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公开(公告)号:US20240174892A1
公开(公告)日:2024-05-30
申请号:US18515857
申请日:2023-11-21
Applicant: Fujifilm Electronic Materials U.S.A. Inc.
Inventor: Ting-Kai Huang , Yannan Liang , Bin Hu , Chun-Fu Chen , Ying-Shen Chuang , Tzu-Wei Chiu , Sung TsaiLin , Hanyu Fan , Hsin-Hsien Lu
IPC: C09G1/02
CPC classification number: C09G1/02
Abstract: This disclosure relates to a polishing composition that includes an abrasive, at least two pH adjusters, a barrier film removal rate enhancer, a low-k removal rate inhibitor, and an azole-containing corrosion inhibitor. This disclosure also features a method of using the polishing composition to polish a substrate containing copper and silicon oxide.