公开(公告)号：US20230193168A1

公开(公告)日：2023-06-22

申请号：US18081738

申请日：2022-12-15

申请人： Fujifilm Electronic Materials U.S.A., Inc.

发明人： Bin Hu ,  Binh Duong ,  Carl Ballesteros ,  Yannan Liang ,  Hyosang Lee

IPC分类号： C11D11/00 ,  C11D7/32 ,  C11D7/50

CPC分类号： C11D11/0047 ,  C11D7/32 ,  C11D7/5004

摘要： This disclosure relates to a method that includes applying a polishing composition to a surface of a substrate; bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate to create a polished substrate; treating the polished substrate with a rinse solvent; flowing a vapor over a meniscus formed at an interface between air and the rinse solvent on the polished substrate. The vapor includes a first component containing a water miscible organic solvent, a second component containing a cleaning agent, and a third component containing an inert gas.