公开(公告)号：US20170288202A1

公开(公告)日：2017-10-05

申请号：US15085819

申请日：2016-03-30

Applicant: Faraday&Future Inc.

Inventor： David Tarlau ,  Alan Lowell Barry

IPC: H01M2/26 ,  B23K26/362 ,  B23K26/21 ,  H05K3/00 ,  H05K3/40

CPC classification number: H01M2/266 ,  B23K26/21 ,  B23K26/362 ,  H01M2/206 ,  H01M10/0525 ,  H05K3/0026 ,  H05K3/005 ,  H05K3/328 ,  H05K3/40 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/10037 ,  H05K2203/107

Abstract: A method of making a printed wiring board (“PWB”) is disclosed. The PWB may be made by forming openings in a substrate. The substrate may be a dielectric substrate. The dielectric substrate may be at least partially uncured. A conductive sheet may be placed on one or both sides of the substrate to cover the openings. The substrate may be cured. The conductive sheet(s) may then be etched to form conductive tabs within the openings. The conductive tabs are free of dielectric material on both sides of the conductive tab. The conductive tabs may then be coupled to terminals of electrochemical cells to form a circuit as desired.