公开(公告)号：US20210109297A1

公开(公告)日：2021-04-15

申请号：US16600256

申请日：2019-10-11

Applicant: Finisar Corporation

Inventor： Peng Chen ,  Chong Heng ,  Huaping Peng ,  Shamei Shi ,  William H. Wang ,  Feng Xu ,  Ranran Zhang ,  Naizhi Zhao ,  Long Van Nguyen

IPC: G02B6/38 ,  G02B6/42

Abstract: An example method of assembling an optoelectronic assembly may include aligning a receptacle with a sleeve that may have a radial flange and with a ferrule that may have a light propagation axis. The method may include axially displacing one or more of the receptacle, the sleeve, and the ferrule such that the receptacle may be positioned at least partially within the sleeve and may at least partially surround the ferrule. The method may include aligning a fiber stub that may have a fiber stub pigtail and a fiber stub flange with the receptacle. The method may include axially displacing one or both of the fiber stub and the receptacle such that the fiber stub may be positioned in close proximity with the ferrule. The method may include coupling the sleeve via the radial flange and the fiber stub via the fiber stub flange with a retention device.

公开(公告)号：US10784602B2

公开(公告)日：2020-09-22

申请号：US16286405

申请日：2019-02-26

Applicant: FINISAR CORPORATION

Inventor： Jia Lian ,  Huaping Peng ,  Shamei Shi ,  William H Wang ,  Frank Flens ,  Henricus Jozef Vergeest

IPC: H01R12/70 ,  H01R12/71 ,  H05K3/34 ,  H01L23/492 ,  H05K1/18

Abstract: A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.

公开(公告)号：US11105984B2

公开(公告)日：2021-08-31

申请号：US16600256

申请日：2019-10-11

Applicant: Finisar Corporation

Inventor： Peng Chen ,  Chong Heng ,  Huaping Peng ,  Shamei Shi ,  William H. Wang ,  Feng Xu ,  Ranran Zhang ,  Naizhi Zhao ,  Long Van Nguyen

IPC: G02B6/38 ,  G02B6/42

Abstract: An example method of assembling an optoelectronic assembly may include aligning a receptacle with a sleeve that may have a radial flange and with a ferrule that may have a light propagation axis. The method may include axially displacing one or more of the receptacle, the sleeve, and the ferrule such that the receptacle may be positioned at least partially within the sleeve and may at least partially surround the ferrule. The method may include aligning a fiber stub that may have a fiber stub pigtail and a fiber stub flange with the receptacle. The method may include axially displacing one or both of the fiber stub and the receptacle such that the fiber stub may be positioned in close proximity with the ferrule. The method may include coupling the sleeve via the radial flange and the fiber stub via the fiber stub flange with a retention device.

公开(公告)号：US20190067849A1

公开(公告)日：2019-02-28

申请号：US15688402

申请日：2017-08-28

Applicant: Finisar Corporation

Inventor： Jia Lian ,  Huaping Peng ,  Shamei Shi ,  William H Wang ,  Frank Flens ,  Henricus Jozef Vergeest

IPC: H01R12/70 ,  H01R12/71

Abstract: A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.

公开(公告)号：US10218098B1

公开(公告)日：2019-02-26

申请号：US15688402

申请日：2017-08-28

Applicant: Finisar Corporation

Inventor： Jia Lian ,  Huaping Peng ,  Shamei Shi ,  William H Wang ,  Frank Flens ,  Henricus Jozef Vergeest

IPC: H01R12/70 ,  H01R12/71

Abstract: A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.

公开(公告)号：US20200059022A1

公开(公告)日：2020-02-20

申请号：US16286405

申请日：2019-02-26

Applicant: FINISAR CORPORATION

Inventor： Jia Lian ,  Huaping Peng ,  Shamei Shi ,  William H. Wang ,  Frank Flens ,  Henricus Jozef Vergeest

IPC: H01R12/70 ,  H01R12/71 ,  H01L23/492 ,  H05K3/34

Abstract: A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.

公开(公告)号：US10466427B2

公开(公告)日：2019-11-05

申请号：US15920178

申请日：2018-03-13

Applicant: Finisar Corporation

Inventor： William H. Wang ,  Shamei Shi ,  Huaping Peng ,  Ranran Zhang ,  Haijun An

IPC: G02B6/42 ,  G02B6/32 ,  G02B6/38

Abstract: In an embodiment, an optoelectronic module includes a printed circuit board (PCB) and a lens block. The printed circuit board (PCB) includes at least one of an optical transmitting or receiving array. The lens block may be configured for directly coupling light between one of the optical transmitting or receiving array to optical fibers in an optical cable. A method may include directly coupling light between one of an optical transmitting or receiving array and a lens block, and further coupling the light through the lens block directly to an optical fiber of an optical cable externally coupled to the optoelectronic module.

公开(公告)号：US20190317283A1

公开(公告)日：2019-10-17

申请号：US16383027

申请日：2019-04-12

Applicant: Finisar Corporation

Inventor： William H. Wang ,  Huaping Peng ,  Ranran Zhang ,  Yandong Mao ,  Shamei Shi

IPC: G02B6/42

Abstract: An example optoelectronic module may include an optical subassembly (OSA), an optical port block, a housing, and a holder. The OSA may be configured to convert between optical and electrical signals. The optical port block may be attached to the OSA and may be configured to optically align a fiber optic cable with the OSA. The housing may be configured to substantially enclose the OSA and the optical port block. The holder may be configured to couple the OSA and the optical port block to the housing. The holder may be detachably coupled to the optical port block and fixedly coupled to the housing.