公开(公告)号：US06763702B2

公开(公告)日：2004-07-20

申请号：US10325356

申请日：2002-12-19

申请人： Allen Chien ,  Frank S Geefay ,  Cheol Hyun Han ,  Qing Gan

发明人： Allen Chien ,  Frank S Geefay ,  Cheol Hyun Han ,  Qing Gan

IPC分类号： G01M316

CPC分类号： G01M3/226

摘要： A method and apparatus for determining the hermeticity of a semiconductor package is disclosed. Gas is introduced into the semiconductor package during packaging. Vacuum suction is then applied to the package. If the package has any leaks, the gas within will escape. The package is next scanned using a spectrometer. If the spectrometer does not detect any gas within the package cavity, the package is not hermetically sealed. In an alternate embodiment, the device is packaged first, and then immersed in a pressurized liquid. If the package has a leak, the pressure on the liquid will force liquid into the package cavity. The cavity of a properly sealed package will remain empty and dry. The package is scanned using a spectrometer. If the spectrometer detects liquid within the package, the package is not hermetically sealed.

摘要翻译： 公开了一种用于确定半导体封装的气密性的方法和装置。 在包装过程中将气体引入半导体封装。 然后将真空吸力施加到包装上。 如果包装有任何泄漏，内部的气体将会逸出。 然后使用光谱仪扫描包装。 如果光谱仪没有检测到封装腔内的任何气体，封装件不会被密封。 在替代实施例中，装置首先包装，然后浸入加压液体中。 如果包装有泄漏，液体上的压力将迫使液体进入包装腔。 正确密封的包装的空腔将保持空且干燥。 使用光谱仪扫描包装。 如果光谱仪检测到包装内的液体，则封装不是密封的。

公开(公告)号：US06777267B2

公开(公告)日：2004-08-17

申请号：US10286729

申请日：2002-11-01

申请人： Richard C. Ruby ,  Frank S. Geefay ,  Cheol Hyun Han ,  Qing Gan ,  Andrew T. Barfknecht

发明人： Richard C. Ruby ,  Frank S. Geefay ,  Cheol Hyun Han ,  Qing Gan ,  Andrew T. Barfknecht

IPC分类号： H01L2144

CPC分类号： H01L21/6836 ,  H01L21/50 ,  H01L21/78 ,  H01L2221/68327

摘要： A method for separating dies on a wafer includes etching channels around the dies on a first side of the wafer, mounting the first side of the wafer to a quartz plate with an UV adhesive, and grinding a second side of the wafer until the channels are exposed on the second side of the wafer. At this point, the dies are separated but held together by the UV adhesive on the quartz plate. The method further includes mounting a second side of the wafer to a tack tape, exposing UV radiation through the quartz plate to the UV adhesive. At this point, the UV adhesive looses its adhesion so the dies are held together by the tack tape. The method further includes dismounting the quartz plate from the first side of the wafer and picking up the individual dies from the tack tape.

公开(公告)号：US08635762B1

公开(公告)日：2014-01-28

申请号：US11533741

申请日：2006-09-20

申请人： Nikhil V. Kelkar ,  Sadanand R. Patil ,  Cheol Hyun Han

发明人： Nikhil V. Kelkar ,  Sadanand R. Patil ,  Cheol Hyun Han

IPC分类号： H01Q17/00

CPC分类号： G06K19/07754 ,  H01P11/00 ,  H01Q1/2208 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q23/00 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018

摘要： A method for attaching antennae to RFID tags is disclosed. Included is the use of RFID tags having asymmetrical interconnect system for one or more antennae, such that virtually any rotational orientation of the RFID tag will result in a successful antennae attachment. Two oversized and “L” shaped gold-bumped holes can be arranged on the same side of the ship in an opposing action, such that at least one axis of symmetry is formed. Accordingly, virtually all rotational orientations of the chip are then acceptable when attaching a pair of opposing pole antenna leads. Alternatively, a pair of poles can be located on opposing chips surfaces, such that antenna substrates can be attached to both the top and bottom of the chip to form a product “sandwich”, whereby the rotational orientation of the chip is irrelevant at an antenna attachment step.

摘要翻译： 公开了一种将天线连接到RFID标签的方法。 包括使用具有用于一个或多个天线的不对称互连系统的RFID标签，使得RFID标签的实际上任何旋转取向将导致成功的天线附接。 两个大尺寸和“L”形的金凸起的孔可以以相对的作用布置在船的同一侧上，使得形成至少一个对称轴。 因此，当连接一对相对的极天线引线时，芯片的几乎所有的旋转取向都是可接受的。 或者，一对极可以位于相对的芯片表面上，使得天线基板可以附接到芯片的顶部和底部，以形成产品“夹心”，由此芯片的旋转取向在天线处是不相关的 附件步骤。

公开(公告)号：US07230580B1

公开(公告)日：2007-06-12

申请号：US10651683

申请日：2003-08-29

申请人： Nikhil V. Kelkar ,  Sadanand R. Patil ,  Cheol Hyun Han

发明人： Nikhil V. Kelkar ,  Sadanand R. Patil ,  Cheol Hyun Han

IPC分类号： H01Q7/00

CPC分类号： G06K19/07754 ,  H01P11/00 ,  H01Q1/2208 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q23/00 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018

摘要： An apparatus and method for attaching antennae to RFID tags is disclosed. Included is the use of RFID tags having a symmetrical interconnect system for attaching one or more antennae, such that virtually any rotational orientation of the RFID tag will result in a successful antennae attachment. Two oversized and “L” shaped gold-bumped poles can be arranged on the same side of a chip in an opposing fashion, such that at least one axis of symmetry is formed. Accordingly, virtually all rotational orientations of the chip are then acceptable when attaching a pair of opposing pole antenna leads. Alternatively, a pair of poles can be located on opposing chip surfaces, such that antenna substrates can attach to both the top and bottom of the chip to form a product “sandwich,” whereby the rotational orientation of the chip is irrelevant at an antenna attachment step.

摘要翻译： 公开了一种用于将天线附接到RFID标签的装置和方法。 包括使用具有用于附接一个或多个天线的对称互连系统的RFID标签，使得RFID标签的实际上任何旋转取向将导致成功的天线附接。 两个大尺寸和“L”形的金凸极可以以相对的方式布置在芯片的同一侧上，使得形成至少一个对称轴。 因此，当连接一对相对的极天线引线时，芯片的几乎所有的旋转取向都是可接受的。 或者，一对极可以位于相对的芯片表面上，使得天线基板可以附接到芯片的顶部和底部两者以形成产品“夹心”，由此芯片的旋转取向在天线附件上是不相关的 步。

公开(公告)号：US07045035B1

公开(公告)日：2006-05-16

申请号：US11101028

申请日：2005-04-06

申请人： Nikhil Kelkar ,  Ken Pham ,  Jaime A. Bayan ,  Cheol Hyun Han

发明人： Nikhil Kelkar ,  Ken Pham ,  Jaime A. Bayan ,  Cheol Hyun Han

IPC分类号： B32B35/00

CPC分类号： H01L21/67132 ,  H01L2221/68322 ,  Y10S156/941 ,  Y10T156/1179 ,  Y10T156/19

摘要： A post singulation, die separation assembly for bulk separation of a plurality of dice in a singulated wafer from the adhesive backing of wafer saw tape. The die separation assembly includes a support base having a support surface. A feed tray includes a collection end positioned adjacent the base such that an elongated, substantially tin gap is formed between the tray collection end and at least a portion of the base. A flexible platform is movably supported atop the base support surface for movement along the base. Upon movement of the flexible platform down the down-ramped portion of the support base, a portion of the wafer saw tape thereat is peeled away from the respective die. The tape is the separated from the dice, releasing the respective dice onto the collection end of the feed tray in a manner substantially maintaining their forward alignment orientation of thereof.

摘要翻译： 用于将单片晶片中的多个骰子从晶片锯带的粘合剂背衬批量分离的后分离模头分离组件。 模具分离组件包括具有支撑表面的支撑基座。 馈送托盘包括邻近基部定位的收集端，使得在托盘收集端和基部的至少一部分之间形成细长的基本上锡的间隙。 柔性平台可移动地支撑在基座支撑表面上方，以便沿底座移动。 当柔性平台沿着支撑基座的向下倾斜的部分移动时，其中的晶片锯带的一部分从相应的模具剥离。 胶带与骰子分离，以相当大的方式保持它们的向前定向取向的方式将相应的骰子释放到进料盘的收集端上。

公开(公告)号：US06932136B1

公开(公告)日：2005-08-23

申请号：US10821824

申请日：2004-04-08

申请人： Nikhil Kelkar ,  Ken Pham ,  Jaime A. Bayan ,  Cheol Hyun Han

发明人： Nikhil Kelkar ,  Ken Pham ,  Jaime A. Bayan ,  Cheol Hyun Han

IPC分类号： H01L21/00 ,  B32B35/00

CPC分类号： H01L21/67132 ,  H01L2221/68322 ,  Y10S156/941 ,  Y10T156/1179 ,  Y10T156/19

摘要： A post singulation, die separation assembly for bulk separation of a plurality of dice in a singulated wafer from the adhesive backing of wafer saw tape. The die separation assembly includes a support base having a support surface, a first portion and an opposite second portion thereof. The second portion includes a down-ramped portion thereof skewed downwardly at a first acute angle from the support surface. A feed tray includes a collection end positioned adjacent the base second portion such that an elongated, substantially thin gap is formed between the tray collection end and at least a portion of the base second portion. A flexible platform is movably supported atop the base support surface for movement from the first portion to the second portion thereof. At the second portion, the platform passes downward through the gap formed between the tray collection end and the at least a portion of the base second portion. The platform defines an upward facing surface upon each die of the singulated wafer is adhered thereto, via the saw tape, in a forward aligned manner. Upon movement of the flexible platform down the down-ramped portion of the support base, a portion of the wafer saw tape thereat is peeled away from the respective die. The tape is the separated from the dice, releasing the respective dice onto the collection end of the feed tray in a manner substantially maintaining their forward alignment orientation of thereof.

摘要翻译： 用于将单片晶片中的多个骰子从晶片锯带的粘合剂背衬批量分离的后分离模头分离组件。 模具分离组件包括具有支撑表面的支撑基座，第一部分和相对的第二部分。 第二部分包括从支撑表面以第一锐角向下倾斜的向下倾斜的部分。 馈送托盘包括收集端，邻近基部第二部分定位，使得在托盘收集端和基部第二部分的至少一部分之间形成细长的基本上较薄的间隙。 柔性平台可移动地支撑在基座支撑表面上方，用于从第一部分移动到第二部分。 在第二部分，平台向下通过形成在托盘收集端和基部第二部分的至少一部分之间的间隙。 平台通过锯带以正向对齐的方式限定了单面晶片的每个管芯上的面向上的表面。 当柔性平台沿着支撑基座的向下倾斜的部分移动时，其中的晶片锯带的一部分从相应的模具剥离。 胶带与骰子分离，以相当大的方式保持它们的向前定向取向的方式将相应的骰子释放到进料盘的收集端上。