公开(公告)号：US20240292521A1

公开(公告)日：2024-08-29

申请号：US18115558

申请日：2023-02-28

Applicant: Hyve Solutions Corporation

Inventor： Jayarama Narayan Shenoy ,  Chiaming Liu ,  Chihwei Lee ,  Zhaohong Chen

IPC: H05K1/02 ,  H05K7/14

CPC classification number: H05K1/0271 ,  H05K7/142 ,  H05K2201/2045

Abstract: A rack server can include a rack server chassis, a backplane printed circuit board (PCB) affixed to the rack server chassis, the backplane PCB comprising a plurality of cantilevered beams, each cantilevered beam of the plurality of cantilevered beams comprising a receiver slot to receive a server element, and a plurality of vibration dampeners secured to the rack server chassis, each vibration dampener residing directly beneath and in physical contact with a corresponding one cantilevered beam of the plurality of cantilevered beams. Each receiver slot can receive a hard disk drive, and the vibration dampener can support the weight of the hard disk drive to protect the cantilevered beam and dampen vibrations that occur during operation of the hard disk drive.

公开(公告)号：US20230217585A1

公开(公告)日：2023-07-06

申请号：US17565259

申请日：2021-12-29

Applicant: Microsoft Technology Licensing, LLC

Inventor： Donghwi KIM ,  Jaejin LEE

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K2201/2045

Abstract: A device for reducing acoustic vibration in an electronic device includes a noninvasive fastener configured to fix a printed circuit board (PCB) to a mechanical ground, and the noninvasive fastener provides vibrational dampening in both compression and tension.

公开(公告)号：US09947466B2

公开(公告)日：2018-04-17

申请号：US14663725

申请日：2015-03-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo Hattori ,  Isamu Fujimoto ,  Hirobumi Adachi

IPC: H05K1/03 ,  H01G2/06 ,  H01G4/30 ,  H01G4/232 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/613

Abstract: An electronic component includes an electronic element including outer electrodes on a surface, a substrate terminal on which the electronic element is mounted, and a conductor that covers at least a portion of the substrate terminal. The substrate terminal includes a first main surface, a second main surface at a side opposite to the first main surface, and a side surface connecting the first main surface and the second main surface. The substrate terminal includes a mounting electrode that is provided on the first main surface and is electrically connected to the outer electrodes of the electronic element. The mounting electrode includes adjacent portions that are located to be adjacent to the side surface of the substrate terminal. The conductor covers at least a portion of the adjacent portion.

公开(公告)号：US09743539B2

公开(公告)日：2017-08-22

申请号：US15100852

申请日：2014-11-17

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Ryouichi Kajiwara ,  Masaru Kamoshida ,  Toshiaki Ishii

IPC: H05K5/00 ,  B23K35/22 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34 ,  B23K35/26 ,  B23K35/02 ,  B23K1/00 ,  B23K1/08

CPC classification number: H05K5/0069 ,  B23K1/0016 ,  B23K1/08 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/226 ,  B23K35/26 ,  B23K35/262 ,  H05K1/117 ,  H05K3/282 ,  H05K3/3405 ,  H05K3/3463 ,  H05K5/003 ,  H05K5/0034 ,  H05K2201/015 ,  H05K2201/10189 ,  H05K2201/2045 ,  H05K2203/122

Abstract: There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.

公开(公告)号：US09711288B2

公开(公告)日：2017-07-18

申请号：US14258711

申请日：2014-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Cheol Park ,  Sang Soo Park

IPC: H01G4/40 ,  H01F27/28 ,  H05K1/18 ,  H01G2/06 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01G4/40 ,  H01F17/0013 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G2/06 ,  H05K1/0233 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A composite electronic component may include: a composite body including a combination of a capacitor formed of a ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face one another with the dielectric layers interposed therebetween, and an inductor formed of a magnetic body including a coil unit; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrodes and a second external electrode formed on the second lateral surface of the ceramic body and electrically connected to the second internal electrodes; third and fourth external electrodes formed on first and second end surfaces of the magnetic body and connected to the coil unit, and first and second dummy electrodes formed on first and second end surfaces of the magnetic body.

公开(公告)号：US09697953B2

公开(公告)日：2017-07-04

申请号：US14667575

申请日：2015-03-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Seok Kyoon Woo ,  Kyoung Jin Jun ,  So Yeon Song ,  Soon Ju Lee

IPC: H01G2/20 ,  H01G4/06 ,  H01G4/228 ,  H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/224 ,  H01G4/012 ,  H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor (MLCC) including first and second external electrodes disposed to be spaced apart from one another on a mounting surface thereof; and first and second terminal electrodes including upper horizontal portions disposed on lower surfaces of the first and second external electrodes, lower horizontal portions disposed to be spaced apart from the upper horizontal portions downwardly, and curved vertical portions connecting one ends of the upper horizontal portions and one ends of the lower horizontal portions, having “⊂” and “⊃” shapes, and disposed on the mounting surface of the MLCC in a facing manner.

公开(公告)号：US09596756B2

公开(公告)日：2017-03-14

申请号：US14020059

申请日：2013-09-06

Applicant: Apple Inc.

Inventor： Amanda R. Rainer ,  Connor R. Duke ,  James W. Bilanski ,  Jeffrey M. Thoma ,  Michael Eng ,  Mingzhe Li ,  Sung Woo Yoo ,  Miguel Alejandro Lara-Pena ,  Weng Choy Foo ,  Kieran Poulain

IPC: H05K1/03 ,  H01L21/56 ,  H05K3/28 ,  H01L25/065 ,  H05K1/18

CPC classification number: H05K1/0393 ,  H01L21/563 ,  H01L25/0655 ,  H01L2224/73204 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10015 ,  H05K2201/10977 ,  H05K2201/2045 ,  H05K2203/0126 ,  H05K2203/304

Abstract: An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.

Abstract translation: 电子设备可以设置有集成电路和电气部件，例如电焊接到印刷电路板的电容器。 诸如密封剂和底部填充材料的液体聚合物粘合剂可以沉积在印刷电路上。 诸如电容器的电气部件可以用密封剂涂覆。 底部填充物可以沉积在集成电路附近，使得底部填充物吸入集成电路和印刷电路板之间的间隙中。 密封剂可能比底部填充剂更粘稠，因此可以防止流动的底部填充物到达电气部件。 一些密封剂可以位于电气部件和印刷电路板之间。 密封剂可以被固化以形成覆盖电气部件的弹性材料，其有助于阻止振动。 弹性材料的硬度可能低于底部填充物。

公开(公告)号：US20170064811A1

公开(公告)日：2017-03-02

申请号：US14841387

申请日：2015-08-31

Applicant: Apple Inc.

Inventor： Gemin Li ,  Paul Martinez ,  Benjamin A. Bard ,  Connor R. Duke ,  Zhong-Qing Gong ,  Kevin R. Richardson ,  Curtis C. Mead ,  Kieran Poulain ,  Sung Woo Yoo ,  Nelson J. Kottke

IPC: H05K1/02 ,  H05K1/11 ,  H01G4/30 ,  H05K3/40 ,  H01G4/224 ,  H05K1/18 ,  H05K3/30

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/224 ,  H05K1/141 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/2045 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

Abstract translation: 公开了一种印刷电路板（PCB）组件，其具有安装在PCB上的几个电子部件和覆盖电子部件的阻尼层。 PCB组件的实施例包括将阻尼层限制在PCB上的包覆模制层。 PCB组件的实施例包括在电子部件的电容器和PCB之间的插入器。 还描述和要求保护其他实施例。

公开(公告)号：US09520239B2

公开(公告)日：2016-12-13

申请号：US14671714

申请日：2015-03-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Soo Park ,  Soon Ju Lee ,  Young Ghyu Ahn ,  Heung Kil Park

IPC: H05K1/16 ,  H01G4/30 ,  H01C1/14 ,  H01C1/148 ,  H01C7/18 ,  H01G2/06 ,  H01G4/232 ,  H05K3/34 ,  H01G4/12 ,  H01C7/00 ,  H01C7/10 ,  H05K1/14

CPC classification number: H01G4/30 ,  H01C1/14 ,  H01C1/148 ,  H01C7/008 ,  H01C7/10 ,  H01C7/18 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/2045 ,  Y02P70/613

Abstract: There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.

Abstract translation: 提供一种芯片电子部件可以包括：陶瓷体; 形成在陶瓷体的两侧部的外部电极; 以及支撑陶瓷体并与外部电极电连接的插入件，其中插入件包括形成在其两侧部分上的第一和第二端子电极以及在第一和第二端子电极内部形成的凹部。

公开(公告)号：US09384893B2

公开(公告)日：2016-07-05

申请号：US14086091

申请日：2013-11-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Ho Lee ,  Doo Young Kim ,  Myung Jun Park ,  Jae Yeol Choi ,  Young Ghyu Ahn ,  Sang Huk Kim

IPC: H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H01G4/232 ,  H05K3/34 ,  H05K1/18

CPC classification number: H01G4/12 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2045 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic capacitor includes: a ceramic body; an active layer disposed in the ceramic body and including first internal electrodes each having a first lead part exposed to at least one of the first and second side surfaces, and second internal electrodes each having a second lead part exposed to the at least one of the first and second side surfaces, thereby forming capacitance; an upper cover layer formed on an upper portion of the active layer in the thickness direction; a lower cover layer formed on a lower portion of the active layer in the thickness direction and having a thickness greater than that of the upper cover layer; a first external; and a second external electrode.

Abstract translation: 一种多层陶瓷电容器包括：陶瓷体; 有源层，其设置在所述陶瓷体中，并且包括第一内部电极，每个所述第一内部电极具有暴露于所述第一和第二侧表面中的至少一个的第一引线部分，以及第二内部电极，每个所述第二内部电极具有暴露于所述至少一个 第一和第二侧表面，从而形成电容; 形成在所述有源层的厚度方向的上部的上覆盖层; 下覆盖层，形成在所述有源层的厚度方向的下部上，其厚度大于所述上覆盖层的厚度; 第一个外部的 和第二外部电极。