公开(公告)号：US20160167192A1

公开(公告)日：2016-06-16

申请号：US14910059

申请日：2014-08-06

申请人： FUJIMI INCORPORATED

发明人： Shingo OTSUKI ,  Hitoshi MORINAGA ,  Kazusei TAMAI ,  Hiroshi ASANO ,  Yuuichi ITOU ,  Souma TAGUCHI

IPC分类号： B24B37/20

CPC分类号： B24B37/20 ,  B24B9/065 ,  B24B37/11

摘要： The present invention relates to a polishing method using a polishing tool provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to efficiently and uniformly polish the curved surface of the object. A polishing tool of the present invention is provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object. The polishing pad preferably has a Shore A hardness of 5 or greater. A polishing method of the present invention uses a polishing tool including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object and polish the curved surface of the object.

摘要翻译： 本发明涉及一种使用抛光工具的抛光工具，该抛光工具设置有抛光垫，该抛光垫包括与待抛光物体的曲面一致的抛光表面，以有效且均匀地抛光物体的曲面。 本发明的抛光工具设置有抛光垫，该抛光垫包括与待抛光物体的曲面一致的抛光表面，以均匀地接触物体的曲面。 抛光垫的肖氏A硬度优选为5以上。 本发明的抛光方法使用包括抛光表面的抛光工具，抛光表面根据被抛光物体的曲面成形，以均匀地接触物体的曲面并抛光物体的曲面。