公开(公告)号：US20200107454A1

公开(公告)日：2020-04-02

申请号：US16702612

申请日：2019-12-04

申请人： FUJITSU LIMITED

发明人： KAZUAKI TAKAO ,  Akira Tamura ,  Takashi Fukuda

IPC分类号： H05K3/32 ,  H05K1/18 ,  H01L23/498

摘要： A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.

公开(公告)号：US09124039B2

公开(公告)日：2015-09-01

申请号：US14283851

申请日：2014-05-21

申请人： FUJITSU LIMITED

发明人： Yasushi Masuda ,  Akira Tamura ,  Satoshi Ohsawa

IPC分类号： H01R13/6586 ,  H01R13/6587 ,  H01R12/57 ,  H01R12/58

CPC分类号： H01R13/6587 ,  H01R12/57 ,  H01R12/585

摘要： A connector includes: a casing; a pair of signal terminals that have respective tip end portions, the pair of signal terminals projecting from the casing, the tip end portions being perpendicularly bent; a ground terminal arranged such that the ground terminal and the pair of signal terminals are arranged in a row, the ground terminal projecting at a position adjacent to the pair of signal terminals; and a shield disposed between the casing and the tip end portions of the pair of signal terminals.

摘要翻译： 连接器包括：壳体; 一对信号端子，其具有相应的末端部分，所述一对信号端子从壳体突出，前端部分垂直弯曲; 接地端子布置成使得接地端子和一对信号端子排成一列，接地端子在与该对信号端子相邻的位置处突出; 以及设置在所述壳体与所述一对信号端子的前端部之间的护罩。

公开(公告)号：US20160294129A1

公开(公告)日：2016-10-06

申请号：US15068680

申请日：2016-03-14

申请人： FUJITSU LIMITED

发明人： Yoko Murata ,  Akira Tamura

IPC分类号： H01R24/44 ,  H01R24/50 ,  H01R12/71

CPC分类号： H01R24/44 ,  H01R13/2428 ,  H01R13/622 ,  H01R13/6315 ,  H01R24/50

摘要： A disclosed coaxial connector includes: an external conductor having a cylindrical shape to be screwed together with a counterpart connector including a circular opening end, the external conductor having a contact surface provided on inner periphery of the external conductor, with which the opening end comes into contact, and also having a slit formed to allow the external conductor to stretch and shrink in a longitudinal direction of the external conductor; and a center conductor provided coaxial with the external conductor, the center conductor having a length long enough to reach a substrate on which the counterpart connector is provided upright.

摘要翻译： 所公开的同轴连接器包括：外部导体，其具有与包括圆形开口端的配对连接器螺纹连接的圆柱形状，外部导体具有设置在外部导体的内周上的接触表面，开口端与开口端 并且还具有形成为允许外部导体沿着外部导体的纵向拉伸和收缩的狭缝; 以及与外部导体同轴设置的中心导体，所述中心导体的长度足够长以到达垂直设置有对应连接器的基板。

公开(公告)号：US20150359122A1

公开(公告)日：2015-12-10

申请号：US14684470

申请日：2015-04-13

申请人： FUJITSU LIMITED

发明人： Yasushi Masuda ,  Akira Tamura ,  YOSHIHIRO MORITA ,  Satoshi Ohsawa

IPC分类号： H05K7/10 ,  H01R13/6581 ,  H05K1/02 ,  H01R12/71

CPC分类号： H05K1/0216 ,  H01R9/096 ,  H01R12/52 ,  H01R12/7076 ,  H01R12/7082 ,  H01R13/2435 ,  H01R13/6588 ,  H05K7/1069

摘要： A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.

摘要翻译： 所公开的用于半导体部件的插座包括具有第一主表面和第二主表面的板状绝缘体，其中形成在绝缘体中的通孔，插入在通孔中的端子，该端子被配置为 连接到所述半导体部件的信号电极，并且具有被配置为连接到印刷电路板的信号电极的另一端以及掩埋在所述绝缘体中以从所述端子的侧面包围所述端子的屏蔽，所述屏蔽包括第一接触 从所述第一主表面突出并且被配置为连接到所述半导体部件的接地电极，以及从所述第二主表面突出并被配置为连接到所述印刷电路板的接地电极的第二接触。

公开(公告)号：US10531572B2

公开(公告)日：2020-01-07

申请号：US16263018

申请日：2019-01-31

申请人： FUJITSU LIMITED

发明人： Kazuaki Takao ,  Akira Tamura ,  Takashi Fukuda

IPC分类号： H05K1/00 ,  H05K3/32 ,  H01L23/02 ,  H01L23/10 ,  H01L23/40 ,  H01L23/055 ,  H01L23/498 ,  H01R12/00 ,  H05K1/18

摘要： A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.

公开(公告)号：US20190269019A1

公开(公告)日：2019-08-29

申请号：US16263018

申请日：2019-01-31

申请人： FUJITSU LIMITED

发明人： KAZUAKI TAKAO ,  Akira Tamura ,  Takashi Fukuda

IPC分类号： H05K3/32 ,  H01L23/498 ,  H05K1/18

摘要： A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.

公开(公告)号：US09474147B2

公开(公告)日：2016-10-18

申请号：US14684470

申请日：2015-04-13

申请人： FUJITSU LIMITED

发明人： Yasushi Masuda ,  Akira Tamura ,  Yoshihiro Morita ,  Satoshi Ohsawa

IPC分类号： H01R12/00 ,  H05K1/02 ,  H01R12/70 ,  H01R13/6588 ,  H05K7/10 ,  H01R12/52 ,  H01R13/24

CPC分类号： H05K1/0216 ,  H01R9/096 ,  H01R12/52 ,  H01R12/7076 ,  H01R12/7082 ,  H01R13/2435 ,  H01R13/6588 ,  H05K7/1069

摘要： A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.

摘要翻译： 所公开的用于半导体部件的插座包括具有第一主表面和第二主表面的板状绝缘体，其中形成在绝缘体中的通孔，插入在通孔中的端子，该端子被配置为 连接到所述半导体部件的信号电极，并且具有被配置为连接到印刷电路板的信号电极的另一端以及掩埋在所述绝缘体中以从所述端子的侧面包围所述端子的屏蔽，所述屏蔽包括第一接触 从所述第一主表面突出并且被配置为连接到所述半导体部件的接地电极，以及从所述第二主表面突出并被配置为连接到所述印刷电路板的接地电极的第二接触。

公开(公告)号：US20140154925A1

公开(公告)日：2014-06-05

申请号：US14088902

申请日：2013-11-25

申请人： FUJITSU LIMITED

发明人： Yasushi Masuda ,  Akira Tamura ,  Yoshihiro Morita ,  Satoshi Ohsawa

IPC分类号： H01R12/16

CPC分类号： H01R12/714 ,  H05K7/1069

摘要： A socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive.

摘要翻译： 插座包括多个联接构件，每个联接构件包括第一端部部分和第二端部部分，所述联接构件由导电材料制成，其中电子部件的端子和电路板的端子与第一端部电连接 端部和第二端部，从而电连接电子部件的端子和板的端子;保持部件，其以多个联接部件不在的方式保持多个联接部件 彼此接触，所述保持构件形成电绝缘材料;以及片状构件，其与所述电子部件和所述基板接触，所述片材在所述多个联接构件之间的部分中，所述片构件由材料制成， 电绝缘和热扩散。

公开(公告)号：US10736220B2

公开(公告)日：2020-08-04

申请号：US16702612

申请日：2019-12-04

申请人： FUJITSU LIMITED

发明人： Kazuaki Takao ,  Akira Tamura ,  Takashi Fukuda

IPC分类号： H05K1/00 ,  H05K3/32 ,  H05K7/20 ,  H01L23/02 ,  H01L23/10 ,  H01L23/40 ,  H01L23/055 ,  H01L23/498 ,  H01R12/00 ,  H05K1/18

摘要： A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.

公开(公告)号：US09716353B2

公开(公告)日：2017-07-25

申请号：US15068680

申请日：2016-03-14

申请人： FUJITSU LIMITED

发明人： Yoko Murata ,  Akira Tamura

IPC分类号： H01R24/44 ,  H01R13/24 ,  H01R13/622 ,  H01R13/631 ,  H01R24/50

CPC分类号： H01R24/44 ,  H01R13/2428 ,  H01R13/622 ,  H01R13/6315 ,  H01R24/50

摘要： A disclosed coaxial connector includes: an external conductor having a cylindrical shape to be screwed together with a counterpart connector including a circular opening end, the external conductor having a contact surface provided on inner periphery of the external conductor, with which the opening end comes into contact, and also having a slit formed to allow the external conductor to stretch and shrink in a longitudinal direction of the external conductor; and a center conductor provided coaxial with the external conductor, the center conductor having a length long enough to reach a substrate on which the counterpart connector is provided upright.