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    Electrode contact contaminate removal
    6.
    发明授权
    Electrode contact contaminate removal 失效
    电极接触污染物去除

    公开(公告)号：US08461042B2

    公开(公告)日：2013-06-11

    申请号：US12628839

    申请日：2009-12-01

    申请人： Fysh Dadd ,  Mirela Pufulescu ,  Kostas Tsampazis ,  Mile Brkljaca ,  Edmond Capcelea ,  Jane Rapsey

    发明人： Fysh Dadd ,  Mirela Pufulescu ,  Kostas Tsampazis ,  Mile Brkljaca ,  Edmond Capcelea ,  Jane Rapsey

    IPC分类号： H01L21/4763 ,  H01L21/302

    CPC分类号： B23K26/36 ,  B23K2101/36 ,  Y10T29/49117

    摘要： Manufacturing an electrode assembly comprising forming an intermediate assembly comprising a carrier member having one or more electrode contacts embedded therein, the surface of the electrode contacts having a layer of carrier member material thereon; removing the layer of carrier member from the surface of the one or more electrode contacts, wherein a residual amount of the carrier member material remains on the surface of at least one of the electrode contacts; and substantially removing the residual carrier member material from the surface of the at least one electrode contact so as to increase the effective surface area of the at least one electrode contact.

    摘要翻译： 制造电极组件包括形成中间组件，所述中间组件包括具有嵌入其中的一个或多个电极触点的载体构件，所述电极触头的表面上具有载体构件材料层; 从所述一个或多个电极接触件的表面去除载体构件层，其中所述载体构件材料的剩余量保留在至少一个所述电极接触件的表面上; 并且从所述至少一个电极接触件的表面基本上去除所述残留载体构件材料，以便增加所述至少一个电极接触件的有效表面积。

    INSULATED CONDUCTIVE ELEMENT HAVING A SUBSTANTIALLY CONTINUOUS BARRIER LAYER FORMED THROUGH CONTINUOUS VAPOR DEPOSITION
    9.
    发明申请
    INSULATED CONDUCTIVE ELEMENT HAVING A SUBSTANTIALLY CONTINUOUS BARRIER LAYER FORMED THROUGH CONTINUOUS VAPOR DEPOSITION 审中-公开
    具有通过连续蒸发沉积形成的大面积连续阻隔层的绝缘导电元件

    公开(公告)号：US20110056729A1

    公开(公告)日：2011-03-10

    申请号：US12556304

    申请日：2009-09-09

    申请人： Fysh Dadd ,  Edmond Capcelea ,  Peter Schuller ,  Jane L. Rapsey ,  Grant Hill

    发明人： Fysh Dadd ,  Edmond Capcelea ,  Peter Schuller ,  Jane L. Rapsey ,  Grant Hill

    IPC分类号： H01B7/08 ,  C23C16/00 ,  B05D5/12 ,  C23C16/44 ,  H01B5/00 ,  H01B3/30 ,  H01B7/00

    CPC分类号： C23C14/50 ,  B05D1/60 ,  B05D7/20 ,  C23C14/562 ,  H01B3/308

    摘要： A continuous vapor deposition system for coating an elongate, uncoated conductive element with a substantially continuous barrier layer. The system comprises an internal deposition chamber configured to have a section of the conductive element extend there through; a vapor supply system connected to the internal deposition chamber configured to provide a barrier material to the internal deposition chamber, wherein the barrier material is deposited on the section of the conductive within the internal deposition chamber to form a substantially continuous barrier layer; and a guide system positioned adjacent to the first deposition chamber configured to maintain tension in the section of the conductive element in the internal deposition chamber to control movement of the conductive element through the internal deposition chamber.

    摘要翻译： 一种用于用基本上连续的阻挡层涂覆细长的未涂覆的导电元件的连续气相沉积系统。 该系统包括内部沉积室，其被配置为具有导电元件的一部分延伸到那里; 连接到内部沉积室的蒸气供应系统，其被配置为向内部沉积室提供阻挡材料，其中阻挡材料沉积在内部沉积室内的导电部分上以形成基本上连续的阻挡层; 以及与所述第一沉积室相邻定位的引导系统，其被配置为保持所述内部沉积室中的所述导电元件的所述部分中的张力，以控制所述导电元件通过所述内部沉积室的运动。