公开(公告)号：US09735112B2

公开(公告)日：2017-08-15

申请号：US14593642

申请日：2015-01-09

申请人： Fairchild Semiconductor Corporation

发明人： John Constantino ,  Timwah Luk ,  Ahmad Ashrafzadeh ,  Robert L. Krause ,  Etan Shacham ,  Maria Clemens Ypil Quinones ,  Janusz Bryzek ,  Chung-Lin Wu

IPC分类号： H01L23/538 ,  H01L27/06 ,  H01L49/02 ,  H01L23/495 ,  H01L23/66

CPC分类号： H01L23/538 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/66 ,  H01L27/06 ,  H01L28/40 ,  H01L2224/0603 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In some general aspects, an apparatus may include a first semiconductor die, a second semiconductor die, and a capacitive isolation circuit being coupled to the first semiconductor die and the second semiconductor die. The capacitive isolation circuit may be disposed outside of the first semiconductor die and the second semiconductor die. The first semiconductor die, the second semiconductor die, and the capacitive circuit may be included in a molding of a semiconductor package.

公开(公告)号：US10446498B2

公开(公告)日：2019-10-15

申请号：US15676360

申请日：2017-08-14

申请人： FAIRCHILD SEMICONDUCTOR CORPORATION

发明人： John Constantino ,  Timwah Luk ,  Ahmad Ashrafzadeh ,  Robert L. Krause ,  Etan Shacham ,  Maria Clemens Ypil Quinones ,  Janusz Bryzek ,  Chung-Lin Wu

IPC分类号： H01L23/538 ,  H01L27/06 ,  H01L49/02 ,  H01L23/495 ,  H01L23/66

摘要： In some general aspects, an apparatus may include a first semiconductor die, a second semiconductor die, and a capacitive isolation circuit being coupled to the first semiconductor die and the second semiconductor die. The capacitive isolation circuit may be disposed outside of the first semiconductor die and the second semiconductor die. The first semiconductor die, the second semiconductor die, and the capacitive circuit may be included in a molding of a semiconductor package.