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公开(公告)号：US20220276281A1
公开(公告)日：2022-09-01
申请号：US17682825
申请日：2022-02-28
Applicant: FormFactor, Inc.
Inventor： Kalyanjit Ghosh , Doug Ondricek , Paul Hsiao
Abstract: A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.
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