公开(公告)号：US20140111917A1

公开(公告)日：2014-04-24

申请号：US13974512

申请日：2013-08-23

Applicant: FUJITSU LIMITED

Inventor： Hiroyuki TAKITA ,  Yoshifumi KAJIWARA ,  Masahiro FUKUHARA ,  Hiroshi KUBO

IPC: H05K5/06

CPC classification number: H05K5/061

Abstract: An electronic device including: a first case including a first wall portion formed with a first hook portion; a second case including a second wall portion formed with a second hook portion; a gasket that is pressed by a face on an opposite side of the second hook portion to an interlocking face with the first hook portion and a bottom face of a housing groove; and a restriction wall portion that extends towards the second case side along a back face of an opposite side of the second wall portion to the first hook portion side, and that is set with a height such that a position of an upper end of the restriction wall portion is higher than an upper end of the gasket in a free state of the gasket prior to fitting the first hook portion together with the second hook portion.

Abstract translation: 一种电子设备，包括：第一壳体，包括形成有第一钩部的第一壁部; 第二壳体，包括形成有第二钩部的第二壁部; 垫圈，其被第二钩部的相反侧的面压紧到与第一钩部和壳体槽的底面的互锁面; 以及限制壁部，其沿着所述第二壁部的与所述第一钩部侧相反的一侧的背面朝向所述第二壳体侧延伸，并且被设定为使得所述限制部的上端的位置 在将第一钩部与第二钩部配合之前，壁部在垫圈的自由状态下高于垫圈的上端。

公开(公告)号：US20140098509A1

公开(公告)日：2014-04-10

申请号：US14048788

申请日：2013-10-08

Applicant: FUJITSU LIMITED

Inventor： Atsushi TOMOE ,  HIROSHI KUBO ,  Hiroyuki TAKITA

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H04M1/0214 ,  H04M1/0277 ,  H05K3/368 ,  H05K9/0032 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/2018 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y10T29/49126

Abstract: An electronic device includes a first substrate, a second substrate that is disposed to be superposed over the first substrate, a connector that connects the first substrate to the second substrate, an inter-substrate frame that is disposed between the first substrate and the second substrate and includes a wall portion, and a wall member that is disposed on at least one of the first substrate and the second substrate to be opposed to the wall portion and locks the wall portion of the inter-substrate frame in response to displacement that is generated between the first substrate and the second substrate.

Abstract translation: 电子设备包括：第一基板，设置成叠置在第一基板上的第二基板，将第一基板连接到第二基板的连接器;设置在第一基板和第二基板之间的基板间框架 并且包括壁部分和壁构件，所述壁构件设置在所述第一基板和所述第二基板中的至少一个上以与所述壁部相对并且响应于所产生的位移而锁定所述基板间框架的壁部分 在第一基板和第二基板之间。

公开(公告)号：US20140118906A1

公开(公告)日：2014-05-01

申请号：US13974598

申请日：2013-08-23

Applicant: FUJITSU LIMITED

Inventor： Manabu HONGO ,  Yoshifumi KAJIWARA ,  Hiroyuki TAKITA ,  Hiroshi KUBO ,  Satoshi WATANABE ,  Shingo YAMAGUCHI ,  Satoshi KANBAYASHI ,  Yasuhiro ITE

IPC: H05K5/00 ,  H05K5/02

CPC classification number: H05K5/0004 ,  G06F1/1626 ,  G06F1/1656 ,  H05K5/0208 ,  Y10T29/49826

Abstract: An electronic device including: a protrusion portion that projects towards a bottom face of a groove from the opposite side face of a second hook portion, that is inserted into the groove, and that makes close contact with a sealing material; and a cut-away portion that is formed to a side wall portion positioned further to the casing inside out of a pair of side wall portions forming the groove, the cut-away portion being formed at a position corresponding to a first hook portion.

Abstract translation: 一种电子设备，包括：突出部，其从第二钩部的相对侧面突出到槽的底面，所述突出部插入到所述槽中，并且与密封材料紧密接触; 以及形成在形成所述槽的一对侧壁部的外侧更靠外壳体的侧壁部的切除部，所述切除部形成在与第一钩部对应的位置。