公开(公告)号：US20250008270A1

公开(公告)日：2025-01-02

申请号：US18482302

申请日：2023-10-06

Applicant: Fortemedia, Inc.

Inventor： Shih-Chin GONG ,  Yu-Xuan XU

IPC: H04R9/02 ,  H04R9/06

Abstract: A micro speaker structure is provided. The micro speaker structure includes a substrate, a diaphragm, a coil, a circuit board, and a magnet member. The substrate has a hollow space. The diaphragm is disposed over the substrate and covers the hollow chamber. The coil is embedded in the diaphragm. The circuit board is attached to the substrate. The magnet member is disposed on the circuit board and in the hollow chamber. The magnet member has a first side facing the coil and a second side opposite the first side, wherein the first side includes a first polar area and a second polar area having different polarities.

公开(公告)号：US20230239628A1

公开(公告)日：2023-07-27

申请号：US17830448

申请日：2022-06-02

Applicant: Fortemedia, Inc.

Inventor： Li-Jen CHEN ,  Yu-Xuan XU ,  Yu-Ting CHENG ,  Shih-Chin GONG

IPC: H04R9/06 ,  B81C1/00 ,  H04R7/04 ,  H04R7/16 ,  H04R1/02 ,  H04R31/00 ,  H04R9/02 ,  H04R9/04

CPC classification number: H04R9/06 ,  B81C1/00587 ,  H04R1/025 ,  H04R7/04 ,  H04R7/16 ,  H04R9/025 ,  H04R9/047 ,  H04R31/003 ,  H04R31/006 ,  B81C2201/014 ,  B81C2201/0132 ,  B81C2201/0133 ,  H04R2307/025

Abstract: A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.

公开(公告)号：US20240357294A1

公开(公告)日：2024-10-24

申请号：US18302207

申请日：2023-04-18

Applicant: Fortemedia, Inc.

Inventor： Yu-Xuan XU ,  Shih-Chin GONG

IPC: H04R7/04 ,  H04R1/02 ,  H04R9/02 ,  H04R9/04 ,  H04R9/06

CPC classification number: H04R7/04 ,  H04R1/025 ,  H04R9/025 ,  H04R9/047 ,  H04R9/06 ,  H04R2201/003

Abstract: A package structure of a micro speaker is provided, and includes a substrate, a membrane, a coil, and a magnetic element. The substrate has a hollow chamber. The membrane is disposed on the substrate and covers the hollow chamber. The coil is embedded in the membrane. The magnetic element is disposed in the hollow chamber. A vent hole is formed in and penetrates the membrane, and the vent hole is separated from the coil and communicates with the hollow chamber.

公开(公告)号：US20240126374A1

公开(公告)日：2024-04-18

申请号：US18167949

申请日：2023-02-13

Applicant: Fortemedia, Inc.

Inventor： Yu-Xuan XU ,  Ching-Lung CHAN ,  Shih-Chung WANG ,  Yen-Son Paul HUANG ,  Shih-Chin GONG

IPC: G06F3/01 ,  G06F3/16

CPC classification number: G06F3/017 ,  G06F3/167

Abstract: A method for touchless gesture recognition is provided. The method includes transmitting ultrasonic signals via a speaker. The method includes generating ultrasonic signals. The method includes receiving the reflected ultrasonic signals from an object via two or more microphones. The method includes computing a frequency shift according to the reflected ultrasonic signals. The method includes identifying a gesture that corresponds to a movement of the object according to the frequency shift. The method includes performing a function that corresponds to the gesture.

公开(公告)号：US20240007793A1

公开(公告)日：2024-01-04

申请号：US17856105

申请日：2022-07-01

Applicant: Fortemedia, Inc.

Inventor： Yu-Xuan XU ,  Li-Jen CHEN ,  Yu-Ting CHENG ,  Shih-Chin GONG

IPC: H04R7/02

CPC classification number: H04R7/02

Abstract: A package structure of a micro speaker is provided. The package structure includes a substrate having a hollow chamber, a diaphragm suspended over the hollow chamber, a coil embedded in the diaphragm, a carrier board disposed on a bottom surface of the substrate, a first permanent magnetic element disposed on the carrier board and in the hollow chamber, and a lid wrapped around the substrate and the diaphragm. The diaphragm includes an etching pattern. One end of the lid exposes a portion of the top surface of the diaphragm.

公开(公告)号：US20240196134A1

公开(公告)日：2024-06-13

申请号：US18064426

申请日：2022-12-12

Applicant: Fortemedia, Inc.

Inventor： Yu-Xuan XU ,  Shih-Chin GONG

IPC: H04R9/04 ,  H04R1/02 ,  H04R7/06 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R31/00

CPC classification number: H04R9/047 ,  H04R1/025 ,  H04R7/06 ,  H04R7/18 ,  H04R9/025 ,  H04R9/06 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003 ,  H04R2307/025

Abstract: A package structure of a micro speaker includes a substrate having a hollow chamber. A diaphragm is disposed on the top surface of the substrate. The diaphragm includes a first portion suspended over the hollow chamber and a second portion surrounding the first portion. In a plan view, the second portion of the diaphragm and the hollow chamber do not overlap. A coil is embedded in the first portion of the diaphragm. At least one dummy structure is embedded in the second portion of the diaphragm, and it is electrically isolated from the coil structure by the diaphragm. A carrier board is disposed on the bottom surface of the substrate. A permanent magnetic element is disposed on the carrier board and in the hollow chamber. A package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the diaphragm.