公开(公告)号：US10736220B2

公开(公告)日：2020-08-04

申请号：US16702612

申请日：2019-12-04

申请人： FUJITSU LIMITED

发明人： Kazuaki Takao ,  Akira Tamura ,  Takashi Fukuda

IPC分类号： H05K1/00 ,  H05K3/32 ,  H05K7/20 ,  H01L23/02 ,  H01L23/10 ,  H01L23/40 ,  H01L23/055 ,  H01L23/498 ,  H01R12/00 ,  H05K1/18

摘要： A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.

公开(公告)号：US20150351244A1

公开(公告)日：2015-12-03

申请号：US14700320

申请日：2015-04-30

申请人： FUJITSU LIMITED

发明人： Keiichi Yamamoto ,  Takashi Fukuda

IPC分类号： H05K1/18

CPC分类号： H05K3/321 ,  H05K3/28 ,  H05K2201/0989 ,  H05K2201/10628

摘要： A printed board unit includes: a base material; an electrode formed on the base material; a resist film formed on the base material, the resist film has an opening to expose the electrode; a recess part formed on an inner wall of the resist film; an electronic component including a lead terminal electrically coupled to the electrode; and a bonding material which bonds the lead terminal to the electrode in the opening, a portion of the bonding material being mounted on the lead terminal at an inner side of the opening opposite to the recess part.

摘要翻译： 印刷电路板单元包括：基材; 形成在基材上的电极; 形成在基材上的抗蚀剂膜，抗蚀剂膜具有露出电极的开口; 形成在抗蚀膜的内壁上的凹部; 电子部件，包括电连接到所述电极的引线端子; 以及接合材料，其将引线端子与开口中的电极接合，接合材料的一部分在与凹部相对的开口的内侧安装在引线端子上。

公开(公告)号：US10531572B2

公开(公告)日：2020-01-07

申请号：US16263018

申请日：2019-01-31

申请人： FUJITSU LIMITED

发明人： Kazuaki Takao ,  Akira Tamura ,  Takashi Fukuda

IPC分类号： H05K1/00 ,  H05K3/32 ,  H01L23/02 ,  H01L23/10 ,  H01L23/40 ,  H01L23/055 ,  H01L23/498 ,  H01R12/00 ,  H05K1/18

摘要： A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.

公开(公告)号：US10445460B2

公开(公告)日：2019-10-15

申请号：US15817695

申请日：2017-11-20

申请人： FUJITSU LIMITED

发明人： Kumiko Teramae ,  Hikoyuki Kawata ,  Takashi Fukuda ,  Megumi Tanaka

IPC分类号： G06F17/50 ,  H05K3/00 ,  H05K1/02 ,  H05K1/11

摘要： A via model generation method includes: acquiring via arrangement information including a hole diameter of a via formed in a board including a plurality of wiring layers, a clearance distance between a ground conductor formed in one wiring layer of the plurality of wiring layers and the via, and a ground via distance between the via and a ground via coupled to the ground conductor; acquiring board information including a relative dielectric constant of the board; calculating a capacitance component of the via by a first electromagnetic field analysis using the hole diameter of the via, the clearance distance, and the relative dielectric constant of the board; calculating an inductance component of the via by a second electromagnetic field analysis using the hole diameter of the via, the ground via distance, and the relative dielectric constant of the board; and generating a via model including the capacitance and inductance components.

公开(公告)号：US20190269019A1

公开(公告)日：2019-08-29

申请号：US16263018

申请日：2019-01-31

申请人： FUJITSU LIMITED

发明人： KAZUAKI TAKAO ,  Akira Tamura ,  Takashi Fukuda

IPC分类号： H05K3/32 ,  H01L23/498 ,  H05K1/18

摘要： A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.

公开(公告)号：US20130321098A1

公开(公告)日：2013-12-05

申请号：US13834555

申请日：2013-03-15

申请人： FUJITSU LIMITED

发明人： Takashi Fukuda ,  Masaki Tosaka

IPC分类号： H03H7/38

CPC分类号： H01P1/26 ,  H04L25/0278

摘要： A semiconductor device includes: a terminal configured to input a signal from a signal source; a receiver configured to receive the signal from the signal source through the terminal; and a terminal circuit configured to be coupled between the terminal and an input end of the receiver, and to suppress reflected wave caused by signal reflection at the receiver, wherein impedance of a wire line connecting the terminal and the input end of the receiver, and direct-current impedance of a resistance component included in the terminal circuit are set lower than impedance of an external wire line connected to the terminal.

摘要翻译： 半导体器件包括：被配置为从信号源输入信号的终端; 接收器，被配置为通过所述终端从所述信号源接收所述信号; 以及端子电路，其被配置为耦合在所述接收器的所述端子和所述接收器的输入端之间，并且抑制由所述接收器处的信号反射引起的反射波，其中连接所述端子和所述接收器的输入端的有线线路的阻抗以及 包括在端子电路中的电阻分量的直流阻抗被设定为低于连接到端子的外部有线线路的阻抗。

公开(公告)号：US20200107454A1

公开(公告)日：2020-04-02

申请号：US16702612

申请日：2019-12-04

申请人： FUJITSU LIMITED

发明人： KAZUAKI TAKAO ,  Akira Tamura ,  Takashi Fukuda

IPC分类号： H05K3/32 ,  H05K1/18 ,  H01L23/498

摘要： A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.

公开(公告)号：US09160048B2

公开(公告)日：2015-10-13

申请号：US13834555

申请日：2013-03-15

申请人： FUJITSU LIMITED

发明人： Takashi Fukuda ,  Masaki Tosaka

IPC分类号： H01P5/12 ,  H01P1/26 ,  H04L25/02

CPC分类号： H01P1/26 ,  H04L25/0278

摘要： A semiconductor device includes: a terminal configured to input a signal from a signal source; a receiver configured to receive the signal from the signal source through the terminal; and a terminal circuit configured to be coupled between the terminal and an input end of the receiver, and to suppress reflected wave caused by signal reflection at the receiver, wherein impedance of a wire line connecting the terminal and the input end of the receiver, and direct-current impedance of a resistance component included in the terminal circuit are set lower than impedance of an external wire line connected to the terminal.

摘要翻译： 半导体器件包括：被配置为从信号源输入信号的终端; 接收器，被配置为通过所述终端从所述信号源接收所述信号; 以及端子电路，其被配置为耦合在所述接收器的所述端子和所述接收器的输入端之间，并且抑制由所述接收器处的信号反射引起的反射波，其中连接所述端子和所述接收器的输入端的有线线路的阻抗，以及 包括在端子电路中的电阻分量的直流阻抗被设定为低于连接到端子的外部有线线路的阻抗。

公开(公告)号：US20150351288A1

公开(公告)日：2015-12-03

申请号：US14632153

申请日：2015-02-26

申请人： FUJITSU LIMITED

发明人： Takashi Fukuda

IPC分类号： H05K7/20 ,  B01D46/00

CPC分类号： B01D46/0065 ,  B01D46/0075 ,  B01D2279/45 ,  H05K7/20181 ,  H05K7/20727

摘要： An electronic apparatus includes a housing including an opening, an object to be cooled that is disposed in the housing, an air flow generation unit that generates cooling air which flows through the opening into the housing and flows to the object to be cooled, a plurality of filter units that remove a foreign matter contained in the cooling air, a blocking unit that blocks at least one filter unit to be cleaned, among the filter units, a controller that increases a flow rate of the cooling air using the air flow generation unit, and a cleaning processing unit that cleans the filter unit to be cleaned, the filter unit to be cleaned being blocked by the blocking unit.

摘要翻译： 一种电子设备，包括：壳体，包括设置在壳体中的待冷却物体的开口;空气流产生单元，其产生流过壳体并流向待冷却物体的开口的冷却空气;多个 的过滤器单元，其中所述过滤器单元除去所述冷却空气中包含的异物，阻塞单元，其阻挡在所述过滤单元中的至少一个待清洁的过滤单元;控制器，其使用所述空气流产生单元增加所述冷却空气的流量 以及清洁处理单元，其清洁待清洁的过滤器单元，待清洁的过滤器单元被阻挡单元阻挡。

公开(公告)号：US09155220B2

公开(公告)日：2015-10-06

申请号：US14171003

申请日：2014-02-03

申请人： FUJITSU LIMITED

发明人： Takanaga Yokosawa ,  Takashi Watanabe ,  Yasuhiro Muramatsu ,  Takashi Fukuda

IPC分类号： A47F7/00 ,  H05K7/18 ,  H05K7/14

CPC分类号： H05K7/183 ,  H05K7/1489

摘要： A coupling member is coupled to a support column of a rack. A plate-shaped member is rotatably engaged with a coupling member with one longitudinal end as an axis. An L-shaped member includes a first flat plate and a second flat plate orthogonal to the first flat plate and includes, with a transverse end of the first flat plate rotatably engaged with one plate face of the plate-shaped member with the longitudinal direction of the plate-shaped member as an axis and with a plate face of the first flat plate in intimate contact with the one plate face, a mounting member in which the second flat plate protrudes from one transverse end of the plate-shaped member and a fixing mechanism that fixes the mounting member with the plate face of the first flat plate in intimate contact with the one plate face of the plate-shaped member.

摘要翻译： 联接构件联接到机架的支撑柱。 板状构件与一个纵向端部作为轴线的联接构件可旋转地接合。 L形构件包括第一平板和与第一平板正交的第二平板，并且包括第一平板的横向端部与板状构件的一个板面可旋转地接合， 所述板状构件为轴线，并且所述第一平板的板面与所述一个板面紧密接触;安装构件，所述第二平板从所述板状构件的一个横向端部突出，并且固定 将安装构件与第一平板的板面固定在一起的机构与板状构件的一个板面紧密接触。