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    POLISHING DEVICE, PROCESSING METHOD OF POLISHING MEMBER, MODIFICATION METHOD OF POLISHING MEMBER, SHAPE PROCESSING CUTTING TOOL, AND SURFACE MODIFICATION TOOL
    2.
    发明申请
    POLISHING DEVICE, PROCESSING METHOD OF POLISHING MEMBER, MODIFICATION METHOD OF POLISHING MEMBER, SHAPE PROCESSING CUTTING TOOL, AND SURFACE MODIFICATION TOOL 审中-公开
    抛光装置，抛光构件的处理方法，抛光构件的修改方法，形状加工切割工具和表面改性工具

    公开(公告)号：US20160236322A1

    公开(公告)日：2016-08-18

    申请号：US15026096

    申请日：2014-10-02

    申请人： FUJIMI INCORPORATED

    发明人： Hitoshi MORINAGA ,  Hiroshi ASANO ,  Shingo OTSUKI ,  Kazusei TAMAI

    IPC分类号： B24B53/07 ,  B24B19/08

    CPC分类号： B24B53/07 ,  B24B9/065 ,  B24B19/08 ,  B24B53/02

    摘要： A polishing device includes a polishing member, a tool, and a contact mechanism. The polishing member includes a polishing surface that is shaped in conformance with the shape of an end of a workpiece. The tool functions as a shape-processing cutting tool or a surface modifying tool that has the same shape as the shape of the end. The shape-processing cutting tool processes the polishing surface of the polishing member to be shaped in conformance with the shape of the end. The surface modifying tool modifies the polishing surface to be shaped in conformance with the shape of the portion to be polished. The contact mechanism brings the tool into contact with the polishing surface of the polishing member.

    摘要翻译： 抛光装置包括抛光构件，工具和接触机构。 抛光构件包括与工件的端部的形状一致的抛光表面。 该工具用作具有与端部形状相同形状的形状加工切削工具或表面修改工具。 形状加工切削工具将抛光构件的抛光表面按照端部的形状进行成形。 表面改性工具根据待抛光部分的形状改变待成形的抛光表面。 接触机构使工具与抛光部件的抛光表面接触。

    POLISHING TOOL AND PROCESSING METHOD FOR MEMBER
    3.
    发明申请
    POLISHING TOOL AND PROCESSING METHOD FOR MEMBER 审中-公开
    会员的抛光工具和加工方法

    公开(公告)号：US20160167192A1

    公开(公告)日：2016-06-16

    申请号：US14910059

    申请日：2014-08-06

    申请人： FUJIMI INCORPORATED

    发明人： Shingo OTSUKI ,  Hitoshi MORINAGA ,  Kazusei TAMAI ,  Hiroshi ASANO ,  Yuuichi ITOU ,  Souma TAGUCHI

    IPC分类号： B24B37/20

    CPC分类号： B24B37/20 ,  B24B9/065 ,  B24B37/11

    摘要： The present invention relates to a polishing method using a polishing tool provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to efficiently and uniformly polish the curved surface of the object. A polishing tool of the present invention is provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object. The polishing pad preferably has a Shore A hardness of 5 or greater. A polishing method of the present invention uses a polishing tool including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object and polish the curved surface of the object.

    摘要翻译： 本发明涉及一种使用抛光工具的抛光工具，该抛光工具设置有抛光垫，该抛光垫包括与待抛光物体的曲面一致的抛光表面，以有效且均匀地抛光物体的曲面。 本发明的抛光工具设置有抛光垫，该抛光垫包括与待抛光物体的曲面一致的抛光表面，以均匀地接触物体的曲面。 抛光垫的肖氏A硬度优选为5以上。 本发明的抛光方法使用包括抛光表面的抛光工具，抛光表面根据被抛光物体的曲面成形，以均匀地接触物体的曲面并抛光物体的曲面。

    POLISHING COMPOSITION
    5.
    发明申请
    POLISHING COMPOSITION 审中-公开
    抛光组合物

    公开(公告)号：US20150291851A1

    公开(公告)日：2015-10-15

    申请号：US14686285

    申请日：2015-04-14

    申请人： FUJIMI INCORPORATED

    发明人： Hiroshi ASANO ,  Maiko ASAI ,  Hitoshi MORINAGA ,  Kazusei TAMAI

    IPC分类号： C09G1/02 ,  B24B1/00

    CPC分类号： C09G1/02 ,  B24B1/00

    摘要： A polishing composition which is able to decrease a difference in polishing rate between the alloy material and the resin, and to polish both the alloy material and the resin at a high polishing rate when polishing a substrate which contains an alloy material and a resin on the surface and has a ratio of the alloy material area to the total polishing area in a specific range is provided. To provide the polishing composition used to polish a substrate which contains an alloy material and a resin on a surface thereof and has a ratio of an alloy material area to a total polishing area of from 60 to 95%, the polishing composition containing crystalline abrasive grains having a cumulative 50% particle size (D50) based on a volume-based particle size distribution of 5.0 μm or more, an acid or a salt thereof and a water-soluble polymer.

    摘要翻译： 一种抛光组合物，其能够降低合金材料和树脂之间的抛光速度差异，并且在研磨含有合金材料和树脂的基材时，以高抛光速率对合金材料和树脂进行抛光 并且具有在特定范围内的合金材料面积与总抛光面积的比率。 为了提供用于研磨在其表面上含有合金材料和树脂的基材的抛光组合物，并且其合金材料面积与总抛光面积的比例为60-95％，所述抛光组合物含有结晶磨料颗粒 基于体积基于5.0μm以上的粒径分布的累积50％粒径（D50），酸或其盐和水溶性聚合物。

    COMPOSITION FOR POLISHING TITANIUM ALLOY MATERIAL
    9.
    发明申请
    COMPOSITION FOR POLISHING TITANIUM ALLOY MATERIAL 审中-公开

    公开(公告)号：US20170216993A1

    公开(公告)日：2017-08-03

    申请号：US15501530

    申请日：2015-05-01

    申请人： FUJIMI INCORPORATED

    发明人： Maiko ASAI ,  Kazusei TAMAI ,  Hitoshi MORINAGA ,  Hiroshi ASANO

    IPC分类号： B24B37/24 ,  C09G1/02

    CPC分类号： B24B37/24 ,  B24B37/00 ,  B24B37/044 ,  C09G1/02 ,  C09K3/1463

    摘要： Provided is a composition for polishing a titanium alloy material, which enables polishing of a titanium alloy material at a high polishing speed and can provide a polished titanium alloy material having excellent surface smoothness and having a highly glossy surface after polishing.The composition for polishing a titanium alloy material is a composition that is intended for polishing a titanium alloy material and comprises a compound having a function of dissolving at least one metal element other than titanium, which exists at a content of more than 0.5% by mass with respect to the total mass of the titanium alloy material, at a higher degree of solubility than that of titanium; and abrasive grains.