公开(公告)号：US06787897B2

公开(公告)日：2004-09-07

申请号：US10028058

申请日：2001-12-20

申请人： Frank S Geefay ,  Qing Gan ,  Ann Mattos ,  Domingo A Figueredo

发明人： Frank S Geefay ,  Qing Gan ,  Ann Mattos ,  Domingo A Figueredo

IPC分类号： H01L2348

CPC分类号： B81B7/0077 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/00

摘要： A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.

公开(公告)号：US06903012B2

公开(公告)日：2005-06-07

申请号：US10826803

申请日：2004-04-15

申请人： Frank S Geefay ,  Qing Gan

发明人： Frank S Geefay ,  Qing Gan

IPC分类号： H01L21/768 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2924/09701 ,  Y10S438/928

摘要： A sloped via contact is used to connect a contact on the front side of a wafer to a contact on the back side of the wafer. The walls of a small (less than 50-80 microns wide) via have typically been difficult to coat with metal. The present invention forms a small via with sloped walls, allowing easy access to the inside walls of the via for metal sputtering or plating. The small via can be formed using a dry etch process such as the well-known deep reactive ion etching (DRIE) process. Using any isotropic plasma etch process, the walls of the via are further etched from the wafer backside to create sloped walls in the via. The via is then coated with metal to make it conductive.

摘要翻译： 使用倾斜的通孔触点将晶片正面上的触点连接到晶片背面的触点。 小（50-80微米宽）通孔的壁通常难以用金属涂覆。 本发明形成具有倾斜壁的小通孔，允许容易地进入用于金属溅射或电镀的通孔的内壁。 可以使用诸如公知的深反应离子蚀刻（DRIE）工艺的干蚀刻工艺来形成小通孔。 使用任何各向同性等离子体蚀刻工艺，从晶片背面进一步蚀刻通孔的壁，以在通孔中产生倾斜的壁。 然后用金属涂覆通孔以使其导电。

公开(公告)号：US06979597B2

公开(公告)日：2005-12-27

申请号：US10615672

申请日：2003-07-08

申请人： Frank S Geefay ,  Qing Gan ,  Ann Mattos ,  Domingo A Figueredo

发明人： Frank S Geefay ,  Qing Gan ,  Ann Mattos ,  Domingo A Figueredo

IPC分类号： H01L23/02 ,  B81B7/00 ,  H01L21/50 ,  H01L23/10 ,  H01L21/44 ,  H01L21/30 ,  H01L21/46 ,  H01L21/48

CPC分类号： B81B7/0077 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/00

摘要： A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.

摘要翻译： 垫圈在盖晶片和基底晶片之间包围密封的环境。 垫圈使用接合材料结合到基底晶片。 接合材料可以是显示可接受的粘合性，密封性和确保密封环境的其它性质的许多物质中的一种或多种。 垫片从盖片材料本身雕刻出来。 盖晶片通常由非常坚固和刚性的材料制成，例如硅。 由于垫片由盖片制成，所以垫片本身也非常坚固和刚性。

公开(公告)号：US06763702B2

公开(公告)日：2004-07-20

申请号：US10325356

申请日：2002-12-19

申请人： Allen Chien ,  Frank S Geefay ,  Cheol Hyun Han ,  Qing Gan

发明人： Allen Chien ,  Frank S Geefay ,  Cheol Hyun Han ,  Qing Gan

IPC分类号： G01M316

CPC分类号： G01M3/226

摘要： A method and apparatus for determining the hermeticity of a semiconductor package is disclosed. Gas is introduced into the semiconductor package during packaging. Vacuum suction is then applied to the package. If the package has any leaks, the gas within will escape. The package is next scanned using a spectrometer. If the spectrometer does not detect any gas within the package cavity, the package is not hermetically sealed. In an alternate embodiment, the device is packaged first, and then immersed in a pressurized liquid. If the package has a leak, the pressure on the liquid will force liquid into the package cavity. The cavity of a properly sealed package will remain empty and dry. The package is scanned using a spectrometer. If the spectrometer detects liquid within the package, the package is not hermetically sealed.

摘要翻译： 公开了一种用于确定半导体封装的气密性的方法和装置。 在包装过程中将气体引入半导体封装。 然后将真空吸力施加到包装上。 如果包装有任何泄漏，内部的气体将会逸出。 然后使用光谱仪扫描包装。 如果光谱仪没有检测到封装腔内的任何气体，封装件不会被密封。 在替代实施例中，装置首先包装，然后浸入加压液体中。 如果包装有泄漏，液体上的压力将迫使液体进入包装腔。 正确密封的包装的空腔将保持空且干燥。 使用光谱仪扫描包装。 如果光谱仪检测到包装内的液体，则封装不是密封的。