公开(公告)号：US20130341767A1

公开(公告)日：2013-12-26

申请号：US13896739

申请日：2013-05-17

Applicant: Fujitsu Limited

Inventor： Manabu WATANABE ,  Masateru KOIDE ,  Kenji FUKUZONO ,  Takashi KANDA

IPC: H01L29/06 ,  H01L21/82

CPC classification number: H01L21/50 ,  H01L21/82 ,  H01L29/06 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/2018

Abstract: A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.

Abstract translation: 半导体器件安装结构包括：其中设置有开口的基板; 框架构件，其具有框架体和从框架体突出的突出部分，框体形成并容纳在围绕开口的凹槽中; 无芯基板，设置在所述基板的上方并由所述框架部件的突出部支撑; 以及设置在无芯基板上的半导体元件。

公开(公告)号：US20140193953A1

公开(公告)日：2014-07-10

申请号：US14203912

申请日：2014-03-11

Applicant: FUJITSU LIMITED

Inventor： Manabu WATANABE ,  Masateru KOIDE ,  Kenji FUKUZONO ,  Takashi KANDA

IPC: H01L21/50

CPC classification number: H01L21/50 ,  H01L21/82 ,  H01L29/06 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/2018

Abstract: A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.

Abstract translation: 半导体器件安装结构包括：其中设置有开口的基板; 框架构件，其具有框架体和从框架体突出的突出部分，框体形成并容纳在围绕开口的凹槽中; 无芯基板，设置在所述基板的上方并由所述框架部件的突出部支撑; 以及设置在无芯基板上的半导体元件。