公开(公告)号：US20240018442A1

公开(公告)日：2024-01-18

申请号：US18473501

申请日：2023-09-25

Applicant: FUJIFILM Corporation

Inventor： Naoko OUCHI ,  Tetsuya Kamimura ,  Shimpei Yamada ,  Naotsugu Muro

IPC: C11D1/62 ,  C11D11/00 ,  C11D3/00 ,  C11D3/28 ,  C11D3/30 ,  C11D3/20 ,  H01L21/02

CPC classification number: C11D1/62 ,  C11D11/0047 ,  C11D3/0073 ,  C11D3/28 ,  C11D3/30 ,  C11D3/2082 ,  C11D3/2086 ,  H01L21/02074

Abstract: An object of the present invention is to provide a cleaning liquid for a semiconductor substrate, which is excellent in cleaning performance of organic impurities, and a cleaning method for a semiconductor substrate. The cleaning liquid for a semiconductor substrate according to the present invention is a cleaning liquid for a semiconductor substrate used for cleaning a semiconductor substrate, and includes a compound represented by Formula (A).