公开(公告)号：US20230235504A1

公开(公告)日：2023-07-27

申请号：US17869308

申请日：2022-07-20

Applicant: G-FUN INDUSTRIAL CORPORATION

Inventor： KUO-CHIN CHEN ,  CHIU-HSIUNG TSAI ,  CHUN-JEN NIU ,  LI-HSUN CHANG

IPC: D06N3/18 ,  C08J5/18 ,  D06N3/00 ,  D06N3/04 ,  D06N3/12

CPC classification number: D06N3/183 ,  C08J5/18 ,  D06N3/0006 ,  D06N3/0034 ,  D06N3/0036 ,  D06N3/0059 ,  D06N3/0095 ,  D06N3/047 ,  D06N3/128 ,  C08J2375/04 ,  D06N2201/0263 ,  D06N2203/066 ,  D06N2203/044 ,  D06N2209/128

Abstract: A composite structure, a resin film, and a method of manufacturing the resin film are provided. The composite structure includes a release carrier and a resin film. The release carrier includes a release substrate and a release resin layer that is formed on the release substrate. The release resin layer covers the release substrate at a coverage rate of between 60% and 100%. The resin film is formed on the release carrier. The resin film is bonded to each of the release substrate and the release resin layer.