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公开(公告)号：US20180299486A1
公开(公告)日：2018-10-18
申请号：US16016141
申请日：2018-06-22
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge , Edin Sijercic , Eric Hill , John Ebner
CPC classification number: G01R1/06733 , G01R1/07314 , G01R1/07371
Abstract: Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50Ω as is customary for high frequency work.
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Patent Agency Ranking
公开(公告)号：US20190383857A1
公开(公告)日：2019-12-19
申请号：US16440468
申请日：2019-06-13
Applicant: FormFactor, Inc.
Inventor： January Kister , Roy Swart , Edin Sijercic
IPC: G01R1/067
Abstract: Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell. In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores. An important application of this approach is to provide impedance matched transmission line probes.
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公开(公告)号：US11460485B2
公开(公告)日：2022-10-04
申请号：US16164326
申请日：2018-10-18
Applicant: FormFactor, Inc.
Inventor： Jason William Cosman , Benjamin N. Eldridge , Eric Hill , John Ebner , Edin Sijercic
Abstract: Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.
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公开(公告)号：US10527647B2
公开(公告)日：2020-01-07
申请号：US16016141
申请日：2018-06-22
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge , Edin Sijercic , Eric Hill , John Ebner
Abstract: Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50Ω as is customary for high frequency work.
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公开(公告)号：US11156637B2
公开(公告)日：2021-10-26
申请号：US16440468
申请日：2019-06-13
Applicant: FormFactor, Inc.
Inventor： January Kister , Roy Swart , Edin Sijercic
IPC: G01R1/067
Abstract: Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell. In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores. An important application of this approach is to provide impedance matched transmission line probes.
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公开(公告)号：US20190120876A1
公开(公告)日：2019-04-25
申请号：US16164326
申请日：2018-10-18
Applicant: FormFactor, Inc.
Inventor： Jason William Cosman , Benjamin N. Eldridge , Eric Hill , John Ebner , Edin Sijercic
Abstract: Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.
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