公开(公告)号：US20060163197A1

公开(公告)日：2006-07-27

申请号：US10550948

申请日：2004-04-19

申请人： Fumihiro Arakawa ,  Yasuhiko Ishii ,  Daisuke Hashimoto ,  Yukihiro Kyouden ,  Eiji Oishi

发明人： Fumihiro Arakawa ,  Yasuhiko Ishii ,  Daisuke Hashimoto ,  Yukihiro Kyouden ,  Eiji Oishi

IPC分类号： C23F1/00 ,  B32B5/00

CPC分类号： H05K9/0096 ,  B32B3/30 ,  B32B7/12 ,  B32B15/02 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/36 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2307/42 ,  B32B2457/20 ,  B32B2571/00 ,  H01J2211/446 ,  H01J2329/869 ,  Y10T428/24

摘要： A metal film 21 is laminated directly to or by means of an adhesive 13 to a transparent base sheet 11. A mesh metal film including lines defining apertures is formed by coating the metal film 21 with a mesh resist layer 109a patterned in a mesh, etching the metal film 21 through the mesh resist layer 109a, and removing the mesh resist layer 109a. The front surfaces and side surfaces of the lines of the mesh metal film are coated with a black coating layer 23.

摘要翻译： 将金属薄膜21直接层叠在粘接剂13上或通过粘接剂13层叠在透明基材11上。 通过用形成网格的网状抗蚀剂层109涂覆金属膜21，通过网状抗蚀剂层109a蚀刻金属膜21，除去网状抗蚀剂层109a，形成包含线状的孔的网状金属膜。 网状金属膜的线的前表面和侧表面涂覆有黑色涂层23。

公开(公告)号：US07754981B2

公开(公告)日：2010-07-13

申请号：US10550948

申请日：2004-04-19

申请人： Fumihiro Arakawa ,  Yasuhiko Ishii ,  Daisuke Hashimoto ,  Yukihiro Kyouden ,  Eiji Oishi

发明人： Fumihiro Arakawa ,  Yasuhiko Ishii ,  Daisuke Hashimoto ,  Yukihiro Kyouden ,  Eiji Oishi

IPC分类号： H05K9/00

CPC分类号： H05K9/0096 ,  B32B3/30 ,  B32B7/12 ,  B32B15/02 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/36 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2307/42 ,  B32B2457/20 ,  B32B2571/00 ,  H01J2211/446 ,  H01J2329/869 ,  Y10T428/24

摘要： A metal film 21 is laminated directly to or by means of an adhesive 13 to a transparent base sheet 11. A mesh metal film including lines defining apertures is formed by coating the metal film 21 with a mesh resist layer 109a patterned in a mesh, etching the metal film 21 through the mesh resist layer 109a, and removing the mesh resist layer 109a. The front surfaces and side surfaces of the lines of the mesh metal film are coated with a black coating layer 23.

摘要翻译： 将金属膜21直接层压到粘合剂13上或通过粘合剂13层叠到透明基片11.通过用网格图案化的网眼抗蚀剂层109a涂覆金属膜21来形成包括限定孔的线的网状金属膜 金属膜21穿过网状抗蚀剂层109a，并且去除网状抗蚀剂层109a。 网状金属膜的线的前表面和侧表面涂覆有黑色涂层23。

公开(公告)号：US20110122596A1

公开(公告)日：2011-05-26

申请号：US12923186

申请日：2010-09-08

申请人： Yuichi Miyazaki ,  Yuusuke Satou ,  Shinya Kiura ,  Yukihiro Kyouden ,  Yusuke Hagiwara ,  Takeshi Nisizono ,  Takeaki Imaizumi

发明人： Yuichi Miyazaki ,  Yuusuke Satou ,  Shinya Kiura ,  Yukihiro Kyouden ,  Yusuke Hagiwara ,  Takeshi Nisizono ,  Takeaki Imaizumi

IPC分类号： H05K9/00 ,  B05D5/12

CPC分类号： H05K9/00 ,  H05K9/0096 ,  Y10T156/10

摘要： The present invention is to provide an electromagnetic wave shielding material including a transparent substrate and a convex pattern layer composed of a conductive composition formed in a prescribed pattern on the transparent substrate, wherein the conductive composition contains conductive particles and a binder resin; and in observation of a transverse cross section of the convex pattern layer by electron microscopic photography, at least a part of the conductive particles has a fused continuation and a method for manufacturing the same. The electromagnetic wave shielding material and the method for manufacturing the same include a configuration capable of achieving a lower surface resistivity in an electromagnetic wave shielding material which is required to achieve a much more reduction in a line width of the pattern, specifically, a reduction to a line width of not more than 30 μm, and more preferably not more than 15 to 20 μm and a treatment method capable of reducing the surface resistivity by an easy and short-time treatment.

摘要翻译： 本发明提供一种电磁波屏蔽材料，其包括透明基板和由在透明基板上以规定图案形成的导电组合物构成的凸起图案层，其中导电组合物包含导电颗粒和粘合剂树脂; 并且在通过电子显微镜摄影观察凸形图案层的横截面时，至少一部分导电颗粒具有熔融连续性及其制造方法。 电磁波屏蔽材料及其制造方法包括能够实现电磁波屏蔽材料中较低表面电阻率的结构，其需要实现图案的线宽度的进一步减小，具体地说，减少为 线宽不大于30μm，更优选不大于15至20μm，以及通过简单且短时间的处理能够降低表面电阻率的处理方法。

公开(公告)号：US08395059B2

公开(公告)日：2013-03-12

申请号：US12923186

申请日：2010-09-08

申请人： Yuichi Miyazaki ,  Yuusuke Satou ,  Shinya Kiura ,  Yukihiro Kyouden ,  Yusuke Hagiwara ,  Takeshi Nisizono ,  Takeaki Imaizumi

发明人： Yuichi Miyazaki ,  Yuusuke Satou ,  Shinya Kiura ,  Yukihiro Kyouden ,  Yusuke Hagiwara ,  Takeshi Nisizono ,  Takeaki Imaizumi

IPC分类号： H05K9/00

CPC分类号： H05K9/00 ,  H05K9/0096 ,  Y10T156/10

摘要： The present invention is to provide an electromagnetic wave shielding material including a transparent substrate and a convex pattern layer composed of a conductive composition formed in a prescribed pattern on the transparent substrate, wherein the conductive composition contains conductive particles and a binder resin; and in observation of a transverse cross section of the convex pattern layer by electron microscopic photography, at least a part of the conductive particles has a fused continuation and a method for manufacturing the same. The electromagnetic wave shielding material and the method for manufacturing the same include a configuration capable of achieving a lower surface resistivity in an electromagnetic wave shielding material which is required to achieve a much more reduction in a line width of the pattern, specifically, a reduction to a line width of not more than 30 μm, and more preferably not more than 15 to 20 μm and a treatment method capable of reducing the surface resistivity by an easy and short-time treatment.

摘要翻译： 本发明提供一种电磁波屏蔽材料，其包括透明基板和由在透明基板上以规定图案形成的导电组合物构成的凸起图案层，其中导电组合物包含导电颗粒和粘合剂树脂; 并且在通过电子显微镜摄影观察凸形图案层的横截面时，至少一部分导电颗粒具有熔融连续性及其制造方法。 电磁波屏蔽材料及其制造方法包括能够实现电磁波屏蔽材料中较低表面电阻率的结构，其需要实现图案的线宽度的进一步减小，具体地说，减少为 线宽不大于30μm，更优选不大于15至20μm，以及通过简单且短时间的处理能够降低表面电阻率的处理方法。