公开(公告)号：US20220276281A1

公开(公告)日：2022-09-01

申请号：US17682825

申请日：2022-02-28

申请人： FormFactor, Inc.

发明人： Kalyanjit Ghosh ,  Doug Ondricek ,  Paul Hsiao

IPC分类号： G01R1/073 ,  G01R31/28

摘要： A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.

公开(公告)号：US12044704B2

公开(公告)日：2024-07-23

申请号：US17682825

申请日：2022-02-28

申请人： FormFactor, Inc.

发明人： Kalyanjit Ghosh ,  Douglas Stewart Ondricek ,  Paul Hsiao

IPC分类号： G01R1/073 ,  G01R31/28

CPC分类号： G01R1/07342 ,  G01R31/2886

摘要： A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.