公开(公告)号：US10304792B1

公开(公告)日：2019-05-28

申请号：US15814736

申请日：2017-11-16

Applicant: Futurewei Technologies, Inc.

Inventor： Shiqun Gu ,  Hongying Zhang ,  HongLiang Cai

IPC: H01L21/44 ,  H01L23/00 ,  H01L21/768

Abstract: A packaged Integrated Circuit (IC) includes an IC and a package. The package has a bottom dielectric layer and a plurality of redistribution layers (RDLs) formed on the bottom dielectric layer. Each the RDLs includes patterned conductors, a dielectric layer, and a plurality of vias that extend between the patterned conductors to a differing RDL or to external connections. The package includes a plurality of package pads that have a first lateral separation pitch. The IC includes a plurality of IC pads that electrically connect to the plurality of package pads that have a first lateral separation pitch. The package also includes a plurality of Printed Circuit Board (PCB) pads that extend through the bottom dielectric layer and contact the plurality of patterned conductors of the first RDL. Power PCB pads and ground PCB pads of the plurality of PCB pads have a second lateral separation pitch that exceeds the first lateral separation pitch.

公开(公告)号：US10672730B2

公开(公告)日：2020-06-02

申请号：US16414304

申请日：2019-05-16

Applicant: FUTUREWEI TECHNOLOGIES, INC.

Inventor： Shiqun Gu ,  Hongying Zhang ,  HongLiang Cai

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/768

Abstract: A packaged Integrated Circuit (IC) includes an IC and a package. The package has a bottom dielectric layer and a plurality of redistribution layers (RDLs) formed on the bottom dielectric layer. Each the RDLs includes patterned conductors, a dielectric layer, and a plurality of vias that extend between the patterned conductors to a differing RDL or to external connections. The package includes a plurality of package pads that have a first lateral separation pitch. The IC includes a plurality of IC pads that electrically connect to the plurality of package pads that have a first lateral separation pitch. The package also includes a plurality of Printed Circuit Board (PCB) pads that extend through the bottom dielectric layer and contact the plurality of patterned conductors of the first RDL. Power PCB pads and ground PCB pads of the plurality of PCB pads have a second lateral separation pitch that exceeds the first lateral separation pitch.

公开(公告)号：US20190273060A1

公开(公告)日：2019-09-05

申请号：US16414304

申请日：2019-05-16

Applicant: FUTUREWEI TECHNOLOGIES, INC.

Inventor： Shiqun Gu ,  Hongying Zhang ,  HongLiang Cai

IPC: H01L23/00 ,  H01L21/768

Abstract: A packaged Integrated Circuit (IC) includes an IC and a package. The package has a bottom dielectric layer and a plurality of redistribution layers (RDLs) formed on the bottom dielectric layer. Each the RDLs includes patterned conductors, a dielectric layer, and a plurality of vias that extend between the patterned conductors to a differing RDL or to external connections. The package includes a plurality of package pads that have a first lateral separation pitch. The IC includes a plurality of IC pads that electrically connect to the plurality of package pads that have a first lateral separation pitch. The package also includes a plurality of Printed Circuit Board (PCB) pads that extend through the bottom dielectric layer and contact the plurality of patterned conductors of the first RDL. Power PCB pads and ground PCB pads of the plurality of PCB pads have a second lateral separation pitch that exceeds the first lateral separation pitch.

公开(公告)号：US20190148323A1

公开(公告)日：2019-05-16

申请号：US15814736

申请日：2017-11-16

Applicant: Futurewei Technologies, Inc.

Inventor： Shiqun Gu ,  Hongying Zhang ,  HongLiang Cai

IPC: H01L23/00 ,  H01L21/768

Abstract: A packaged Integrated Circuit (IC) includes an IC and a package. The package has a bottom dielectric layer and a plurality of redistribution layers (RDLs) formed on the bottom dielectric layer. Each the RDLs includes patterned conductors, a dielectric layer, and a plurality of vias that extend between the patterned conductors to a differing RDL or to external connections. The package includes a plurality of package pads that have a first lateral separation pitch. The IC includes a plurality of IC pads that electrically connect to the plurality of package pads that have a first lateral separation pitch. The package also includes a plurality of Printed Circuit Board (PCB) pads that extend through the bottom dielectric layer and contact the plurality of patterned conductors of the first RDL. Power PCB pads and ground PCB pads of the plurality of PCB pads have a second lateral separation pitch that exceeds the first lateral separation pitch.