公开(公告)号：US20240279517A1

公开(公告)日：2024-08-22

申请号：US18635166

申请日：2024-04-15

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Kenji TOKUHISA

IPC: C09J163/08 ,  C08G59/02 ,  C08G59/50 ,  C08G65/38 ,  C08G83/00 ,  C08K3/36 ,  H01L23/29

CPC classification number: C09J163/08 ,  C08G59/027 ,  C08G59/5073 ,  C08G65/38 ,  C08G83/007 ,  C08K3/36 ,  H01L23/295 ,  C09J2203/326

Abstract: An adhesive composition containing: an epoxy resin (A) having a fused ring structure; an epoxy resin curing agent (B); a polyrotaxane compound (C); and a polymer component (D), wherein the polyrotaxane compound (C) is contained in a content of 5 to 15 parts by mass based on total 100 parts by mass of contents of the epoxy resin (A) and the polymer component (D); a film adhesive using the adhesive composition; and a semiconductor package and a producing method thereof.

公开(公告)号：US20230295470A1

公开(公告)日：2023-09-21

申请号：US18203389

申请日：2023-05-30

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Koyuki SAKAI ,  Kenji TOKUHISA

IPC: C09J7/29 ,  C09J7/25

CPC classification number: C09J7/29 ,  C09J7/25

Abstract: A base material/adhesive layer integrated sheet for a flexible device, containing a flexible film and an adhesive layer, in which the flexible film and the adhesive layer are laminated, an absolute value of a difference between surface free energy of the flexible film and surface free energy of a cured layer obtained by curing the adhesive layer is 30 dyn/cm or less, and the cured layer has a storage modulus of 5.0 GPa or less; and



a method of producing a flexible device with the same.