公开(公告)号：US20100099333A1

公开(公告)日：2010-04-22

申请号：US12254291

申请日：2008-10-20

申请人： Fransisca Maria Astrid Sudargho ,  Ara Philipossian ,  Leonard Borucki ,  Masanori Furukawa ,  Koichiro Ichikawa

发明人： Fransisca Maria Astrid Sudargho ,  Ara Philipossian ,  Leonard Borucki ,  Masanori Furukawa ,  Koichiro Ichikawa

IPC分类号： B24B49/00 ,  B24B7/20 ,  B24B1/00

CPC分类号： B24B37/042 ,  B24B49/16

摘要： A method for (a) determining the shear force between a wafer head and a polishing pad in a polishing tool using a CMP polishing tool with a plate above the wafer head which hangs or rests on the plate. The plate is connected to the CMP polishing tool by (b) low friction motion means (c). A load cell sensor is fixed to the framework of the polishing tool or another immovable structure. (d) The load cell determines the force from the leading edge of the plate when the wafer head is in contact with the polishing pad. (e) Signals from the load cell sensor reporting the shear force. A CMP polishing tool which includes elements corresponding to each of points (a)-(e) in the above method.

摘要翻译： 一种用于（a）使用CMP抛光工具在抛光工具中确定晶片头和抛光垫之间的剪切力的方法，该抛光工具具有悬挂或搁置在板上的晶片头上方的板。 通过（b）低摩擦力运动装置（c）将板连接到CMP抛光工具。 称重传感器固定在抛光工具的框架或其他不可移动的结构上。 （d）当晶片头与抛光垫接触时，称重传感器确定来自板的前缘的力。 （e）报告剪切力的称重传感器传感器的信号。 CMP抛光工具，其包括与上述方法中的点（a） - （e）中的每一个相对应的元件。

公开(公告)号：US20100107726A1

公开(公告)日：2010-05-06

申请号：US12262974

申请日：2008-10-31

申请人： Leonard Borucki ,  Naoki Rikita ,  Ara Philipossian ,  Fransisca Maria Astrid Sudargho ,  Yun Zhuang

发明人： Leonard Borucki ,  Naoki Rikita ,  Ara Philipossian ,  Fransisca Maria Astrid Sudargho ,  Yun Zhuang

IPC分类号： G01N19/02

CPC分类号： B24B53/12 ,  B24B49/16

摘要： A device for determining the coefficient of friction of diamond conditioner discs and a method of use thereof. The device is a solid base means comprising a block of granite with a smooth flat upper surface, a diamond conditioner disc counter surface means comprising a removable sheet of polycarbonate, a means for moving the diamond conditioner disc comprising an assembly parallel to and perpendicular to the surface of the said slab and overlain material along which a plate, the surface of which is parallel to the surface of the assembly and perpendicular to the surface of the said slab and overlain material, is moved by a screw, a means for securing the diamond conditioner disc comprising a holder bolted to the said plate that is capable of riding just above the surface of the slab and overlain material with an anterior face with respect to the direction of motion that is concave and capable of securely holding a diamond conditioner disc placed grinding face down upon the said overlain material the top of which is open so that load may be applied to the diamond conditioner disc and a means for measuring the shear force imparted by the moving diamond conditioner disc comprising a load cell. Shear force and down force are determined using the above apparatus and the coefficient of friction of the diamond conditioner disc and the said sheet are calculated therefrom.

摘要翻译： 一种用于确定金刚石修整片的摩擦系数的装置及其使用方法。 该装置是一种固体基部装置，包括具有光滑平坦上表面的花岗岩块，金刚石调节盘对置表面装置，包括可移除的聚碳酸酯片，用于移动金刚石调节盘的装置，其包括平行于并垂直于 所述板坯和覆盖材料的表面，其表面平行于组件的表面并且垂直于所述板坯和覆盖材料的表面沿着该板的表面通过螺钉移动，用于固定金刚石的装置 调节盘包括螺栓连接到所述板的支架，其能够刚好在板的表面上方并且相对于凹入的运动方向的前表面覆盖材料，并且能够可靠地保持钻石调节盘放置研磨 面朝下地覆盖所述重叠的材料，其顶部是敞开的，从而可以将负载施加到钻石调节盘和用于的钻石调节盘 测量包括测力传感器的移动金刚石调节盘所施加的剪切力。 使用上述装置确定剪切力和向下力，并由此计算金刚石调节盘和所述片材的摩擦系数。

公开(公告)号：US20100112905A1

公开(公告)日：2010-05-06

申请号：US12261540

申请日：2008-10-30

申请人： Leonard Borucki ,  Ara Philipossian ,  Masanori Furukawa ,  Koichiro Ichikawa

发明人： Leonard Borucki ,  Ara Philipossian ,  Masanori Furukawa ,  Koichiro Ichikawa

IPC分类号： B24B7/20 ,  B24B41/06 ,  B24B1/00

CPC分类号： B24B37/32

摘要： The present invention is a planar template for a CMP tool polishing head possessing a means of securing a wafer in CMP polishing where the back surface of the template is held to the polishing head by retaining means and a method for using the planar template.

摘要翻译： 本发明是一种用于CMP工具抛光头的平面模板，其具有将晶片固定在CMP抛光中的装置，其中模板的后表面通过保持装置保持在抛光头上，以及使用该平面模板的方法。

公开(公告)号：US20100112911A1

公开(公告)日：2010-05-06

申请号：US12262579

申请日：2008-10-31

申请人： Leonard Borucki ,  Ara Philipossian ,  Yasa Sampurno ,  Sian Theng

发明人： Leonard Borucki ,  Ara Philipossian ,  Yasa Sampurno ,  Sian Theng

IPC分类号： B24B57/00

CPC分类号： B24B37/04 ,  B24B57/02

摘要： The present invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising a solid crescent shaped injector the concave trailing edge of which is fitted to the size and shape of the leading edge of the polishing head with a gap of up to 1 inch, the bottom surface of which faces the pad and rests on it with a light load, and through which CMP slurry or components thereof are introduced through one or more openings in the top of the injector and travel through a channel or reservoir the length of the device to the bottom where it or they exit multiple openings in the bottom of the injector, are spread into a thin film, and are introduced between the surface of the polishing pad and the wafer along the leading edge of the wafer in quantities such that all or most of the slurry is introduced between the wafer and the polishing pad and a method of use therefor.

摘要翻译： 本发明包括一种用于在半导体晶片的化学机械抛光中在晶片和衬垫之间注入浆料的设备，其包括固体月牙形喷射器，其凹后缘与抛光头的前缘的尺寸和形状相配合， 高达1英寸的间隙，其底表面面向垫并以轻负载放置在其上，并且通过其中CMP浆料或其组分通过喷射器顶部中的一个或多个开口引入并穿过一个 通道或储存器，其中它或它们离开喷射器底部的多个开口的底部的长度被扩散成薄膜，并且沿着前述边缘的引导边缘被引入到抛光垫的表面和晶片之间 晶片的量使得所有或大部分浆料被引入晶片和抛光垫之间，并且其使用方法。

公开(公告)号：US08197306B2

公开(公告)日：2012-06-12

申请号：US12262579

申请日：2008-10-31

申请人： Leonard Borucki ,  Ara Philipossian ,  Yasa Sampurno ,  Sian Theng

发明人： Leonard Borucki ,  Ara Philipossian ,  Yasa Sampurno ,  Sian Theng

IPC分类号： B24B57/00 ,  B24B1/00

CPC分类号： B24B37/04 ,  B24B57/02

摘要： The present invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising a solid crescent shaped injector the concave trailing edge of which is fitted to the size and shape of the leading edge of the polishing head with a gap of up to 1 inch, the bottom surface of which faces the pad and rests on it with a light load, and through which CMP slurry or components thereof are introduced through one or more openings in the top of the injector and travel through a channel or reservoir the length of the device to the bottom where it or they exit multiple openings in the bottom of the injector, are spread into a thin film, and are introduced between the surface of the polishing pad and the wafer along the leading edge of the wafer in quantities such that all or most of the slurry is introduced between the wafer and the polishing pad and a method of use therefor.

摘要翻译： 本发明包括一种用于在半导体晶片的化学机械抛光中在晶片和衬垫之间注入浆料的设备，其包括固体月牙形喷射器，其凹后缘与抛光头的前缘的尺寸和形状相配合， 高达1英寸的间隙，其底表面面向垫并以轻负载放置在其上，并且通过其中CMP浆料或其组分通过喷射器顶部中的一个或多个开口引入并穿过一个 通道或储存器，其中它或它们离开喷射器底部的多个开口的底部的长度被扩散成薄膜，并且沿着前述边缘的引导边缘被引入到抛光垫的表面和晶片之间 晶片的量使得所有或大部分浆料被引入晶片和抛光垫之间，并且其使用方法。

公开(公告)号：US20100216373A1

公开(公告)日：2010-08-26

申请号：US12392676

申请日：2009-02-25

申请人： Leonard Borucki ,  Yasa Sampurno ,  Sian Theng ,  Ara Philipossian

发明人： Leonard Borucki ,  Yasa Sampurno ,  Sian Theng ,  Ara Philipossian

IPC分类号： B24B49/12 ,  B24B57/02 ,  B24B49/14

CPC分类号： B24B57/02 ,  B24B37/015 ,  B24B49/12

摘要： A method for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising a solid crescent shaped injector the concave trailing edge of which is fitted to the size and shape of leading edge of the polishing head with a gap of between 0 and 3 inches, the bottom surface facing the pad, which rests on the pad with a light load, and through which CMP slurry or components thereof are introduced through one or more openings in the top of the injector and travel through a channel or reservoir the length of the device to the bottom where it or they exit multiple openings in the bottom of the injector, are spread into a thin film, and are introduced at the junction of the surface of the polishing pad and the wafer along the leading edge of the wafer in quantities small enough that all or most of the slurry is introduced between the wafer and the polishing pad, wherein multiple inlets for the introduction of fluids to different points in the channel or directly to the bottom surface of the injector are utilized and some or all of which inlets are fitted with means for controlling the flow of fluid and adjustment is made to the said flow control means during or after polishing to adjust slurry delivery to the wafer surface to improve uniformity of removal rate at the wafer surface.

摘要翻译： 一种用于在半导体晶片的化学机械抛光中在晶片和衬垫之间注入浆料的方法，其包括固体新月形喷射器，其凹形后缘与抛光头的前缘的尺寸和形状相配合，间隙为0 并且3英寸，底表面面向垫，其以轻负载放置在垫上，并且通过该CMP浆料或其组分通过喷射器的顶部中的一个或多个开口引入CMP浆料或其组分，并且穿过通道或容器 设备到底部的距离，其中它们或它们离开喷射器底部的多个开口，被扩散成薄膜，并且在沿着抛光垫的前缘的抛光垫的表面和晶片的接合处被引入 晶片的数量足够小，使得所有或大部分浆料被引入晶片和抛光垫之间，其中多个入口用于将流体引入到 通道或直接到喷射器的底表面，并且其中的一些或所有入口装配有用于控制流体流动的装置，并且在抛光期间或之后对所述流量控制装置进行调整以调节浆料向晶片的输送 表面以提高晶片表面的去除速率的均匀性。

公开(公告)号：US20100186479A1

公开(公告)日：2010-07-29

申请号：US12359772

申请日：2009-01-26

申请人： Leonard Borucki ,  Yun Zhuang ,  Yasa Sampurno ,  Ara Philipossian

发明人： Leonard Borucki ,  Yun Zhuang ,  Yasa Sampurno ,  Ara Philipossian

IPC分类号： G01N3/56

CPC分类号： G01N3/56

摘要： The present invention is a method for determining the location of and distinguishing aggressive diamonds from active diamonds on a diamond conditioner disc, comprising: (a) contacting a diamond conditioner disc with a hard surface, wherein the diamond-containing side of the diamond conditioning disc is facing the hard surface, (b) pushing the conditioner disc a sufficient distance that all diamonds could possibly be scratching the surface at the same time and at least a distance corresponding to the length of the said diamond conditioner disc (c) observing number and position of the scratches left by diamonds on the hard surface to determine the number and position of active diamonds on the diamond conditioner disc, and (d) selecting the diamonds, the marks for which are the most pronounced and which comprise 50% or more of the total furrow area observed for all of the active diamonds in descending order of furrow are plus any diamonds in excess of the number needed to achieve said 50% or more whose individual furrow area is 2% or more, which diamonds are determined to be aggressive diamonds, or impressing the diamond conditioner disc under a load onto a hard surface and the impression of the most aggressive diamonds in the hard surface being confirmed by microscopic examination to in turn confirm the position and aggressiveness of the aggressive diamonds observed or (e) contacting a diamond conditioner disc with a hard surface, wherein the diamond-containing side of the diamond conditioning disc is facing the hard surface, (f) pushing the conditioner disc a sufficient distance that all diamonds could possibly be scratching the surface at the same time and at least a distance corresponding to the length of the said diamond conditioner disc (g) observing number and position of the scratches left by diamonds on the hard surface to determine the number and position of active diamonds on the diamond conditioner disc, (h) the hard surface further comprises a layer of contrasting material such that when the diamond conditioner disc moves across the hard surface, the said diamond conditioner disc crosses the limits of the layer entirely from one end to the other and scratches the layer of contrasting material on the hard surface thereby leaving a visible mark, (i) the said layer is between 8 and 15 microns thick and (j) selecting the diamonds which cut entirely through the said layer allowing backlighting to be easily viewed.

公开(公告)号：US07869027B2

公开(公告)日：2011-01-11

申请号：US12426574

申请日：2009-04-20

申请人： Leonard Borucki

发明人： Leonard Borucki

IPC分类号： G01N21/01

CPC分类号： G02B21/34

摘要： The present invention is a sample holder for confocal microscopy of CMP pad samples cut or otherwise removed from either new or used CMP pads that maintains a uniform load and pressure over the part of the sample visible to the confocal microscope by placing the pad behind a transparent window and holding it against the said window by a means comprising upper transparent window retaining means having an offset adjacent the transparent window having the same or essentially the same refractive index as the pad material so that when the pad is held against the transparent window, the edges of the pad are outside the outer edge of the transparent window; lower pad retaining means to press the pad under a known/load against the transparent window, which lower pad retaining means has a size less than the size of the pad; spherical force transmitting means pressed against the lower pad retaining means; through a load cell to measure the load transferred to the sample through lower pad retaining means, the spherical force transmitting means, the force transfer means and load cell from the posterior structural housing of the sample holder which is forced together with the said window retaining means by a force generating means; and means to adjust the known load and a method of confocal microscopy of new and used CMP pad samples to determine relative surface area and other characteristics using the said confocal sample.

摘要翻译： 本发明是用于共聚焦显微镜的样品保持器，用于从新的或使用过的CMP垫切割或以其它方式从其中去除的CMP垫样品，其通过将所述垫放置在透明的后面，保持对共聚焦显微镜可见的部分样品上的均匀负载和压力 并且通过包括上透明窗保持装置的装置将其保持抵靠所述窗口，所述上透明窗保持装置具有与所述透明窗相邻的偏移，所述偏移具有与所述垫材料相同或基本相同的折射率，使得当所述垫被抵靠所述透明窗时， 垫的边缘在透明窗的外边缘之外; 下垫片保持装置，在已知/负载下将垫压靠在透明窗口上，该下垫片保持装置的尺寸小于垫的尺寸; 球形力传递装置压靠下垫垫保持装置; 通过测力传感器测量通过下垫片保持装置传递到样品的载荷，球形力传递装置，力传递装置和载荷传感装置，其与所述窗口保持装置一起被迫与样品架的后结构壳体 通过力产生装置; 以及用于调整已知负载的方法和新的和使用的CMP垫样品的共焦显微镜的方法，以使用所述共聚焦样品来确定相对表面积和其它特征。

公开(公告)号：US20100265576A1

公开(公告)日：2010-10-21

申请号：US12426574

申请日：2009-04-20

申请人： Leonard Borucki

发明人： Leonard Borucki

IPC分类号： G02B21/30 ,  G02B21/34 ,  G01L1/14

CPC分类号： G02B21/34

摘要： The present invention is a sample holder for confocal microscopy of CMP pad samples cut or otherwise removed from either new or used CMP pads that maintains a uniform load and pressure over the part of the sample visible to the confocal microscope by placing the pad behind a transparent window and holding it against the said window by a means comprising upper transparent window retaining means having an offset adjacent the transparent window having the same or essentially the same refractive index as the pad material so that when the pad is held against the transparent window, the edges of the pad are outside the outer edge of the transparent window; lower pad retaining means to press the pad under a known/load against the transparent window, which lower pad retaining means has a size less than the size of the pad; spherical force transmitting means pressed against the lower pad retaining means; through a load cell to measure the load transferred to the sample through lower pad retaining means, the spherical force transmitting means, the force transfer means and load cell from the posterior structural housing of the sample holder which is forced together with the said window retaining means by a force generating means; and means to adjust the known load and a method of confocal microscopy of new and used CMP pad samples to determine relative surface area and other characteristics using the said confocal sample.

摘要翻译： 本发明是用于共聚焦显微镜的样品保持器，用于从新的或使用过的CMP垫切割或以其它方式从其中去除的CMP垫样品，其通过将所述垫放置在透明的后面，保持对共聚焦显微镜可见的部分样品上的均匀负载和压力 并且通过包括上透明窗保持装置的装置将其保持抵靠所述窗口，所述上透明窗保持装置具有与所述透明窗相邻的偏移，所述偏移具有与所述垫材料相同或基本相同的折射率，使得当所述垫被抵靠所述透明窗时， 垫的边缘在透明窗的外边缘之外; 下垫片保持装置，在已知/负载下将垫压靠在透明窗口上，该下垫片保持装置的尺寸小于垫的尺寸; 球形力传递装置压靠下垫垫保持装置; 通过测力传感器测量通过下垫片保持装置传递到样品的载荷，球形力传递装置，力传递装置和载荷传感装置，其与所述窗口保持装置一起被迫与样品架的后结构壳体 通过力产生装置; 以及用于调整已知负载的方法和新的和使用的CMP垫样品的共焦显微镜的方法，以使用所述共聚焦样品来确定相对表面积和其它特征。

公开(公告)号：US07410411B2

公开(公告)日：2008-08-12

申请号：US11528835

申请日：2006-09-28

申请人： Leonard Borucki ,  Naoki S. Rikita

发明人： Leonard Borucki ,  Naoki S. Rikita

IPC分类号： B24B1/00 ,  G01N3/56

CPC分类号： B24B37/042 ,  B24B37/24 ,  B24B53/017

摘要： The invention relates to a method for determining the number of active diamonds on a conditioning disk. In particular, the method comprises (a) contacting a diamond conditioner disk with a hard surface, wherein the diamond-containing side of the diamond conditioning disk is facing the hard surface, (b) moving the diamond conditioner disk under a load across the hard surface so as to cause any active diamonds present on the diamond-containing side of the diamond conditioner disk to leave a mark corresponding to each active diamond, and (c) counting the marks to determine the number of active diamonds on the diamond conditioner disk.

摘要翻译： 本发明涉及一种用于确定调节盘上活性钻石数目的方法。 特别地，该方法包括：（a）将金刚石调节盘与硬表面接触，其中金刚石调节盘的含金刚石的侧面面向硬表面，（b）将金刚石调节盘在负载下移动穿过硬 表面，以便使存在于钻石调节盘的含金刚石侧的任何活性钻石留下与每个活性金刚石相对应的标记，以及（c）计数标记以确定钻石调理盘上活性钻石的数量。