摘要:
Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.
摘要:
A method, and an apparatus employing the method, of using a laser to secure a composite film to a substrate. The method includes the acts of positioning the composite film adjacent the substrate, and heating at least a portion of the composite film with the laser and thereby tack the composite film to the substrate.
摘要:
Sealing tapes, such as those utilizing an ultra-thin adhesive layer for attaching the sealing tape to the nozzle member of an ink jet printhead. One such ultra-thin adhesive has a thickness of 3 microns or less, and can be applied using pressure or both heat and pressure.
摘要:
A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along multiple fluid vias skewed variously to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and individual ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes, including chevrons, are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments as does increased usage of the wafer.
摘要:
Printing systems such as those comprising a printing device operable for depositing one or more inks upon a substrate and a drying device, such as one operable for emitting radiation having a pre-selected electromagnetic wavelength, for the purpose of drying the one or more inks in a predetermined time period subsequent to the deposition of the one or more inks upon the substrate, wherein the printing device and the drying device are operated at about the same moving speed. Methods of printing, such as those comprising depositing one or more inks onto a substrate using a printing device and drying the one or more deposited inks using a drying device, such as one operable for emitting pre-selected wavelengths of energy that are focused onto the one or more deposited inks in a predetermined time period subsequent to ink deposition, wherein the depositing and the drying are synchronized.
摘要:
A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along multiple fluid vias skewed variously to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and individual ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes, including chevrons, are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments as does increased usage of the wafer.
摘要:
A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-conductive layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers.
摘要:
An improvement in a networked digital computing system comprises an Information Resource Manager (IRM) operable to communicate with elements of the digital computing system to obtain performance information regarding operation of and resources available in the computing system, and to utilize this information to enable the IRM to adjust the application parameters relating to application execution, thereby to optimize execution of the at least one application program. The IRM comprises (1) a performance profiling system operable to communicate with the at least one CPU, network and SAN and to obtain therefrom performance information and configuration information, (2) an analytical performance model system, operable to communicate with the performance profiling system and to receive the performance information and configuration information and to utilize the performance information and configuration information to generate an analytical model output, the analytical model output comprising any of performance statistics and updated application parameters, and (3) an application parameter determination system, operable to communicate with the analytical model system, to receive therefrom the analytical model output, to determine, in response to the analytical model output, updated application parameter values, and to transmit the updated application parameter values to at least one application running on the digital computing system, for use by the application to set its application parameters, thereby to optimize execution of multiple applications running on the digital computing system, using updated runtime parameters.
摘要:
The invention provides methods, apparatus, systems and computer program code (software) products operable in a digital processing environment, and more particularly a digital storage environment, for enabling a mapping from a set of applications to storage elements used in the digital storage environment, and to provide a hierarchical image of a set of applications (other software programs) that are generating load on any storage element in the digital storage environment.
摘要:
A method of packaging an ink tank for shipment, the method comprising: (a) sealing a first substratum to an ink tank to inhibit fluid communication between an interior of the ink tank and an external environment by way of an ink outlet port of the ink tank, the resultant seal between the first substratum and the ink tank includes at least one of an apex at least partially defined by two substantially linear segments being angled from one another between about 20 degrees to about 160 degrees and fractions separating portions of the substrate from one another; and (b) sealing a second substratum to the ink tank to inhibit fluid communication between the interior of the ink tank and the external environment by way of an ink vent of the ink tank, where the first substratum and the second substratum are removable from the ink tank.