公开(公告)号：US20240174892A1

公开(公告)日：2024-05-30

申请号：US18515857

申请日：2023-11-21

Applicant: Fujifilm Electronic Materials U.S.A. Inc.

Inventor： Ting-Kai Huang ,  Yannan Liang ,  Bin Hu ,  Chun-Fu Chen ,  Ying-Shen Chuang ,  Tzu-Wei Chiu ,  Sung TsaiLin ,  Hanyu Fan ,  Hsin-Hsien Lu

IPC: C09G1/02

CPC classification number: C09G1/02

Abstract: This disclosure relates to a polishing composition that includes an abrasive, at least two pH adjusters, a barrier film removal rate enhancer, a low-k removal rate inhibitor, and an azole-containing corrosion inhibitor. This disclosure also features a method of using the polishing composition to polish a substrate containing copper and silicon oxide.