公开(公告)号：US20130021405A1

公开(公告)日：2013-01-24

申请号：US13187755

申请日：2011-07-21

申请人： JIANDONG FANG ,  JAMES MRVOS

发明人： JIANDONG FANG ,  JAMES MRVOS

IPC分类号： B41J2/015 ,  C23F1/02

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1639 ,  B41J2/1642

摘要： Disclosed is a substrate structure for an ejection chip that includes a first substrate layer, a second substrate layer disposed beneath the first substrate layer, and an intermediate layer configured between the first substrate layer and the second substrate layer. The substrate structure also includes a plurality of fluid channels configured within the second substrate layer. Further, the substrate structure includes a plurality of fluid ports configured within the first substrate layer. At least one fluid port of the plurality of fluid ports is configured in alignment with a corresponding fluid channel of the plurality of fluid channels. Furthermore, the substrate structure includes a plurality of slots configured within the intermediate layer such that the at least one fluid port is in fluid communication with the to corresponding fluid channel. Further disclosed is a method for fabricating the substrate structure and an ejection chip employing the substrate structure.

摘要翻译： 公开了一种用于喷射芯片的衬底结构，其包括第一衬底层，设置在第一衬底层下方的第二衬底层和构造在第一衬底层和第二衬底层之间的中间层。 衬底结构还包括在第二衬底层内配置的多个流体通道。 此外，衬底结构包括配置在第一衬底层内的多个流体端口。 多个流体端口中的至少一个流体端口构造成与多个流体通道的相应流体通道对准。 此外，衬底结构包括配置在中间层内的多个槽，使得至少一个流体端口与相应的流体通道流体连通。 进一步公开了一种用于制造衬底结构的方法和使用衬底结构的射出芯片。

公开(公告)号：US20120273597A1

公开(公告)日：2012-11-01

申请号：US13097549

申请日：2011-04-29

申请人： DAVID BERNARD ,  ANDREW MCNEES ,  JAMES MRVOS

发明人： DAVID BERNARD ,  ANDREW MCNEES ,  JAMES MRVOS

IPC分类号： B05B1/14 ,  B23P17/00

CPC分类号： B41J2/1433 ,  B41J2/04541 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/164 ,  B41J2/1645 ,  B41J2202/03 ,  B41J2202/12 ,  B41J2202/13 ,  B41J2202/19 ,  B41J2202/22 ,  H01L21/265 ,  Y10T29/49083 ,  Y10T29/49401

摘要： Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned to method.

摘要翻译： 公开了一种制造流体喷射装置的方法。 该方法包括在衬底上形成驱动电路层。 该方法还包括在衬底上制造至少一个流体喷射元件。 此外，该方法包括在衬底的顶部部分内形成至少一个槽，并在衬底的底部部分内形成至少一个流体供给槽。 至少一个流体供给沟槽的每个流体供给沟槽与至少一个槽的一个或多个槽流体连通。 此外，该方法包括将流动特征层和喷嘴板层压在具有至少一个槽和在其中形成的至少一个流体进料沟槽的基底上。 另外公开了使用上述方法制造的流体喷射装置。

公开(公告)号：US20060054590A1

公开(公告)日：2006-03-16

申请号：US10938009

申请日：2004-09-10

申请人： John Krawczyk ,  Andrew McNees ,  James Mrvos

发明人： John Krawczyk ,  Andrew McNees ,  James Mrvos

IPC分类号： B41J2/04 ,  G11B5/127

CPC分类号： B41J2/1631 ,  B41J2/1603 ,  B41J2/1628

摘要： A method of substantially simultaneously forming at least two fluid supply slots through a thickness of semiconductor substrate from a first surface to a second surface thereof. The method includes the steps of applying a photoresist layer to the first surface of the semiconductor substrate. The photoresist layer is patterned and developed using a gray scale mask for a first fluid supply slot. The semiconductor substrate is then reactive ion etched, to form the at least two fluid supply slots through the thickness of the substrate. The first fluid supply slot is substantially wider than the second fluid supply slot, and the first and second fluid supply slots are etched through the substrate at substantially the same rate.

公开(公告)号：US20060001713A1

公开(公告)日：2006-01-05

申请号：US11169905

申请日：2005-06-29

申请人： Kin Kwan ,  James Mrvos ,  Jeanne Saldanha Singh ,  Mary Smoot

发明人： Kin Kwan ,  James Mrvos ,  Jeanne Saldanha Singh ,  Mary Smoot

IPC分类号： B41J2/175

CPC分类号： B41J2/17559

摘要： A method for manufacturing an inkjet print cartridge and an inkjet cartridge produced thereby are disclosed. An inkjet print cartridge in accordance with one aspect includes a component of the inkjet print cartridge and an applied adhesive on at least a portion of the component, wherein the applied adhesive is formed from an adhesive having a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1. The method in accordance with one aspect includes applying an adhesive onto at least a portion of a component of an inkjet print cartridge at an application temperature, Tα, and heating the adhesive from an initial temperature, Ti, to a cure temperature for the adhesive, Tc. The adhesive has a rheology cure profile characterized by at least one of the following parameters: a) a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1, b) a temperature of the adhesive is approximately equal to a minimum viscosity temperature for the adhesive, Tηmin, within less than about 10 minutes from the start of the cure cycle, and c) viscosity of the adhesive increases within less than about 5 minutes from the start of the cure cycle.

摘要翻译： 公开了一种用于制造由此制造的喷墨打印墨盒和喷墨墨盒的方法。 根据一个方面的喷墨打印墨盒包括喷墨打印墨盒的组件和在组件的至少一部分上的涂布的粘合剂，其中涂布的粘合剂由具有流变粘度比η的粘合剂形成， / SUB> / etamin为1.0至小于2.1。 根据一个方面的方法包括在施加温度Tαα下将粘合剂施加到喷墨打印盒的部件的至少一部分上，并从初始温度T 1加热粘合剂， 将粘合剂的固化温度提高到粘合剂的固化温度。 粘合剂具有以下参数中的至少一个特征的流变学固化分布：a）1.0至小于2.1的流变粘度比ηa / etamin，b）粘合剂的温度为 大约等于从固化循环开始不到约10分钟内粘合剂T etamin N的最小粘度温度，以及c）粘合剂的粘度在小于约5分钟内增加 治愈周期的开始。

公开(公告)号：US20060001703A1

公开(公告)日：2006-01-05

申请号：US10880898

申请日：2004-06-30

申请人： Craig Bertelsen ,  James Mrvos ,  Paul Spivey ,  Melissa Waldeck ,  Sean Weaver

发明人： Craig Bertelsen ,  James Mrvos ,  Paul Spivey ,  Melissa Waldeck ,  Sean Weaver

IPC分类号： B41J2/05

CPC分类号： B41J2/17559

摘要： A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The ejection device includes an ejection head substrate having a fluid supply side and a device side and containing two or more fluid flow paths therein for supplying fluid from the fluid supply side to the device side thereof. A multi-channel manifold is attached to the fluid supply side of the ejection head substrate for providing fluid from two or more fluid reservoirs to the fluid flow paths in the ejection head substrate. The multi-channel manifold has fluid flow channels therein in fluid flow communications with the fluid flow paths in the ejection head substrate and the manifold consists essentially of a patterned photoresist material.

摘要翻译： 微流体喷射装置结构，包含喷射装置结构的多流体盒，以及用于制造喷射装置结构和盒的方法。 喷射装置包括具有流体供给侧和装置侧的喷射头基板，并且在其中包含用于将流体从流体供应侧供应到其装置侧的两个或更多个流体流动路径。 多通道歧管连接到喷射头基板的流体供应侧，用于将流体从两个或更多个流体储存器提供到喷射头基板中的流体流动路径。 多通道歧管在其中具有与喷射头基底中的流体流动通路的流体流动通道，并且歧管基本上由图案化的光致抗蚀剂材料组成。

公开(公告)号：US20120273594A1

公开(公告)日：2012-11-01

申请号：US13097566

申请日：2011-04-29

申请人： DAVID BERNARD ,  ANDREW MCNEES ,  JAMES MRVOS

发明人： DAVID BERNARD ,  ANDREW MCNEES ,  JAMES MRVOS

IPC分类号： A62C31/02 ,  B23P17/00

CPC分类号： B41J2/1621 ,  B41J2/1603 ,  B41J2/1632 ,  B41J2/1634 ,  H01L21/265 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49401

摘要： Disclosed is a method for fabricating a fluid ejection device that includes forming a drive circuitry layer on a substrate and fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and filling each slot of the at least one slot with a protective material. Additionally, the method includes grinding the substrate from a bottom portion thereof. Moreover, the method includes removing the protective material from the each slot. Further, the method includes depositing a layer of a polymeric bonding material on a bottom surface of the substrate. Furthermore, the method includes attaching a manifold chip to the layer of the polymeric bonding material. The method also includes laminating a flow feature layer and a nozzle plate over the substrate. Further disclosed are an ejection chip and a method for fabricating the ejection chip.

摘要翻译： 公开了一种用于制造流体喷射装置的方法，该方法包括在基底上形成驱动电路层，并在衬底上制造至少一个流体喷射元件。 此外，该方法包括在衬底的顶部部分内形成至少一个槽，并用保护材料填充至少一个槽的每个槽。 此外，该方法包括从其底部研磨衬底。 此外，该方法包括从每个槽中去除保护材料。 此外，该方法包括在基底的底表面上沉积聚合物粘结材料层。 此外，该方法包括将歧管芯片附接到聚合物粘合材料的层。 该方法还包括在基底上层叠流动特征层和喷嘴板。 另外公开了一种喷射芯片及其制造方法。

公开(公告)号：US20070076044A1

公开(公告)日：2007-04-05

申请号：US11241218

申请日：2005-09-30

申请人： Richard Corley ,  Brian Hart ,  James Mrvos ,  Paul Spivey

发明人： Richard Corley ,  Brian Hart ,  James Mrvos ,  Paul Spivey

IPC分类号： B41J2/165

CPC分类号： B41J2/17536

摘要： Sealing tapes, such as those utilizing an ultra-thin adhesive layer for attaching the sealing tape to the nozzle member of an ink jet printhead. One such ultra-thin adhesive has a thickness of 3 microns or less, and can be applied using pressure or both heat and pressure.

摘要翻译： 密封带，例如利用超薄粘合剂层的密封带，用于将密封带附着到喷墨打印头的喷嘴构件上。 一种这样的超薄粘合剂具有3微米或更小的厚度，并且可以使用压力或热和压力施加。

公开(公告)号：US20050231557A1

公开(公告)日：2005-10-20

申请号：US10823939

申请日：2004-04-14

申请人： John Krawczyk ,  Andrew McNees ,  James Mrvos ,  Carl Sullivan

发明人： John Krawczyk ,  Andrew McNees ,  James Mrvos ,  Carl Sullivan

IPC分类号： B41J2/16 ,  C23F1/00

CPC分类号： B41J2/14129 ,  B41J2/1603 ,  B41J2/1628

摘要： A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.

摘要翻译： 一种微流体喷射组件，包括其中具有精确形成的流体路径的硅衬底。 流体路径是通过在具有不超过约5000埃的电介质层厚度的蚀刻之前在具有蚀刻前的表面特性的基底上进行的深反应离子蚀刻工艺形成的，以及基本上不含介质材料的凹坑表面，其中a 表面点蚀的均方根深度小于约500埃，最大表面点蚀深度不超过约2500埃。 这种衬底中的流体路径具有改进的流动特性以便更可靠的流体喷射操作。

公开(公告)号：US20050205517A1

公开(公告)日：2005-09-22

申请号：US10941404

申请日：2004-09-15

申请人： John Krawczyk ,  James Mrvos ,  Girish Patil ,  Jason Vanderpool ,  Brian Hart ,  Christopher Money ,  Jeanne Singh ,  Karthik Vaideeswaran

发明人： John Krawczyk ,  James Mrvos ,  Girish Patil ,  Jason Vanderpool ,  Brian Hart ,  Christopher Money ,  Jeanne Singh ,  Karthik Vaideeswaran

IPC分类号： B41J2/16 ,  B41J2/05 ,  B44C1/22 ,  G11B5/127 ,  H01L21/302

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1645 ,  B81B2201/052 ,  B81C1/00531

摘要： A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.

摘要翻译： 蚀刻半导体衬底的方法。 该方法包括以下步骤：将光致抗蚀剂蚀刻掩模层施加到衬底的器件表面。 光刻胶蚀刻掩模的选择第一区被掩蔽，成像和显影。 照射光致抗蚀剂蚀刻掩模层的选择的第二区域以辅助蚀刻掩模层从选择的第二区域的后蚀刻剥离。 蚀刻基板以形成通过基板的厚度的流体供给槽。 至少蚀刻掩模层的选择第二区域从衬底去除，由此从蚀刻掩模层的选择的第二区域形成的掩模层残留物显着减少。

公开(公告)号：US09403365B2

公开(公告)日：2016-08-02

申请号：US13097549

申请日：2011-04-29

申请人： David Bernard ,  Andrew Mcnees ,  James Mrvos

发明人： David Bernard ,  Andrew Mcnees ,  James Mrvos

IPC分类号： B41J2/16 ,  H01L21/265

CPC分类号： B41J2/1433 ,  B41J2/04541 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/164 ,  B41J2/1645 ,  B41J2202/03 ,  B41J2202/12 ,  B41J2202/13 ,  B41J2202/19 ,  B41J2202/22 ,  H01L21/265 ,  Y10T29/49083 ,  Y10T29/49401

摘要： A method for fabricating a fluid ejection device includes forming a drive circuitry layer on a substrate, fabricating at least one fluid ejection element on a top portion of the substrate, grinding the substrate from a bottom portion of the substrate up to a predetermined height, etching the top portion of the substrate to configure at least one slot within the top portion of the substrate, depositing a layer of an etch-stop material over the top portion of the substrate while filling the at least one slot with the etch-stop material, etching the bottom portion of the substrate to configure at least one fluid feed trench within the bottom portion of the substrate, removing the layer of the etch-stop material from the top portion of the substrate, and laminating a flow feature layer and a nozzle plate as a single unit over the top portion of the substrate.

摘要翻译： 一种用于制造流体喷射装置的方法包括在基板上形成驱动电路层，在基板的顶部上制造至少一个流体喷射元件，将基板从基板底部研磨至预定高度，蚀刻 衬底的顶部以在衬底的顶部部分内配置至少一个槽，在衬底的顶部部分沉积一层蚀刻停止材料，同时用该蚀刻停止材料填充该至少一个槽， 蚀刻衬底的底部以在衬底的底部部分内配置至少一个流体馈送沟槽，从衬底的顶部去除蚀刻停止材料层，并层压流动特征层和喷嘴板 作为衬底顶部上的单个单元。