05K1/036 ,  C09J2301/304 ,  C09J2479/08 ,  C09J2400/226 ,  C09J2400/166

Abstract: An object of the present invention is to provide a polymer film with an adhesive layer, capable of forming a laminate in which a metal layer formed of a metal foil that is arranged on and compression-bonded to the adhesive layer is excellent in adhesiveness, and a portion other than the metal layer has a low dielectric loss tangent. Another object of the present invention is to provide a laminate obtained by using the polymer film with an adhesive layer; and a method for producing the laminate. A polymer film with an adhesive layer according to an embodiment of the present invention has a polymer film including a polymer having a standard dielectric loss tangent of 0.005 or less and the adhesive layer arranged on the polymer film, in which in a case where a surface of the polymer film on a side of the adhesive layer is measured by X-ray photoelectron spectroscopy, an atomic ratio of oxygen atoms to carbon atoms is 0.27 or more, the adhesive layer includes a compound having a reactive group, the adhesive layer has a thickness of 1 μm or less, and the adhesive layer has a post-curing elastic modulus of 0.8 GPa or more.

公开(公告)号：US20220394843A1

公开(公告)日：2022-12-08

申请号：US17824872

申请日：2022-05-25

Applicant: FUJIFILM Corporation

Inventor： Genya TANAKA ,  Yasuyuki SASADA

IPC: H05K1/02 ,  H05K3/10

Abstract: A wiring board, comprising: wiring patterns that are buried with the wiring board, in which at least one of thickness regions to a thickness position of 7 μm toward a direction away from the wiring patterns with each of one surface and the other surface of the wiring pattern in a thickness direction as a reference has an elastic modulus at 240° C. equal to or greater than 300 MPa, and a dielectric loss tangent is equal to or less than 0.006.

公开(公告)号：US20220394842A1

公开(公告)日：2022-12-08

申请号：US17824868

申请日：2022-05-25

Applicant: FUJIFILM Corporation

Inventor： Genya TANAKA ,  Yasuyuki SASADA

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/46

Abstract: A wiring board, comprising: wiring patterns that are buried in the wiring board, in which a region positioned between wiring patterns disposed in an in-plane direction of the same plane has an elastic modulus at 140° C. equal to or less than 0.1 MPa, and a dielectric loss tangent is equal to or less than 0.006.