Abstract:
A skate on a tip of a probe for testing electrical devices is a reduced thickness probe tip contact. Such a skate can advantageously increase contact pressure, but it can also undesirably reduce probe lifetime due to rapid mechanical wear of the skate. Here multilayer skate probes are provided where the overall shape of the probe tip is a smooth curved surface, as opposed to the conventional fin-like skate configuration. The skate layer is the most mechanically wear-resistant layer in the structure, so abrasive processing of the probe tip leads to a probe skate defined by the skate layer. The resulting probes provide the advantage of increased contact pressure without the disadvantage of reduced lifetime.
Abstract:
A method of making a probe (and the resulting probe) comprising providing a metal foil, creating a tip on an edge of the foil, and laser cutting a body of the probe from the foil with one or more tips at an end of the body.
Abstract:
The present invention is a probe array for testing an electrical device under test comprising one or more ground/power probes and one or more signal probes and optionally a gas flow apparatus.
Abstract:
MEMS probes are provided having decoupled electrical and mechanical design. In these probes, electrical conduction is primarily through one or more electrically conductive rails, and mechanical compliance for vertical compression is provided by a coil. The resulting independence of electrical and mechanical design advantageously enables probes to have a combination of electrical and mechanical properties that cannot be obtained in probes where the probe body is subject to both electrical and mechanical design constraints.
Abstract:
Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.
Abstract:
A probe-on-carrier architecture is provided, where several vertical probes are disposed on each probe carrier and the probe carriers are affixed to the space transformer. Each vertical probe has two flexible members. The first flexible member makes electrical contact to the space transformer. The second flexible member makes temporary electrical contact to the device under test. A mechanical stiffener can be used to deal with the possible lack of flatness and thermal expansion of the space transformer. The mechanical stiffener can be affixed to the space transformer to bring the flatness and thermal expansion of the space transformer to within specifications. Alternatively, the mechanical stiffener ca be affixed to the space transformer without trying to bring the flatness and thermal expansion of the space transformer to within specifications.
Abstract:
Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell. In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores. An important application of this approach is to provide impedance matched transmission line probes.
Abstract:
Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section.
Abstract:
A probe-on-carrier architecture is provided, where several vertical probes are disposed on each probe carrier and the probe carriers are affixed to the space transformer. Each vertical probe has two flexible members. The first flexible member makes electrical contact to the space transformer. The second flexible member makes temporary electrical contact to the device under test. A mechanical stiffener can be used to deal with the possible lack of flatness and thermal expansion of the space transformer. The mechanical stiffener can be affixed to the space transformer to bring the flatness and thermal expansion of the space transformer to within specifications. Alternatively, the mechanical stiffener can be affixed to the space transformer without trying to bring the flatness and thermal expansion of the space transformer to within specifications.
Abstract:
Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell. In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores. An important application of this approach is to provide impedance matched transmission line probes.